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    R5C485-LQFP144

    Abstract: bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP
    Text: 8 Part List 8-1 Exploded View 8-1-1 System Exploded Housing Bottom P28 8-1 This Document can not be used without Samsung’s authorization. 8 Part List No Part Name Code No Q’ty Specification Vendor 1 UNIT/HOUSING-BOTTOM BA75-01374A 1 SON & ARRK 2 FAN BA31-00018A


    Original     		PDF BA75-01374A BA31-00018A BA92-02744A BA75-01375A BA59-01294A BA61-00910A BA43-00134A BA75-01376A BA59-01052A BA75-01377A R5C485-LQFP144 bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP

    bc725

    Abstract: BC248 BC249 BC195 BC105* BC106* BC107* BC108* BC109* BC110 bc711 BC710 bc188 BC712 BC246
    Text: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU


    Original     		PDF 100nF 100nF, 2K/33OHM 220PF 10000NF, bc725 BC248 BC249 BC195 BC105* BC106* BC107* BC108* BC109* BC110 bc711 BC710 bc188 BC712 BC246

    BC249

    Abstract: BC248 BC246 bc711 bc725 bc732 BC247 BC217 samsung R519 BC735
    Text: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU


    Original     		PDF 100nF 100nF, 2K/33OHM 220PF 10000NF, BC249 BC248 BC246 bc711 bc725 bc732 BC247 BC217 samsung R519 BC735