Moisture Sensitivity Levels MICROCHIP PIC Package
Abstract: 78610 delamination leadframe barber excursion AN598
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
Moisture Sensitivity Levels MICROCHIP PIC Package
78610
delamination leadframe
barber excursion
AN598
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tm 1628 smd
Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
DS00599B-page
tm 1628 smd
AN598
78610
3002 ic equivalent
cte table epoxy
IC 3004
200B
hear
HEINEMANN
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1n4733 smd
Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
DS00599B-page
1n4733 smd
moisture during operation
triac scr schematic
AN599
capacitors coefficient of thermal expansion
soft solder die bonding
TP2222A
triac triggering ic
DS00598A-page
Triac soft turn on
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822 smd
Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
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SMD codes databook
Abstract: SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap manufacturing process calcium chloride ic shelf life MIL-STD-38510 QFP Shipping Trays
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
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J-STD-020 MSL Rating
Abstract: mil J-STD-020
Text: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC.
J-STD-020 MSL Rating
mil J-STD-020
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Untitled
Abstract: No abstract text available
Text: KEMET Surface Mount Ceramic Revision H, 9 June 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC
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90Sn10
Abstract: No abstract text available
Text: KEMET Surface Mount Ceramic Revision Nil, 01 November 2005 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2005/618/EC.
90Sn10
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IC51-0562-1514
Abstract: Yamaichi IC51-0644-807 footprint IC51-0562 socket tqfp 56 socket Yamaichi TQFP IC51-0804-808 IC51-0644-807
Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology SCZA003A March 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest
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SCZA003A
IC51-0562-1514
Yamaichi IC51-0644-807 footprint
IC51-0562 socket
tqfp 56 socket
Yamaichi TQFP
IC51-0804-808
IC51-0644-807
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mar 618
Abstract: MAR 618 transistor
Text: KEMET Surface Mount Ceramic Array Revision C, 12 Mar 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC
mar 618
MAR 618 transistor
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tungsten slug glass diode
Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
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UPS840e3
Abstract: EIA-481-2
Text: UPS840e3 POWERMITE 3 SURFACE MOUNT 8 AMP 40 V SCHOTTKY RECTIFIER SCOTTSDALE DIVISION APPEARANCE The UPS840e3 offers a small and powerful surface mount package that is RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications
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UPS840e3
UPS840e3
EIA-481-2
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UPS840e3
Abstract: FR4 epoxy EIA-481-2 MIL-PRF19500 POWERMITE
Text: UPS840e3 POWERMITE 3 SURFACE MOUNT 8 AMP 40 V SCHOTTKY RECTIFIER SCOTTSDALE DIVISION APPEARANCE The UPS840e3 offers a small and powerful surface mount package that is RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications
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UPS840e3
UPS840e3
FR4 epoxy
EIA-481-2
MIL-PRF19500
POWERMITE
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Yamaichi IC51-0644-807 footprint
Abstract: IC51-0562-1514 footprint ssop 0.635 IC51-0562 socket IC51-0644-807 IC51-0804-808 Yamaichi IC51-0804-808 tqfp 56 socket SN700870PM SN700782PCB
Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology Tom Jackson Advanced System Logic – Semiconductor Group SCZA003A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor
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SCZA003A
Yamaichi IC51-0644-807 footprint
IC51-0562-1514
footprint ssop 0.635
IC51-0562 socket
IC51-0644-807
IC51-0804-808
Yamaichi IC51-0804-808
tqfp 56 socket
SN700870PM
SN700782PCB
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V18AUMLA1206
Abstract: V18AUMLA1210 V18AUMLA1812 V18AUMLA2220 V18AUMLA2220H
Text: Next Surface Mount Varistors Multilayer Transient Voltage Surge Suppressor AUML Varistor Series The AUML Series of Multilayer Transient Surge Suppressors was specifically designed to suppress the destructive transient voltages found in an automobile. The most common transient condition results from large
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-55oC
125oC.
V18AUMLA222OT.
V18AUMLA2220H.
V18AUMLA2220A.
V18AUMLA1206
V18AUMLA1210
V18AUMLA1812
V18AUMLA2220
V18AUMLA2220H
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S840
Abstract: msc 0043 MSC 501
Text: UPS840e3 Compliant Powermite 3 Surface Mount 8 Amp 40 V Schottky Rectifier DESCRIPTION The UPS840e3 offers an exceptionally small and powerful RoHS compliant package for a 40 V, 8 Amp Schottky rectifier. Competing solutions typically come only in much larger packages. It is an
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UPS840e3
UPS840e3
RF01102,
S840
msc 0043
MSC 501
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A5625-01
Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
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powermite
Abstract: EIA-481-B TR13 8700 CJ marking s17 do216 DO-216
Text: UPS5817e3 and UPS5819e3 POWERMITE 1 SURFACE MOUNT 1 AMP 20 and 40 V SCHOTTKY RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount package that is RoHS compliant for a 1 Amp rated Schottky. These ratings
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UPS5817e3
UPS5819e3
UPS5819e3
UPS5817e3
DO-216
powermite
EIA-481-B
TR13
8700 CJ
marking s17
do216
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HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E
Abstract: GH sc-59 to-92 hall sensor ultrasonic range meter IC Ultrasonic welding circuit transistor Common collector configuration thermoset plastics Application Note 27703 HALL EFFECT TO 92 leadframe
Text: GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC
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N140 ALLEGRO
Abstract: Ultrasonic welding generator Allegro Hall-Effect ICs GH SC-59 Loctite 406 pressure low die bond sensor RTV HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E FLEX THERMOSET COMPOUND TO-236A TRA-CON
Text: Application Note 27703.1‡ GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical
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UPS5819E3
Abstract: s19 schottky diode EIA-481-B MIL-PRF19500 TR13
Text: UPS5817e3 and UPS5819e3 POWERMITE 1 SURFACE MOUNT 1 AMP 20 and 40 V SCHOTTKY RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount package that is RoHS compliant for a 1 Amp rated Schottky. These ratings
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UPS5817e3
UPS5819e3
UPS5819e3
UPS5817e3
DO-216
s19 schottky diode
EIA-481-B
MIL-PRF19500
TR13
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SN63 PB37 alpha
Abstract: No abstract text available
Text: ^EDI Ceramic SOJ Electronic D#rign*lnc. Military Surface Mount Advances in the density ol Static SRAM and Dynamic Surface Mount Packages (DRAM) memory devices have resulted in increased die size Packaging of active devices for surface mount has been and elevated power requirements. With these issues, the
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EIA-469
Abstract: JESD22a121 JESD22-A121 MIL-PRF-55581 EIA-459 kemet COTS X5R 0402cog NC0402C
Text: KEMET Surface Mount Ceramic Revision I, 22 Sept 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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MIL-PRF-55581
L-PRF-55581
EIA459
EIA-469:
2002/95/EC,
2005/618/EC
P/NC0402C
7S07PP
EIA-469
JESD22a121
JESD22-A121
EIA-459
kemet COTS X5R
0402cog
NC0402C
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Untitled
Abstract: No abstract text available
Text: 4-TERMINAL SURFACE MOUNT RESISTORS* CAPACITORS *COILS* DELAY LINES SF SERIES □ Industry’s widest range! Values from .001Q-5KQ, tolerances to ±0.01%, TC's to 5ppm, 1W to 3W □ Excellent for current sensing applications □ Available on exclusive SWIFT delivery program!
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001Q-5KQ,
1ft1000
R0025,
20ppm,
100ppm
100ppm,
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