G017
Abstract: als244c hipotted IPC-TP-787 perkin cte table E5007 IPC-SM-786 PE-68051 PE-69037
Text: OPTIMIZING SOLDER JOINT RELIABILITY for Surface Mount Magnetic Components Pulse’s Mechanical Design for Thermal Expansion and Optimal Lead Compliance Deliver Empirically-Measurable Solder Joint Reliability 1998, Pulse Engineering, Inc. G017.A © 1998, Pulse Engineering, Inc.
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CU-106A
Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Text: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation
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28September
CU-106A
entek plus cu 106a
anova
general cross references
TI Cross Reference Search
HC373
Au Sn eutectic
gold embrittlement
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Untitled
Abstract: No abstract text available
Text: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause
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Abstract: No abstract text available
Text: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause
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Untitled
Abstract: No abstract text available
Text: SMD Film Capacitors Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end terminations capacitor’s body mechanical deformation capacitance drop up to 20% capacitance drop (over 20%) Typical cause
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AN3298
Abstract: FREESCALE PACKING J-STD-020B
Text: Freescale Semiconductor Application Note Document Number: AN3298 Rev. 0, 07/2006 Solder Joint Temperature and Package Peak Temperature Determining Thermal Limits during Soldering 1 Processability of Integrated Circuits JEDEC/IPC J-STD-020 http://www.jedec.org is a Joint
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AN3298
J-STD-020
AN3298
FREESCALE PACKING
J-STD-020B
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all ic data
Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Text: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile
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Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
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conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
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all ic data
Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Text: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile
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mutoh ip-220
Abstract: No abstract text available
Text: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK
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kskimm12
RC22717
W0302-019)
mutoh ip-220
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solder joint
Abstract: joint TA65
Text: LEAD FREE SOLDER JOINT RELIABILITY QUALITY ENG : REPORT DATE: Herb Grimm 3/4/2004 PACKAGE TYPE: TEST DESCRIPTION: SOLDER PASTE SAMPLE SIZE: RESULT: INSPECTION METHOD: 20L TSSOP Temperature Cycle Sn,Ag.Cu 5 samples board mounted using +260C peak reflow PASS
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all ic data
Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as
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CH09WIP
all ic data
Intel reflow soldering profile BGA
infrared heating gun
82425EX
intel 80486 DX4
hot air bga
land pattern for TSOP
TSOP infrared
80c196kb 1988
land pattern QFP 208
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datasheet of BGA Staggered pins
Abstract: of BGA Staggered pins Samtec Connector Reliability Samtec Cross reference
Text: HIGH SPEED CONNECTOR OPTIMIZES BANDWIDTH PER SQUARE INCH System allows 1 Terabit of data or 4 GHz per Differential Pair solder joint reliability. This technology is superior to standard BGA/solder ball attachment in that the connectors will only be subjected to extreme heat once - during
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Solderability Tests
Abstract: AN2036 AN-2036 an2036 st joint interfacial JESD22-B102 J-STD-002
Text: AN2036 APPLICATION NOTE Solderability Tests Lead-free devices, from STMicroelectronics, are warranted to pass the solderability tests, and to form a reliable solder joint with the base material of the circuit board, using Leaded Sn-Pb solder or Lead-free
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AN2036
2002/95/EU,
Solderability Tests
AN2036
AN-2036
an2036 st
joint interfacial
JESD22-B102
J-STD-002
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Untitled
Abstract: No abstract text available
Text: FACTSHEET F-201 ICF–648–S–I ICF–324–S–O SURFACE MOUNT DIP SOCKETS ICF SERIES Surface mount sockets for IC packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high
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F-201
1-800-SAMTEC-9
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Text: FACTSHEET F-200 ICF–648–S–I ICF–324–S–O SURFACE MOUNT DIP SOCKETS ICF SERIES Surface mount sockets for IC packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high
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F-200
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JIS C7021
Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Text: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint
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10OOhrs
1000hrs
p7021
C7021
C--25
30min-
30min
C7021
JIS C7021
JIS-C-7021
JIS C7021 B-10
JIS C 7021B-10
C7021A
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TEKAS00056
Abstract: No abstract text available
Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering
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IS09001
TEKAS00056
IS0900?
TEKAS00056
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Untitled
Abstract: No abstract text available
Text: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering
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IS09001
ISO9001
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Untitled
Abstract: No abstract text available
Text: F -2 0 2 -1 m sarnle c GFZ— 2 0 -0 1 -G -1 0 -A D c SOLDERLESS INTERFACES Board Stacking Modular-to-Board LGA Interfaces Solderless Interconnects No solder pad delamination Minimizes Coefficient of Thermal Expansion CTE issues No solder joint reliability
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1-800-SAMTEC-9
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Untitled
Abstract: No abstract text available
Text: SURFACE MOL Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or infrared soldering. Precision stamped
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1-300-SAMTEC-9
0i814l
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Untitled
Abstract: No abstract text available
Text: Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or infrared soldering. ROW SPACING & NO. OF CONTACTS
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Abstract: No abstract text available
Text: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for
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Untitled
Abstract: No abstract text available
Text: F -2 0 4 SURFACE MOUNT DIP SOCKET SERIES Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or
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