SG-BGA-6116 Search Results
SG-BGA-6116 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| MPC860PZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860PVR80D4 |
|
32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC855TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860TCZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
|
| MPC860ENZQ50D4 |
|
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
|
|
SG-BGA-6116 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| SG-BGA-6116 | Ironwood Electronics | GHz BGA Sockets-1.0mm; IC Size X (mm): 13; IC Size Y (mm): 15; IC Array X: 11; IC Array Y: 15; Max Pincount: 165; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): 0.4; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.2; Max Package Code: BGA165C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) | Original |