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    QFN 48 7X7 STENCIL Search Results

    QFN 48 7X7 STENCIL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QFN 48 7X7 STENCIL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    qfn 48 7x7 stencil

    Abstract: SI53302-B-GM 53302-B-GM
    Text: Si53302 1 : 1 0 L OW J I T T E R U NIVERSAL B U FF E R /L EVEL T RANSLATOR WITH 2 : 1 I NPUT M UX Features Ordering Information: See page 25. Applications Q6 Q6 VDDOB 34 37 35 38 39 DIVA 1 33 DIVB SFOUTA[1] SFOUTA[0] 2 32 3 31 SFOUTB[1] SFOUTB[0] Q2 4 Q2 5


    Original     		PDF Si53302 44-QFN qfn 48 7x7 stencil SI53302-B-GM 53302-B-GM

    qfn 48 7x7 stencil

    Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
    Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die


    Original     		PDF XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: Si53302 1 : 1 0 L OW J I T T E R U NIVERSAL B U FF E R /L EVEL T RANSLATOR WITH 2 : 1 I NPUT M UX Features Ordering Information: See page 29. Applications 34 37 35 36 38 39 40 41 The Si53302 is an ultra low jitter ten output differential buffer with pin-selectable


    Original     		PDF Si53302

    cross reference guide

    Abstract: Silabs SI53302-B-GM
    Text: Si53302 1 : 1 0 L OW J I T T E R U NIVERSAL B U FF E R /L EVEL T RANSLATOR WITH 2 : 1 I NPUT M UX Features         10 differential or 20 LVCMOS outputs Ultra-low additive jitter: 45 fs rms Wide frequency range: 1 to 725 MHz  Any-format input with pin selectable


    Original     		PDF Si53302 44-QFN cross reference guide Silabs SI53302-B-GM

    rs 422

    Abstract: Si53312
    Text: Si53312 1 : 1 0 L OW J I T T E R U NIVERSAL B U FF E R /L EVEL T RANSLATOR WITH 2 : 1 I NPUT M UX <1.25 GH Z Features Ordering Information: See page 25. Applications Q6 Q6 VDDOB 34 37 35 38 39 DIVA 1 33 DIVB SFOUTA[1] SFOUTA[0] 2 32 3 31 SFOUTB[1] SFOUTB[0]


    Original     		PDF Si53312 44-QFN rs 422

    MO-220 7x7 0.4 pitch

    Abstract: si5331 Si53313
    Text: Si53313 D UAL 1:5 L OW J I T T E R B UFFER / L EVEL T RANSLATOR <1.25 GH Z Features        10 differential or 20 LVCMOS outputs Ultra-low additive jitter: 100 fs rms  Wide frequency range: 1 MHz to 1.25 GHz  Any-format input with pin selectable


    Original     		PDF Si53313 44-QFN MO-220 7x7 0.4 pitch si5331

    Si53303

    Abstract: No abstract text available
    Text: Si53303 D UAL 1:5 L OW J I T T E R B UFFER / L EVEL T RANSLATOR Features         10 differential or 20 LVCMOS outputs Ultra-low additive jitter: 100 fs rms Wide frequency range: 1 to 725 MHz Any-format input with pin selectable


    Original     		PDF Si53303 44-QFN

    Si53315

    Abstract: 44qfn
    Text: Si53315 1 : 1 0 L O W J I TT E R U N I V E R S A L B U F F E R /L E V E L T R A N S L A T O R W IT H 2 : 1 I N P U T M U X A N D I N D I V I D U A L O E < 1 . 2 5 G H Z Features         10 differential or 20 LVCMOS outputs Ultra-low additive jitter: 100 fs rms


    Original     		PDF Si53315 44qfn

    qfn 48 7x7 stencil

    Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical


    Original     		PDF

    marking 18w sot23

    Abstract: marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG
    Text: Tape and Reel Packaging Specifications BRD8011/D Rev. 7, January−2007 SCILLC, 2007 Previous Edition @ 2006 “All Rights Reserved’’ http://onsemi.com Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated.


    Original     		PDF BRD8011/D January-2007 marking 18w sot23 marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG

    md 5406

    Abstract: No abstract text available
    Text: Si 5 3 4 5 / 4 4 /42 1 0 - C H A N N E L , A NY -F R E Q U E N C Y, A NY - O U T P U T J I T T E R A T T E N U A T O R /C LOC K M U LT IP L IE R Features Preliminary Rev. 0.9 7/14 Copyright 2014 by Silicon Laboratories VDDO9 OUT8 VDDO8 OUT7 OUT7 VDDO7 53


    Original     		PDF Si5345 Si5345: Si5344: Si5342: md 5406

    md 5406

    Abstract: pin out md 5406 Si5341
    Text: S i 5 3 4 1/40 L O W - J I T T E R, 1 0 - O U T P U T , A NY -F R E Q U E N C Y, A NY -O U T P U T CLOCK GENERATOR Features RSVD OUT8 OUT8 VDDO8 OUT7 OUT7 VDDO7 54 53 52 51 50 49 OUT9 VDDO9 OUT9 58 55 VDD 59 RSVD FB_IN 60 56 FB_IN 61 OUT6 44 OUT6 RST 6 43


    Original     		PDF

    AN315

    Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
    Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are


    Original     		PDF AN315 AN315REV1 AN315 an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer

    Untitled

    Abstract: No abstract text available
    Text: S i 5 3 4 7/46 D UAL / Q UAD D S P L L A N Y - F R E Q U E N C Y, A NY -O U TP U T JITTER ATTENUATORS Features IN0 IN0 IN3 IN3 VDD OUT7 OUT7 VDDO7 RSVD RSVD OUT6 OUT6 VDDO6 OUT5 OUT5 VDDO5 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDD LOL_B LOL_C 4 45 OUT4


    Original     		PDF Si5347 64QFN Si5347: Si5346:

    mosfet 4800

    Abstract: schematic diagram inverter 12v to 24v 30a schematic diagram inverter 500w USING MOSFET 4606 MOSFET INVERTER ltsx e3 mosfet driver ic mt 1389 de aot 110 optocoupler 4558 opamp schematic ic 4440 40w amplifier 12v LTPG e3
    Text: May 2008 Product Selection Guide Operational Amplifiers Data Converters Linear Regulators Switching Regulators µModule DC/DC Converters Battery Chargers Hot Swap Interface Filters High Frequency Silicon Oscillators Comparators µP Supervisor References High


    Original     		PDF D-59387 D-73230 1-800-4-LINEAR mosfet 4800 schematic diagram inverter 12v to 24v 30a schematic diagram inverter 500w USING MOSFET 4606 MOSFET INVERTER ltsx e3 mosfet driver ic mt 1389 de aot 110 optocoupler 4558 opamp schematic ic 4440 40w amplifier 12v LTPG e3

    SMD LTYN

    Abstract: ic 4440 40w amplifier 12v ltls e3 Weston 2281 thermometer LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 LTPG e3 5Dx diode SMD LTABA
    Text: November 2009 Product Selection Guide Amplifiers Data Converters Linear Regulators Switching Regulators µModule DC/DC Converters Battery Chargers LED Drivers Hot Swap Interface Filters RF/Wireless Silicon Oscillators Comparators Supervisory Circuits References


    Original     		PDF D-59387 D-73230 1-800-4-LINEAR SMD LTYN ic 4440 40w amplifier 12v ltls e3 Weston 2281 thermometer LT3060ITS8 Transistor SR 6863 TO-126 LTC3855EUH-1 LTPG e3 5Dx diode SMD LTABA

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    lm 7803 3V Positive Voltage Regulator

    Abstract: ic 4440 40w amplifier 12v ltsx e3 mt 1389 de LM 4440 AUDIO AMPLIFIER CIRCUIT w10 mic package bridge rectifier PF08109B smd code marking 162 sot23-5 ul 1741 grid te inverter datasheet ltqt e3
    Text: May 2009 Product Selection Guide Amplifiers Data Converters Linear Regulators Switching Regulators µModule DC/DC Converters Battery Chargers LED Drivers Hot Swap Interface Filters High Frequency Silicon Oscillators Comparators P Supervisor References Reference


    Original     		PDF D-59387 D-73230 1-800-4-LINEAR lm 7803 3V Positive Voltage Regulator ic 4440 40w amplifier 12v ltsx e3 mt 1389 de LM 4440 AUDIO AMPLIFIER CIRCUIT w10 mic package bridge rectifier PF08109B smd code marking 162 sot23-5 ul 1741 grid te inverter datasheet ltqt e3