in-process quality inspections
Abstract: process flow diagram
Text: 9 OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical and visual/mechanical
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A -1123* test
Abstract: Family of Testability Products process flow diagram
Text: pASIC 1 FAMILY Quality Program OVERVIEW The pASIC product quality program has the goal to meet or exceed the industry's highest quality standards. The program includes product acceptance inspection in the Standard Process Flow see the following Standard Process Flow diagram . Electrical, visual/mechanical and check on the
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bsim3v3
Abstract: C035ANV IMD2 transistor pmos Vt poly dielectric capacitor
Text: ANV Process ID: SM/SN [C035ANV] Applications Main Process Flow Situations where single-cell operation or • P Substrate extended battery life are key, e.g: • High Voltage Wells optional
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C035ANV]
bsim3v3
C035ANV
IMD2 transistor
pmos Vt
poly dielectric capacitor
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cmos transistor 0.35 um
Abstract: 0.35Um c035 ZENER C035 5V IMD2 transistor bsim3v3 polysilicon 20v zener diode 3.3v zener C035
Text: 0.35µ µm 5V / 3.3V CMOS Process ID: SL [C035] Applications Main Process Flow • Interfacing high density industry- • P Substrate standard 0.35um core logic to 5V • LOCOS Field Oxidation
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SG 1050
Abstract: C06 60V polysilicon fuse
Text: 0.6µ µm 60V CMOS Process ID: SG [C06] Applications Main Process Flow • Automotive, including 42V standard. • P Substrate • HV Well Formation • LOCOS Field Oxidation • Twin Retrograde Wells
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bsim3v3
Abstract: C08p
Text: 0.7µ µm 13.5V CMOS Process ID: SE/SF [C08p] Applications Main Process Flow • High voltage interface to mixed signal • P Substrate circuits, e.g: LCD display drivers, Power • Twin Wells
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asic design flow
Abstract: HIV52002-1
Text: 2. HardCopy Design Center Implementation Process HIV52002-1.0 Introduction This chapter discusses the HardCopy IV back-end design flow executed by the Altera® HardCopy Design Center when developing your HardCopy IV device. HardCopy IV Back-End Design Flow
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HIV52002-1
asic design flow
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Altera hardcopy ASIC
Abstract: No abstract text available
Text: 2. HardCopy Design Center Implementation Process HIII53002-2.0 Introduction This chapter discusses the HardCopy III back-end design flow executed by the Altera® HardCopy Design Center when developing your HardCopy III device. HardCopy III Back-End Design Flow
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HIII53002-2
Altera hardcopy ASIC
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LOCOS
Abstract: ON SEMICONDUCTOR 613 poly dielectric capacitor 95nm poly1 poly2 resistor
Text: 0.5µ µm 3.3V CMOS Process ID: SH [C05] Applications Main Process Flow • Mixed signal embedded systems / • P Substrate systems on a chip SOC . • N Well • High precision mixed signal circuits.
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Untitled
Abstract: No abstract text available
Text: System Design Process Introduction Specifying Components Conceptually, system definition is the first step in the design process. This involves visualizing the PLD’s interaction with the rest of the electronic system and defining a general flow diagram to determine the design’s basic
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Abstract: No abstract text available
Text: System Design Process Introduction Specifying Components Conceptually, system definition is the first step in the design process. This involves visualizing the PLD’s interaction with the rest of the electronic system and defining a general flow diagram to determine the design’s basic
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ON SEMICONDUCTOR 613
Abstract: metal oxide in capacitor
Text: 0.7µ µm 5V CMOS Process ID: SA/SB [C08n] Applications Main Process Flow • Mixed signal embedded systems / • N Substrate systems on a chip SOC . • Twin Wells • High precision mixed signal circuits.
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bsim3
Abstract: mos transistor ON SEMICONDUCTOR 613
Text: 0.6µ µm 5V CMOS Process ID: SC/SD [C06] Applications Main Process Flow • Mixed signal embedded systems / • P Substrate systems on a chip SOC . • Twin Wells • High precision mixed signal circuits.
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Abstract: ZARLINK SEMICONDUCTOR ON SEMICONDUCTOR 613 C035 0.35uM 5V C035 5V
Text: 0.35µ µm 3.3V CMOS Process ID: SJ/SK [C035] Applications Main Process Flow • Mixed signal embedded systems / • P Substrate systems on a chip SOC . • LOCOS Field Oxidation • High precision mixed signal circuits.
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H51003-1
Abstract: No abstract text available
Text: 3. Design Migration Flow H51003-1.1 Migration Flow Altera Corporation August 2003 Design migration for HardCopy Stratix devices occurs in several steps, outlined in this section and shown in Figure 3–1. The migration process uses both proprietary and third-party EDA tools, and has been
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Stepper motor and driver selection
Abstract: application note driver motor stepper ULN floppy disk Stepping Motors stepper drive uln 2003 stepper motor electronic damping pm500 watt power supply circuit diagram ic. uln 2003 30W dc motor current driver stepper motor driver uln 2003
Text: Stepper motor and driver selection Stepper motors are used in many different types of applications this makes it difficult to recommend a general step-by-step design flow chart. The design process is more an iterative process, involving experience, calculation
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EP4SE230
Abstract: EP4SGX180 EP4SGX70 F1517 HIV52001-2 EP4SGX360 EP4SGX290 EP4SGX360HF35 EP4SE820 ep4sgx230f1517
Text: Section I. HardCopy IV Design Flow and Prototyping with Stratix IV Devices This section provides a description of the design flow and the implementation process used by the HardCopy Design Center. It also provides information about mapping Stratix IV devices to HardCopy® IV devices and associated power and configuration
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FBGA 1760
Abstract: F1517 EP3SE110F stratix III fpga
Text: Section I. HardCopy III Design Flow and Prototyping with Stratix III Devices This section provides a description of the design flow and the implementation process used by the HardCopy Design Center. It also provides information about mapping Stratix III devices to HardCopy® III devices and associated power and configuration
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Abstract: No abstract text available
Text: SPECIFICATION FLOW CHART To the right is a flowchart showing how to navigate through all top level menus by pressing the d and a buttons. _ Underline denotes factory default setup Accuracy: +0.5°C temp; 0.03% rdg. process typical Resolution: 1°/0.1°; 10 µV process
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RS-485
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LF-301MA
Abstract: LF-301MK LF-301VA LF-301VK 7 segment LED display 7 Segment single Display COMMON anode PIN detail
Text: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zDimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend
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LF-301
LF-301VA
LF-301VK
LF-30
LF-301MA
LF-301MK
LF-301VA
LF-301VK
7 segment LED display
7 Segment single Display COMMON anode PIN detail
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LF-301VA
Abstract: LF-301VK LF-301MA LF-301MK
Text: LF-301 A / K Series LED displays Single Digit Surface Mount LED Numeric Display LF-301 A / K Series zExternal dimensions Unit : mm 5±0.5 0.2 13 11 8 1 (1) zFeatures 1) Re-flow soldering ∗ 2) Pb-free availabe 3) Automatic mounting with taping pack ∗Number of re-flow process shall be recommend
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LF-301
LF-301VA
LF-301VK
LF-301MA
LF-301MK
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MLCC 0402 MTBF
Abstract: process flow diagram MIL-PRF-123 MIL-PRF-55681 Surface Mount MLC Capacitors reliability BME MLCC Novacap
Text: Multilayer Ceramic Capacitors Product Test and Reliability Guide March 2008 1 Introduction 2) Base Metal Electrode BME) versus Precious Metal Electrode (PME) Ceramic Capacitors 3) Process Flow Diagram 4) NOVACAP Surface Mount Product Reliability Groups 5) Capacitor Design
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RF-55681/EIA-198
MIL-PRF-38534
MIL-PRF-55681
MLCC 0402 MTBF
process flow diagram
MIL-PRF-123
MIL-PRF-55681
Surface Mount MLC Capacitors reliability
BME MLCC
Novacap
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csp process flow diagram
Abstract: jedec Package Shipping Trays
Text: 2.0 µBGA* PACKAGE/PRODUCT PROCESS FLOW Wafer Fabrication Fab 2.1 Overview The µBGA package cross-sectional diagram is illustrated below Figure 3 and displays the various materials used to manufacture the package. This section outlines the µBGA package
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A17J
Abstract: No abstract text available
Text: 54AC11034,74AC11034 HEX NONINVERTERS D2957, FEBRUARY 1988 - REVISED APRIL 1993 Flow-Through Architecture Optimizes PCB Layout Center-PIn Vqc and GND Configurations Minimize High-Speed Switching Noise EPICm Enhanced-Performance Implanted CMOS 1-|im Process
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54AC11034
74AC11034
D2957,
500-mA
300-mil
D2967,
A17J
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