Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-LF - EPOXY fibre-glass FR4 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-LF
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RE200-HPDS
Abstract: No abstract text available
Text: Prototyping Board RE200-HPDS - SRBP-paper FR2 1.5 mm double-sided 35 µm CU npth - organic soldering protection (OSP) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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RE200
Abstract: No abstract text available
Text: 2002-05-13 PRODUKTINFORMATION Vi reserverar oss mot fel samt förbehåller oss rätten till ändringar utan föregående meddelande ELFA artikelnr 48-320-02 Labbkort RE200 HP 48-320-10 Labbkort RE200 EP
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RE200
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Untitled
Abstract: No abstract text available
Text: Laborkarte RE200-LFDS - Epoxyd FR4 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - heißverzinnt (HAL-leadfree) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-LFDS
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RE200-HPDS
Abstract: No abstract text available
Text: Laborkarte RE200-HPDS - Phenolharz-Hartpapier FR2 1,5 mm, zweiseitig 35 µm CU nicht durchkontaktiert - organischer Oberflächenschutz (OSP) - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-HP - SRBP-paper FR2 1,5 mm single-sided 35 µm CU - organic soldering protection OSP - 38 x 61 single-hole conductor 2,2 mm Ø - hole spacing 2,54 x 2,54 mm - hole dia 1,0 mm - size 100 x 160 mm
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RE200-HP
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RE200-HPDS
Abstract: No abstract text available
Text: Carte d´Expérimentation RE200-HPDS - résine phénolplaste FR2 1,5 mm, double face 35 µm CU - Protection organique de la surface OSP - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-HPDS
RE200-HPDS
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-C3 - CEM3 1.5 mm single-sided 35 µm CU - hot air leveling HAL-leadfree - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-C3
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RE200
Abstract: fr4 datasheet FR4 data sheet RE200-LF
Text: Tarjeta experimental RE200-LF - epóxido FR4 1,5 mm, por un lado 35 µm CU - estañado en caliente HAL-leadfree - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm
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RE200-LF
RE200
fr4 datasheet
FR4 data sheet
RE200-LF
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re200
Abstract: No abstract text available
Text: Laborkarte RE200-HP - Phenolharz-Hartpapier FR2 1,5 mm, einseitig 35 µm CU - organischer Oberflächenschutz OSP - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-HP
re200
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Untitled
Abstract: No abstract text available
Text: Tarjeta experimental RE200-LFDS - epóxido FR4 1,5 mm, por dos lados 35 µm CU npth - estañado en caliente (HAL-leadfree) - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm
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RE200-LFDS
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re200
Abstract: No abstract text available
Text: Laborkarte RE200-LF - Epoxyd FR4 1,5 mm, einseitig 35 µm CU - heißverzinnt HAL-leadfree - 38 x 61 Lötinseln 2,2 mm Ø - Lochraster 2,54 x 2,54 mm - Lochdurchmesser 1,0 mm - Größe 100 x 160 mm
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RE200-LF
re200
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Untitled
Abstract: No abstract text available
Text: Prototyping Boards Dual Inline RE200-HT - High-temperature printed circuit board - On auf polyimide resin base glass fiber P97 1.50 mm, one-sided 35 m CU - Surface in chemical Au - Suitable for temperature ranges up to 260˚ centigrade - 38 x 61 soldering island 2.2 mm
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RE200-HT
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Untitled
Abstract: No abstract text available
Text: Prototyping Board RE200-LFDS - EPOXY fibre-glass FR4 1.5 mm double-sided 35 µm CU npth - hot air leveling (HAL-leadfree) - 38 x 61 single-hole conductor 2.2 mm Ø - hole spacing 2.54 x 2.54 mm - hole dia 1.0 mm - size 100 x 160 mm
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RE200-LFDS
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RE200
Abstract: RE20
Text: Carte d´Expérimentation RE200-C3 - CEM3 1,5 mm, simple face 35 µm CU - étamé à chaud HAL-leadfree - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-C3
RE200
RE20
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RE200B
Abstract: Sensor Pir RE200B RE-200B RE200B sensor RE200B datasheet PIR RE200B Fresnel lens IR RE200B amplifier circuit re200b FL65
Text: INFRARED PARTS MANUAL RE200B FL65 S211FL GLOLAB CORPORATION Thank you for buying our Pyroelectric Infrared components. The goal of Glolab is to produce top quality electronic kits, products and components. All of our kits are designed by Glolab engineers and tested in our laboratory.
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RE200B
S211FL
S211FL
RE200B
Sensor Pir RE200B
RE-200B
RE200B sensor
RE200B datasheet
PIR RE200B
Fresnel lens
IR RE200B
amplifier circuit re200b
FL65
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re200
Abstract: transistor C3 esta ltm240m1-l01
Text: Tarjeta experimental RE200-C3 - CEM3 1,5 mm, por un lado 35 µm CU - estañado en caliente HAL-leadfree - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm - tamaño 100 x 160 mm
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RE200-C3
re200
transistor C3
esta
ltm240m1-l01
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RE200-HPDS
Abstract: No abstract text available
Text: Tarjeta experimental RE200-HPDS - papel endurecido con resina fenolada FR2 1,5 mm, por dos lados 35 µm CU npth - revestido de laca de soldadura - 38 x 61 nodos de soldadura Ø 2,2 mm - trama de agujeros 2,54 x 2,54 mm - diámetro de los agujeros 1,0 mm
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RE200-HPDS
RE200-HPDS
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Untitled
Abstract: No abstract text available
Text: Carte d´Expérimentation RE200-HP - résine phénolplaste FR2 1,5 mm, simple face 35 µm CU - Protection organique de la surface OSP - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-HP
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RE200-LF
Abstract: No abstract text available
Text: Carte d´Expérimentation RE200-LF - fibre de verre époxyde FR4 1,5 mm, simple face 35 µm CU - étamé à chaud HAL-leadfree - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-LF
RE200-LF
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Untitled
Abstract: No abstract text available
Text: Carte d´Expérimentation RE200-LFDS - fibre de verre époxyde FR4 1,5 mm, double face 35 µm CU NPTH - étamé à chaud (HAL-leadfree) - 38 x 61 pastilles 2,2 mm Ø - pas 2,54 x 2,54 mm - perforation 1,0 mm - dimensions 100 x 160 mm
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RE200-LFDS
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passive infrared sensor
Abstract: SDA02-54 Z8FS040xHH20EG DC PIR CONTROLLER 8 reset ZMOTION detection NCL-10S SBDI46-504AA nicera NCL-10IL PIR SENSORS pir sensor free schematic diagram
Text: Z8FS040 ZMOTION Detection and Control Family Featuring PIR Technology Product Specification PS028511-0112 Copyright 2012 Zilog, Inc. All rights reserved. www.zilog.com ZMOTION™ Detection and Control Family Product Specification ii Warning: DO NOT USE THIS PRODUCT IN LIFE SUPPORT SYSTEMS.
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Z8FS040
PS028511-0112
RE200B-P
passive infrared sensor
SDA02-54
Z8FS040xHH20EG
DC PIR CONTROLLER 8 reset
ZMOTION detection
NCL-10S
SBDI46-504AA
nicera NCL-10IL
PIR SENSORS
pir sensor free schematic diagram
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Untitled
Abstract: No abstract text available
Text: ZMOTION 20-Pin Detection and Control Development Kit Quick Start Guide QS008502-0813 Introduction This Quick Start Guide acquaints users with Zilog’s ZMOTION 20-Pin Detection and Control Development Kit Revision B or later, and provides instructions for setting up and
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20-Pin
QS008502-0813
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PIR Sensor Interface
Abstract: LS6506R LS6507R pir sensor
Text: LSI/CSI UL A3800 LS6506R LS6507R LSI Computer Systems, Inc. 1235 Walt Whitman Road, Melville, NY 11747 631 271-0400 FAX (631) 271-0405 PIR SENSOR INTERFACE June 2009 FEATURES: • Latching relay drive (LS6506R) • LS6506R is suitable for incandescent and fluorescent lights,
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A3800
LS6506R
LS6507R
LS6506R)
LS6506R
LS6507R)
MPSA42
001uF,
120VRMS
PIR Sensor Interface
LS6506R LS6507R
pir sensor
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