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    SAC305 REFLOW PROFILE Search Results

    SAC305 REFLOW PROFILE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    AM79C970AVC-G Rochester Electronics LLC Rochester Manufactured 79C970, Ethernet Controller, 144 LQFP Package, Commercial Temp spec. Visit Rochester Electronics LLC Buy
    LUSB3193002 Amphenol Communications Solutions Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste Visit Amphenol Communications Solutions
    UPD703185GC-XXX-8EU-A Renesas Electronics Corporation 32-bit Microcontrollers, LQFP, / Visit Renesas Electronics Corporation
    UPD703111GM-15-UEU Renesas Electronics Corporation 32-bit Microcontrollers, LQFP, / Visit Renesas Electronics Corporation
    UPD70F3134AYGJ-UEN-A Renesas Electronics Corporation 32-bit Microcontrollers, LQFP, / Visit Renesas Electronics Corporation

    SAC305 REFLOW PROFILE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste
    Text: REFLOW PROCESS GUIDELINE Introduction This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak reflow requirements. Each board must be characterized to establish reliable profile and to ensure high


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    PDF J-STD-020 SAC305 AN-112 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste

    SAC405

    Abstract: Sn57Bi SAC305 reflow profile sac305 SAC305 reflow J-STD-020B SAC-305 jstd for msl 3
    Text: Application Note High Temperature Report Revision 3 OBJECTIVE The objective of this application note is to provide the customer with a general understanding of ANADIGICS’ product’s high temperature capabilities associated with 2nd level lead-free assembly. It also


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    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


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    PDF 15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3

    JEDEC J-STD-020d.1

    Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
    Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined


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    PDF J-STD-020D APPNOTE-007 JEDEC J-STD-020d.1 sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform SAC-305

    DAP 07

    Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
    Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2


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    PDF AN-1187 DAP 07 JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220

    PCB design for 0.2mm pitch csp package

    Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
    Text: Table of Contents Introduction . 2 Package Overview . 2


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    PDF CSP-9-111S2) CSP-9-111S2. AN-1187 PCB design for 0.2mm pitch csp package SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220

    MCM SERIES Q-TECH OSCILLATOR

    Abstract: No abstract text available
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


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    PDF 500kHz 160MHz EAR99 36000G 12kHz QT84L11, 25MHz MCM SERIES Q-TECH OSCILLATOR

    Untitled

    Abstract: No abstract text available
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


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    PDF 500kHz 160MHz EAR99 160MHz 36000G QT84L11, 25MHz 30MHz

    CRYSTAL DIP 16MHZ

    Abstract: MCM SERIES Q-TECH OSCILLATOR
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


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    PDF 500kHz 160MHz EAR99 160MHz 36000G 20MHz, QT84L11, 25MHz 12kHz CRYSTAL DIP 16MHZ MCM SERIES Q-TECH OSCILLATOR

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications
    Text: Application Note AN-112 Using Convection Ovens for Attaching Z-COMM VCOs Introduction: This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak


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    PDF AN-112 J-STD-020 SAC305 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications

    QT84HCD10M-50

    Abstract: 32MHz Quartz oscillator 30MHz
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


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    PDF 500kHz 160MHz EAR99 160MHz 36000G QT84L11, 25MHz 30MHz QT84HCD10M-50 32MHz Quartz oscillator 30MHz

    Untitled

    Abstract: No abstract text available
    Text: LOW PROFILE QT81, QT82, QT83 MINIATURE CLOCK OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 5 X 7 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built


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    PDF 500kHz 160MHz EAR99 raQT82LD10M, 32MHz QT83HCD10M, 40MHz 36000G 30MHz

    Untitled

    Abstract: No abstract text available
    Text: LOW PROFILE QT81, QT82, QT83 MINIATURE CLOCK OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 5 X 7 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built


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    PDF 500kHz 160MHz EAR99 fQT82LD10M, 32MHz QT83HCD10M, 40MHz 36000G 30MHz

    SAC405

    Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
    Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’


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    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


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    24-7068-1407

    Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
    Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com


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    MCM SERIES Q-TECH OSCILLATOR

    Abstract: No abstract text available
    Text: LOW PROFILE QT81, QT82, QT83 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built


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    PDF 500kHz 160MHz QT81HCD10M-50 000MHz 000MHz QT82LD10M, 32MHz QT83HCD10M, 40MHz 12kHz MCM SERIES Q-TECH OSCILLATOR

    Asp1251

    Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
    Text: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .


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    PDF 100nF, TD431111615116 Asp1251 J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter

    33-2C

    Abstract: No abstract text available
    Text: 8200 Series Miniature Surface Mount Power Inductors SELECTION GUIDE Inductance, L Order Code 0.1V @ 10KHz Tolerance H % FEATURES n RoHS compliant n Up to 2.0A IDC n 1.0μH to 470μH n Ultra low profile n Low RDC n Tape and reel packaging n J-STD-020C reflow


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    PDF 10KHz 82102C 82152C 82222C 82332C 82472C 82682C 82103C 82153C 82223C 33-2C

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


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    PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    mems microphone

    Abstract: Laser microphone SAC305 ADMP421 admp401 paste profile AN-1068 microphone placement SAC305 reflow stencil
    Text: AN-1068 APPLICATON NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reflow Soldering of the MEMS Microphone by Santosh A. Kudtarkar and Jia Gao BACKGROUND This application note provides guidance and suggestions for


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    PDF AN-1068 ADMP401 ADMP421 AN08937-0-7/10 mems microphone Laser microphone SAC305 paste profile AN-1068 microphone placement SAC305 reflow stencil

    SAC405

    Abstract: SAC305 SAC405 Data sheet SN60 SN62 SN63
    Text: AN-010 Rev A Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components Introduction This application note describes recommended practices and guidelines for the successful assembly of M/A-COM E-Series surface mount components using automated solder reflow


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    PDF AN-010 of255 SAC405 SAC305 SAC405 Data sheet SN60 SN62 SN63

    GR-78-CORE

    Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
    Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with


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    PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527

    SN63PB37

    Abstract: No abstract text available
    Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product


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    PDF EM907 EM828 SN63PB37