Siemens Aktiengesellschaft
Abstract: No abstract text available
Text: Package Outlines Siemens Aktiengesellschaft 245 Summary of Package Outlines Memory Components Siemens Aktiengesellschaft 246 Summary of Package Outlines Siemens Aktiengesellschaft 247 Summary of Package Outlines Memory Modules Siemens Aktiengesellschaft 248
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P-DIP-16
20A16
P-DIP-18-T
P-DIP-20-T
L-SIM-30-950
MO-064-AD
L-SIM-72-1000
Siemens Aktiengesellschaft
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TO-220AB Option E3045 Package
Abstract: TO-220AB Option E3044 Package
Text: Gehäusemaßbilder Package Outlines SIEMENS Gehäusemaßbilder Package Outlines Maße in mm, wenn nicht anders angegeben (Dimensions in mm, unless otherwise specified) Bild 9 Semiconductor Group Figure 9 135 GehäusemaBbllder Package Outlines SIEMENS - 15 -14.8-
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O-218
O-220
E3045
E3044
TO-220AB Option E3045 Package
TO-220AB Option E3044 Package
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Circuit Diagrams
Abstract: siemens Package Outlines ECONOPACK
Text: SIEMENS Package Outlines and Circuit Diagrams Fig. 1 W eight: 150 g Dim ensions in mm Fig. 2 W eight: 250 g Dim ensions in mm SIS00026 Sem iconductor Group 302 SIEMENS Package Outlines and Circfuit Diagrams Fig. 3 W eight: 190 g Dim ensions in mm Fig. 4 W eight: 420 g
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SIS00026
Circuit Diagrams
siemens Package Outlines
ECONOPACK
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1607b
Abstract: C1039 C513 SAB-C513A-L16P "C513A-L16P" CPU 103 siemens Marking AD6 siemens crystal clock
Text: SIEMENS This Material Copyrighted By Its Respective Manufacturer SAB-C513A-L16P 16 MHz Specification SIEMENS Ordering Information Type Ordering Code Package Description 8-Bit CMOS Microcontroller SAB-C513A-L16P Q 67120-C1039 P-DIP-40 for external memory, 16 MHz
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SAB-C513A-L16P
SAB-C513A-L16P
Q67120-C1039
P-DIP-40
C513A-L16P
P-DIP-40-2
1607b
C1039
C513
"C513A-L16P"
CPU 103 siemens
Marking AD6
siemens crystal clock
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BUP101
Abstract: bup transistor A 671 transistor
Text: • 823SbD5 QDSlBb^ 2 O S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF 47E I> r-3 3 -13 BUP101 SIRET Siemens Ring Emitter Transistor VGe = 1000 V /0 =15 A • N channel • Breakdown-proof • Package: TO-218 AA TO P-3 1) Type Ordering code B U P 101 C 6 7 060-A 1000-A 2
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823SbD5
QDS13bci
BUP101
O-218
C67060-A1000-A2
01234s6789a10
r-33-/3
BUP101
bup transistor
A 671 transistor
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MARKING SMD T43
Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
Text: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package
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P-DIP-20-2
P-SOJ-26/20-1
P-SOJ-26/20-5
J-28-2
P-SOJ-40-1
P-SOJ-26/24-1
J-28-3
P-SOJ-34-1
P-SOJ-42-1
L-DIM-168-1
MARKING SMD T43
siemens Package Outlines Plastic Package
siemens Package Outlines
smd marking l5
7750a
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Untitled
Abstract: No abstract text available
Text: SIEMENS ^ FEATURES ILD256 DUAL AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER Package Dimensions in Inches mm • Each Channel: Guaranteed CTR Symmetry, 2:1 Maximum • Bidirectional AC Input • Industry Standard SOIC-0 Surface Mountable Package
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ILD256
ILD256
Ta-25
IL02S6
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siemens Package Outlines
Abstract: l20x
Text: Summary of Types in Alphanumerical Order Semiconductor Group - Addresses Information on Literature Package Outlines SIEMENS P-SOJ-28-2 SMD Plastic Package (small outline J-lead) P-SOJ-40-1 (SMD) Plastic Package (small outline J-lead) P-SOJ-26/24-1 (300 mil) (SMD)
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P-SOJ-28-2
P-SOJ-40-1
P-SOJ-26/24-1
P-SOJ-28/24-1
P-SOJ-28-3
P-TSOPII-26/20-1
P-ZIP-20/19-1
L-SIM-30-1
SocM-30-4
L-SIM-72-3
siemens Package Outlines
l20x
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Untitled
Abstract: No abstract text available
Text: bOE ]> B Ö235b05 QQMSTDI 10b M S I E G SIEMENS SIEMENS AKTIEN6ESELLSCHAF • 7 ^ 3 SIMOPAC Module BSM 191 V DS = 1000 V / d =28 A ^ DS on = 0.37 Q • • • • • • Power module Single switch N channel Enhancement mode Package with insulated metal base plate
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235b05
C67076-A1009-A2
6235bÃ
0D4S71S
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Untitled
Abstract: No abstract text available
Text: bOE J> • fl235b05 00M5tiôE 133 « S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF SIMOPAC Module VDS / D R DS on BSM151 = 500 V =48 A “ 0.12 £2 • Power module • Single switch • N channel • Enhancement mode • Package with insulated metal base plate
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fl235b05
00M5tiÃ
BSM151
C67076-A1004-A2
SIM00006
fl23SbG5
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Untitled
Abstract: No abstract text available
Text: SIEMENS IL256 AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER FEATURES Package Dimensions in Inches mm • Guranteed CTR Symmetry, 2:1 Maximum • Bidirectional AC Input • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing, .05*
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IL256
RS481
IL256
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25C31
Abstract: 5113 LED
Text: SIEMENS FEATURES IL256 AC INPUT PHOTOTRANSISTOR SMAUL OUTLINE SURFACE MOUNT OPTOCOUPLER Package Dimensions in Inches mm • Guranteed CTR Symmetry, 2:1 Maximum • B idirectional AC Input • Industry Standard SOtC-8 Surface Mountable Package • Standard Lead Spacing, .05*
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RS481
IL256
IL256
25C31
5113 LED
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8 pin SMD relay
Abstract: optocoupler smd 8 Siemens optocoupler
Text: Telecom Switches SIEMENS FEATURES DESCRIPTION • Solid state relay and an autopolarity optocoupler in a single package • Low-profile, small-outline package SOP available • Up to 5300 Vrms I/O minimum • Surface mountable • Optocoupler — Bidirectional current detection
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BS6301
LH1529AB
LH1529AAC
LH1529ACC
u4i529BB
LH1529BCC
LH1548ACE*
LH1549AB*
LH1549AAC'
LH1549ACC*
8 pin SMD relay
optocoupler smd 8
Siemens optocoupler
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bsm181
Abstract: No abstract text available
Text: bOE D • flB35bDS 0 0 4 5 ^ 5 ATI ISIEG SIEMENS -n-39~iS~ SIEMENS AKTIENGESELLSCHAF SIMOPAC Module ^DS BSM 181 BSM 181 R = 100V = 200 A ^ Ds on = 8.5 m il I D • Power module • Single switch • N channel • Enhancement mode • Package with insulated metal base plate
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flB35bDS
-n-39
C67076-A1001-A2
C67076-A1016-A2
023SbÃ
G04S7D0
fi23SbOS
bsm181
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BSM141
Abstract: d45b V103
Text: bOE ]> • fi23 SbGS Gü 4Sb 7 b ^31 ■ SIEG SIEMENS SIEMENS AKTIEN 6 ESELLSCHAF T-3^/5- SIMOPAC Module V DS / D = 400 V =60 A ^ = 0.075 • • • • • • DS on BSM 141 i 2 Power m odule Single switch N channel Enhancement mode Package with insulated m etal base plate
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fi23SbGS
C67076-A1010-A2
BSM141
d45b
V103
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Untitled
Abstract: No abstract text available
Text: bOE D • fl53SbOS 004S71b 34b ■ S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF SIMOPAC Module V DS ID BSM 191 F = 1000 V =28 A R ds on = 0 .4 2 £2 • • • • • • • Power module Single switch FREDFET N channel Enhancement mode Package with insulated metal base plate
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fl53SbOS
004S71b
C67076-A1053-A2
023SbGS
BSM191F
SIMD0104
235b05
004572E
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Untitled
Abstract: No abstract text available
Text: bOE D • fi23SbDS DDMSbbT ?TT H S I E 6 SIEMENS SIEMENS AKTIEN6ESELLSCHAF 'P 3 SIMOPAC Module CÍ - J 5 ' BSM 121 AR V DS = 200 V I D = 130 A ^ DS on = 20 m i) • • • • • • Power module Single switch N channel Enhancement mode Package with insulated metal base plate
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fi23SbDS
C67076-S1014-A2
SIM00026
fiS3Sb05
0045b74
0D45b75
121AR
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Untitled
Abstract: No abstract text available
Text: H ISIE G â235bG5 0020077 s SIEMENS SIEMENS A KT IE NGESELLSCHAF 47E T> T -39-/5 SIMOPAC MOSFET Module ^03 A ^DS on) • • • • • • BSM 121 AR (C) = 200 V = 130 A '=» 20 mfl Power module Single switch N channel Enhancement mode Package with insulated metal base plate
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235bG5
C67076-S1014-A2
235b05
535b05
T-39-15
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KTY 10-6
Abstract: KTY10 KTY temperature sensor 10-62 Q62705-K110 temperature DEPENDENT RESISTOR Q62705-K331 KTY10 Siemens
Text: SIEMENS Silicon Spreading Resistance Temperature Leaded Plastic Package lorin K T 100 KTY10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts
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KTY10
FC40/PP7)
GPD05636
KTY 10-6
KTY10
KTY temperature sensor 10-62
Q62705-K110
temperature DEPENDENT RESISTOR
Q62705-K331
KTY10 Siemens
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kty 110 15
Abstract: No abstract text available
Text: SIEMENS Silicon Spreading Resistance Temperature Sensor in Miniature Leaded Plastic Package K T 110, KT 210, KTY 11, KTY 21 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Miniature plastic package for very small thermal time
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Q62705-K332
Q62705-K245
Q62705-K246
Q62705-K247
Q62705-K334
Q62705-K258
Q62705-K259
Q62705-K260
FC40/PP7)
KTY11,
kty 110 15
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R01C
Abstract: No abstract text available
Text: SIEMENS ILD205T/06T/07T/11T/13T/17T DUAL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER FEATURES Package Dim ensions in Inches mm • Two Channel Coupler • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing of .05" • Available In Tape and Reel (suffix T)
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ILD205T/06T/07T/11T/13T/17T
ILD205T,
ILD206T,
ILD207T,
ILD211T,
ILD213T,
ILD217T,
11-1ma
10rna
Ta-25
R01C
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BSM300GA120DN2E3166
Abstract: C67070-A2007-A70 D273 siemens igbt BSM300GA120DN2
Text: SIEMENS BSM300GA120DN2E3166 IGBT Power Module Preliminary data • Single switch • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate Type BSM300GA120DN2E3166 VCE 1200V 430A Package Ordering Code SINGLE SWITCH 1
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BSM300GA120DN2E3166
BSM300GA120DN2E3166
C67070-A2007-A70
fl235b05
053Sb05
53SLDS
C67070-A2007-A70
D273
siemens igbt
BSM300GA120DN2
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Untitled
Abstract: No abstract text available
Text: SIEMENS BSM150GB120DN2E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate BSM150GB120DN2E3166 h 1200V 210A 111 Type Package Ordering Code HALF-BRIDGE 2
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BSM150GB120DN2E3166
C67076-A2112-A70
ID0fl020fl
023Sb05
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BSM 214 A
Abstract: 78AK
Text: SIEMENS SIMOPAC Module V DS ¡0 =100V =2x125 A R = 0.013 i l • • • • • • DS on BSM 214 A Power module Half-bridge N channel Enhancem ent mode Package with insulated metal base plate Package outline/Circuit diagram : 2a11 Type O rdering Code
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2x125
67076-S1100-A2
SIM00126
SIM00QO6
nC360
BSM 214 A
78AK
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