Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C02 144-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Ceramic material Alumina Mounting height 2.0mm MAX FPT-144C-C02 144-pin ceramic QFP
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FPT-144C-C02
144-pin
FPT-144C-C02)
F144005SC-1-3
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FPT-144P-M05
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)
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FPT-144P-M05
144-pin
FPT-144P-M05)
F144006S-2C-3
FPT-144P-M05
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QFP 144 PACKAGE
Abstract: QFP144-P-2828-1
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M01 EIAJ code : ∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01 144-pin plastic QFP (FPT-144P-M01)
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FPT-144P-M01
QFP144-P-2828-1
144-pin
FPT-144P-M01)
QFP 144 PACKAGE
QFP144-P-2828-1
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QFP144
Abstract: QFP144-P-2020-1
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)
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FPT-144P-M03
QFP144-P-2020-1
144-pin
FPT-144P-M03)
QFP144
QFP144-P-2020-1
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QFP 144 PACKAGE
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP (FPT-144C-C01) 3.30(.130) (Mounting height)
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FPT-144C-C01
144-pin
FPT-144C-C01)
F144004SC-3-2
QFP 144 PACKAGE
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP
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FPT-144C-C01
144-pin
FPT-144C-C01)
F144004SC-3-2
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QFP144
Abstract: QFP Package 144 lead QFP144-P-2828-2
Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)
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FPT-144P-M02
QFP144-P-2828-2
144-pin
FPT-144P-M02)
QFP144
QFP Package 144 lead
QFP144-P-2828-2
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frequency hopping spread spectrum
Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Text: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM
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Z87001/Z87L01
Z87001
Z87L01
144-Pin
and001010
frequency hopping spread spectrum
spread spectrum receiver circuity
TDD synchronizer
cordless phone "control signals"
cordless phone Transceiver IC
direct sequence spread spectrum
P115
Z87000
Z87001
Z87010
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A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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Untitled
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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96-144M65
QQ-B-626.
-or96-144M65-P
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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Original
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PDF
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QQ-B-626.
-or97-68340-P
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Untitled
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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PDF
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96-144M65
-or96-144M65-P
144-PGM15048-30
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144 QFP body size
Abstract: ASTM-B16-85
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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PDF
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-or97-68340-P
145-PGM15024-30
144 QFP body size
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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145-PGM15024-30
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ASTM-B16-85
Abstract: MIL-T-10727
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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PDF
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-or97-68340-P
145-PGM15024-30
ASTM-B16-85
MIL-T-10727
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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Original
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PDF
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-or97-68340-P
145-PGM15024-30
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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Original
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PDF
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-or97-68340-P
145-PGM15024-30
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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Original
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PDF
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-or97-68340-P
145-PGM15024-30
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144 QFP body size
Abstract: ASTM-B16-85 96-144M65
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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PDF
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96-144M65
96-144M65
-or96-144M65-P
144-PGM15048-30
144 QFP body size
ASTM-B16-85
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18025
Abstract: No abstract text available
Text: P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES • Convert surface mount QFP packages to a 15x15 PGA footprint • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs • Pins are mechanically fastened and soldered to board using Aries’ patented process,
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144-Pin
15x15
C36000
ASTM-B16-00
97-68340-P
145-PGM15024-30
18025
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Untitled
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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96-144M65
-or96-144M65-P
144-PGM15048-30
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AMS-QQ-N-290
Abstract: ASTM-B16-00
Text: P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES • Convert surface mount QFP packages to a 15x15 PGA footprint • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs • Pins are mechanically fastened and soldered to board using Aries’ patented process,
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144-Pin
15x15
C36000
97-68340-P
145-PGM15024-30
AMS-QQ-N-290
ASTM-B16-00
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Untitled
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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Original
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PDF
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96-144M65
-or96-144M65-P
144-PGM15048-30
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144 QFP body size
Abstract: No abstract text available
Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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96-144M65
-or96-144M65-P
144-PGM15048-30
144 QFP body size
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