ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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and14
12C-0707-E19
12F-1111-119
1F3-1313-D19
1F1-1717-A19
12U-1919-G19
12Y-2323-919
12Y-3333-419
12Y-3535-419
ADV0505
FBGA-484
daewon tray
daewon
FBGA672
PEAK TRAY bga
1f1-1717-a19
12C-0707-E19
FBGA256
Daewon BGA 7x7
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intel 04195
Abstract: BGA package tray 40 x 40 uBGA device MARKing intel F800B3 T1234567 04195 Material Handling Systems Shipping Trays 28F008S3 28F160B3
Text: 4.0 4.1 THE µBGA* PACKAGE SHIPPING MEDIA, HANDLING, AND DEVICE MARKINGS Shipping Media Overview NOTE: Please refer to the web-based Mechanical Spec for most up to date information at: 4.2 Shipping Media 4.2.1 Tape and Reel The µBGA package shipped in Tape and Reel
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intel 04195
BGA package tray 40 x 40
uBGA device MARKing intel
F800B3
T1234567
04195
Material Handling Systems
Shipping Trays
28F008S3
28F160B3
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Kostat tray
Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
Text: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by
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14x20mm
28x28mm
32x32mm
ND-1420-2
ND-2828-3
ND-3232-3
KS-8202*
KS-8201*
Kostat tray
Kostat
PEAK TRAY
QFP Shipping Trays
KS-8201
Shipping Trays
KS-8205
KS-8202
ks 870163
8201
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28 TSSOP JEDEC Thin Matrix Tray outlines
Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three
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0637D
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28 TSSOP JEDEC Thin Matrix Tray outlines
tsop tray matrix outline
Shipping Trays
ATMEL Packing Methods and Quantities
ATMEL EIA-481-x Packing
ATMEL 234
tsop Shipping Trays
atmel tape and reel
JEDEC Matrix Tray outlines
EIA-481-x
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Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three
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ATMEL 234
ATMEL Packing Methods and Quantities
ATMEL 210
atmel tape and reel
ATMEL shipping label
ATMEL Tape and Reel code
ATMEL SOIC tape and reel
ATMEL JEDEC SOIC
atmel tape and reel JEDEC SOIC
ATMEL Packing information JEDEC SOIC
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Date Code wolfson
Abstract: WM8725ED MH1082 WOLFSON date code Date Code format wolfson EH11 MH10 WOLFSON MICROELECTRONICS WM8199SCDS ti packing label
Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications –
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Ion Chromatography
Abstract: No abstract text available
Text: Application Report SZZA042 - November 2003 Use of Polystyrene for Bare-Die Carrier-Tape Shipping Applications Michael Hayden, Lee Lewis, and Lance Wright Standard Linear & Logic ABSTRACT The packing and shipping of bare-die product is relatively new, especially in the tape-and-reel
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Date Code wolfson
Abstract: MH1082 EH11 MH10 ti packing label INNER CARTON LABEL inner product
Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications – differences may occur due to manufacturing route variations.
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JEDEC Matrix Tray outlines
Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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JEDEC Matrix Tray outlines
ATMEL EIA-481-x Packing
JEDEC tray standard for PLCC
ATMEL Packing Methods and Quantities
EIA-481-x
JEDEC TRAY PLCC
ATMEL Tape and Reel
tsop Shipping Trays
JEDEC tray standard 13
ATMEL shipping label
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tsop tray matrix outline
Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also
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bga 0,8 mm
Abstract: tray matrix bga AN-1126 MO-151 fine BGA thermal profile an1126
Text: National Semiconductor Application Note 1126 December 2000 CONTENTS Introduction Package Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations Solder Pad Geometry Escape Routing Guidlines Via Density Assembly Recommendations
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EIA-583
Abstract: JESD31 JEDEC J-STD-033 TAPE AND REEL JESD-625 JEDEC JESD31 JESD625 J-STD-033 JESD-31 JSTD-033 JEP113
Text: Publication 26011 GENERAL INFORMATION STORAGE OF SEMICONDUCTOR DEVICES by Raymond Dewey Introduction General All semiconductor devices are susceptible to damage or degradation during shipping, storage, and handling. Non-hermetic, plastic-encapsulated surface-mount devices are particularly sensitive to
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BGA PACKAGE TOP MARK intel
Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Text: Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document Number: 298049-007 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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28F160F3
US048641
RD33708SW
RD33716SW
12B-1013-G13
BGA PACKAGE TOP MARK intel
144 bga
12B-1013-G13
BGA PACKAGE TOP MARK
28F160F3
BGA package tray 64
tray bga 17
intel Easy BGA TOP MARK
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QFN Shipping Trays
Abstract: No abstract text available
Text: Nomenclature Guide ZL Types ZL BBBBB P T S L F -CC ZL = ZILKER LABS DESIGNATOR CUSTOM CODE Any alphanumeric character BASE PART NUMBER 5 Character Max. ZL90XXM - Power Modules ZL91XXM - Power Modules ZLS4XXM - Module Component SHIPPING OPTION J: Trays T1 or TK: (Tape and Reel - 1000 piece)
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ZL90XXM
ZL91XXM
1-888-INTERSIL
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INTEL 28F640
Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
Text: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
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12E-0607-C13
28F320C3
12E-0710-C13
28F160F3
12E-0810-C13
28F320D18
12E-0713-C13
28F320W18
28F320W30
28F640W18
INTEL 28F640
BGA PACKAGE TOP MARK intel
28F160C18
INTEL 28F640 application
298161
vf bga
BGA PACKAGE TOP MARK
BGA package tray 64
28F008B3
28F160B3
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Untitled
Abstract: No abstract text available
Text: Nomenclature Guide ZL Types ZL BBBBB P T S L F -CC CUSTOM CODE Any alphanumeric character ZL = ZILKER LABS DESIGNATOR BASE PART NUMBER 5 Character Max. SHIPPING OPTION J: Trays T1 or TK: (Tape and Reel - 1000 piece) T3: (Tape and Reel - 3000 piece) T4: (Tape and Reel - 4000 piece)
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Abstract: No abstract text available
Text: MULTI-PORT PRODUCTS Part Number Description A = Alpha character N = Numeric character NN A NNNNNN A NNN AAA A A N N A A AA NNN A NNNNNN A NN Shipping Type Optional 8 suffix at end of part number indicates Tape & Reel packaging 8 = Tape & Reel Blank = Tube or Trays
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ANSI/EOS/ESD S11.11-93
Abstract: ANSI/EOS static charge meter PRS801
Text: Application Report SZZA041A - January 2004 Intrinsically Static-Dissipative Reel Albert Escusa and Lance Wright Standard Linear & Logic ABSTRACT Polystyrene, black, intrinsically static-dissipative ISD reels and polystyrene antistatic-coated reels used for shipping integrated circuits in tape-and-reel configuration
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SZZA041A
ANSI/EOS/ESD S11.11-93
ANSI/EOS
static charge meter
PRS801
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automotive
Abstract: No abstract text available
Text: SRAM PRODUCTS Part Number Description A = Alpha character N = Numeric character NN A NNNNNN A NNN AA A A N N A A AA NNN A NNNNNN A NN Shipping Type Optional 8 suffix at end of part number indicates Tape & Reel packaging. 8 = Tape & Reel Blank = Tube or Trays
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INTEL 28F640
Abstract: 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
Text: E µBGA* Package Mechanical and Shipping Media Specifications November 1998 Revision 3.12 11/12/98 2:37 PM REV3_12.doc INTEL CONFIDENTIAL until publication date Information in this document is provided in connection with Intel products. No license, express or implied, by
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RD33708SW
28F640J5
28F160F3
RD33716SW
INTEL 28F640
28F008B3
28F008S3
28F016B3
28F016S3
28F160B3
28F800B3
intel DOC
28F800F3
intel i5 block diagram
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4x13
Abstract: No abstract text available
Text: DEVICE PACKING 1. SHIPPING CONTAINERS AND HANDLING 1.1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain
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Untitled
Abstract: No abstract text available
Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain
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J4444444444444444444444444444
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CP-52
Abstract: No abstract text available
Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain
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FLC301XP
Abstract: FLC301XP equivalent FLK052XP Fujitsu GaAs FET application note ISS1B1 CS98E1V6R800-K41D CS98E1V6R000-K41B fujitsu "application notes" FJS-DS-158 fll171
Text: APPLICATION NOTES II. FET CHIPS A. REMOVAL OF GaAs FET AND HEMT CHIPS FROM SHIPPING CONTAINERS 1 REQUIREMENTS Anti-static work surface Grounding cable and wrist Metal tweezers or vacuum Clean container to receive Binocular microscope with strap probe transferred chips
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