capacitor 47 nano
Abstract: No abstract text available
Text: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001
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reflow soldering profile BGA
Abstract: BGA PROFILING solder joint bga warpage bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100X
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100X
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.
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2002/95/EC)
120Hz,
120Hz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WD Chip Type, Low Impedance High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ10 x 10, : 1 time) Chip type, low impedance temperature range up to +105°C.
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2002/95/EC)
100kHz,
100kHz
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.
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2002/95/EC)
120Hz,
120Hz
8100B
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WD Chip Type, Low Impedance High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ10 x 10, : 1 time) Chip type, low impedance temperature range up to +105°C.
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2002/95/EC)
100kHz,
100kHz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WS Chip Type, High CV High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time) Chip type higher capacitance in large case size.
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2002/95/EC)
120Hz,
120Hz
8100Z
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Untitled
Abstract: No abstract text available
Text: ALUMINUM ELECTROLYTIC CAPACITORS WS Chip Type, High CV High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time) Chip type higher capacitance in large case size.
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2002/95/EC)
120Hz,
120Hz
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Reflow Soldering Guide
Abstract: berex
Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo
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Reflow61110
B61110
Reflow Soldering Guide
berex
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reflow soldering profile BGA
Abstract: reflow temperature bga BGA PROFILING bga rework
Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already
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Untitled
Abstract: No abstract text available
Text: NSEV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS NSEV SERIES 85¡C Bi-polar, Lead Free Reflow Soldering. ♦FEATURES • Lead Free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics Category Temperature Range
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120Hz)
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Untitled
Abstract: No abstract text available
Text: NSKV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS NSKV SERIES 105¡C Bi-polar, Lead Free Reflow Soldering. ♦FEATURES • Lead Free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics Category Temperature Range
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120Hz)
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zarlink label
Abstract: ZL30462 Zarlink Semiconductor
Text: ZLAN-70 Applications of the ZL30462 Manufacturing Guidelines Application Note Contents November 2003 1.0 Operating Temperature 2.0 Storage Temperature 3.0 Use & Storage 4.0 Reflow parameters 5.0 Reel Characteristics 1.0 4.0 Surface mount product suitable for Convection reflow
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ZLAN-70
ZL30462
zarlink label
ZL30462
Zarlink Semiconductor
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Untitled
Abstract: No abstract text available
Text: SEV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS SEV SERIES 85¡C, Lead Free Reflow Soldering. ♦FEATURES • Case Dia ø3~ø10mm • Lead free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics Category Temperature Range
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120Hz)
10x10
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Untitled
Abstract: No abstract text available
Text: JKV CHIP ALUMINUM ELECTROLYTIC CAPACITORS JKV SERIES 105°C Standard, High Temperature Reflow Soldering. FEATURES • Load Life : 105°C 1000 hours. • High Temperature reflow soldering is available. • Available for high density mounting. • RoHS compliance.
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MFK Series
Abstract: No abstract text available
Text: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).
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