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Text: Recommended P.C.B Loyout Componend Side 12.SO 2.00 difl Ep (Lp n CD NOTE: A. 0 2 0 1 22MR008 S_Q 20Z X (2522A X - 08 G D T -T) 1 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /