SIGNETICS
Abstract: 10X10MM TQFN 72-QFN
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance
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10x10MM
C/-65
C/100%
15PSIG,
168hrs
SIGNETICS
10X10MM
TQFN
72-QFN
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SIGNETICS
Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,
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JEDEC TSSOP 28 LEAD PACKAGE
Abstract: SIGNETICS TSSOP 28 Ablestik 12-1
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSSOP Signetics Thin Shrink Small Outline Package Cross Section View of TSSOP Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSSOP packages are available in 8 - 56 lead counts with 0.50 / 0.65mm lead
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TSOP 48 thermal resistance
Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead
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12x20
TSOP 48 thermal resistance
TSOP 48 thermal resistance type1
thin TSOP 8x20 package tray
TSOP 32 thermal resistance
TSOP 48 package tray
JEDEC tray standard 13
Ablestik 12-1
signetics
TSOP package tray
TSOP1-48
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SIGNETICS
Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches
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12x20
SIGNETICS
JEDEC tray standard 13
Signetics OR Mullard
package tray outline
signetics data
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SIGNETICS
Abstract: 10X10MM FLGA
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics FLGA Signetics Fine Pitch Land Grid Array Package FLGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and are cost effective because they are manufactured in a high-utilization
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10X10MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
SIGNETICS
10X10MM
FLGA
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signetics
Abstract: epbga EBGA epbga 304 signetics data book
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the
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100um
31x31MM
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
epbga
EBGA
epbga 304
signetics data book
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Signetics
Abstract: 19X19 19X19MM
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This
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19x19MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
Signetics
19X19
19X19MM
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signetics
Abstract: No abstract text available
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the
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40x40MM
100um
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
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signetics
Abstract: No abstract text available
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content
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696hr,
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
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hspbga
Abstract: No abstract text available
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics PBGA / HSPBGA Signetics Plastic Ball Grid Array Package PBGA packages have a wire bonded die mounted to a laminate substrate which is then over molded. This configuration offers excellent performance and cost that enables use
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192hr,
C/-65
C/100%
15PSIG,
168hrs
hspbga
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RDRAM SOP
Abstract: SIGNETICS Bt epoxy rohs
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics BOC Signetics Board On Chip BOC is a laminate-based, nearly chip-scale package with the die mounted topside down. Wire bonds are made through a cavity in the center of the substrate and both
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696hr,
C/-65
C/100%
15PSIG,
168hrs
RDRAM SOP
SIGNETICS
Bt epoxy rohs
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tfbga
Abstract: SIGNETICS 48TFBGA 48-TFBGA
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics TFBGA Signetics Tape Fine Pitch Ball Grid Array Package TFBGA is a package that uses a tape-based substrate with plastic over mold, offering a near chip scale solution. TFBGA packages are cost efficient and provide excellent
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168hr,
C/-65
C/100%
15PSIG,
168hrs
tfbga
SIGNETICS
48TFBGA
48-TFBGA
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88C681
Abstract: DUART EXAR XR SC26C92 DOG MARKING "Pin compatible" Signetics
Text: TAN - 014 A Comparison between Exar’s XR-88C681 with Signetics’ SC26C92 DUART Devices Comparison of EXAR DUART XR-88C681 device with that of Signetics (SC26C92) Introduction Although the XR-88C681 and the Signetics SC26C92 devices have exactly the same pin
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XR-88C681
SC26C92
SC26C92)
88C681
DUART
EXAR XR
DOG MARKING
"Pin compatible" Signetics
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signetics handbook
Abstract: Philips FA 153 signetics military data handbook 42VA12
Text: Philips Components-Signetics Ordering Information Programmable Logic Devices Philips Components-Signetics Programmable Logic Devices may be ordered by contacting either the local Signetics sales office, Signetics representatives or authorized distributors. A complete listing is located
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28-lead
24-Pin
68-Pin
42VA12)
signetics handbook
Philips FA 153
signetics military data handbook
42VA12
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defect ppm sampling
Abstract: signetics
Text: Signetics Quality and Reliability Military Products SIGNETICS MILITARY PRODUCT QUALITY SIGNETICS SHIP-TO-STOCK STS PROGRAM Signetics Quality leadership begins with the In dustry's firstzerodefect warranty. If a single de fect is found in any lot that we ship, the entire lot
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1987and
tobelow100ppm.
defect ppm sampling
signetics
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60c31
Abstract: AD347 AD7ME 80C31BH 80C31BH/BQA
Text: Signetics 80C31BH/80C51BH CMOS Single-Chip 8-Bit Microcontroller Product Specification Military Microprocessor Products DESCRIPTION The Signetics 80C31BH/80C51BH is a high-performance microcontroller fabri cated with Signetics high-density CMOS technology.
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80C31BH/80C51BH
80C31BH/80C51BH
80C31BH/
80C51
80C31BH/80C51
16-bit
60c31
AD347
AD7ME
80C31BH
80C31BH/BQA
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PHD48N22
Abstract: No abstract text available
Text: Philips Components-Signetics SLICE 10 Signetics Logic Integration Computer Environment Programmable Logic Development Software FEATURES • Easy to learn and use GENERAL DESCRIPTION they are introduced. The devices currently supported are: • Supports Signetics PLD line
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00000000000000000oooooooooooooooooooooo
PHD48N22
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signetics 723
Abstract: 20L8D M7MJ PLUS20R8
Text: PLUS20L8, PLUS20R8 Signetics PAL -Type Devices Signetics Programmable Logic Product Specification Military Application Specific Products • Series 24 FEATURES DESCRIPTION • Ultra high-speed The Signetics PLUS20XX family is an ultra high-speed version of existing Series
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24-pin
PLUS20L8,
PLUS20R8
PLUS20XX
8/20R8D
1B/27
ZL30/30A
30A31
20L8/20L8D
signetics 723
20L8D
M7MJ
PLUS20R8
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t-con Application Note
Abstract: 8XC752
Text: Philips Components-Signetics Application Specific Product Section 3 - 80C51 family derivatives 8XC752 OVERVIEW The Signetics 83C752/87C752 is a single-chip control oriented microcontroller fabricated with Signetics high-density CMOS technology minimizing CMOS latch-up sensi
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80C51
8XC752
8XC752
83C752/87C752
60C51
63C752
80C51.
83C751
83C752
t-con Application Note
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SCC2691AC1N24
Abstract: diagram remote control receiver and transmitter SCC2691AC1A28 T-75-37-05 SCC2691 SCC2691AA1D24 SCC2691AA1N24 SCC2691AC1D24 bts312 bbS312
Text: S'îE D NAPC/ SIGNETICS Signetics bbS3T24 GDSSIST 1 .7=7Sr-37-ar SCC2691 Universal Asynchronous Receiver/Transmitter UART Product Specification Communications and Industrial Products Group c PIN CONFIGURATIONS DESCRIPTION FEATURES The Signetics SCC2691 Universal Asyn
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SCC2691
7sr-37-aT
SCC2691
24-pin
SCC2691AC1N24
diagram remote control receiver and transmitter
SCC2691AC1A28
T-75-37-05
SCC2691AA1D24
SCC2691AA1N24
SCC2691AC1D24
bts312
bbS312
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textool socket dil 40
Abstract: 30A27 47 16L xn PAL 007 B MO-C47AA textool socket dil 24 c16v8 PLC16V8-25 PAL 007 E 16H8
Text: a^E D NAPC/ SIGNETICS • bbS3TS4 QGSMQMO 1 ■ T~*U>- 3rH7 c Signetics PLC16V8-25/-35 Erasable and OTP Universal PALMype Devices Signetics Programmable Logic Product Specification Application Specific Products • Series 20 FEATURES • 20-pln Universal Programmable
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20-pln
300mil-wide
20-PIN
textool socket dil 40
30A27
47 16L xn
PAL 007 B
MO-C47AA
textool socket dil 24
c16v8
PLC16V8-25
PAL 007 E
16H8
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P34QJ
Abstract: SC80C51 SC80C652 SC83C652 C0126 0023H EXO 3 8K
Text: ? Signetics -5 SC80C652/ SC83C652 CMOS Single-Chip 8-Bit Microcontroller Objective Specification Microprocessor Products DESCRIPTION FEATURES The SC80C652/83C652 is a derivative of the SC8051 family, fabricated with Signetics high-density CMOS technolo gy. Signetics epitaxial substrate mini
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SC80C652/
SC83C652
SC80C652/83C652
SC8051
SC83C652
16-bit
0003h
001BH
0023H
P34QJ
SC80C51
SC80C652
C0126
0023H
EXO 3 8K
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SCN2650
Abstract: scn2651
Text: Philips Semlconductors-Signetics Data Communications Products Product specification Programmable communications interface PCI DESCRIPTION • Asynchronous operation The Signetics SCN2651 PCI is a universal synchronous/asynchronous data communications controller chip designed for
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SCN2651
SCN2651
SCN2650
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