Untitled
Abstract: No abstract text available
Text: Module no:2771146 LabelId:2771146 Operator:Phoenix 17:43:38, Donnerstag, 28. Juni 2001 UKKB 5 Terminal width 6.2 IEC 2 [mm ] IEC 947-7-1 rigid solid flexible stranded AWG 0.2-4 0.2-4 24-12 H CAIgL Description U [A] [V] 32 500 BV/LR/RMRS/NK Type Order No.
|
Original
|
|
PDF
|
smd a17 power
Abstract: 94611 smd a7 transistor smd transistor a4 smd transistor A6 3 WS512K32-XXX top mark smd A9
Text: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120nS ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611
|
Original
|
WS512K32-XXX
512Kx32
120nS
66-pin,
512Kx32,
1024Kx16
01HMX
100nS
02HMX
smd a17 power
94611
smd a7 transistor
smd transistor a4
smd transistor A6 3
WS512K32-XXX
top mark smd A9
|
PDF
|
WS512K32-XXX
Abstract: smd A018
Text: WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 PRELIMINARY* FEATURES • Access Times of 70, 85, 100, 120ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.185 inch square, Hermetic
|
Original
|
WS512K32-XXX
512Kx32
120ns
66-pin,
04HZX
01HMX
100ns
02HMX
WS512K32-XXX
smd A018
|
PDF
|
A016 SMD
Abstract: Mark A12 SMD smd a7 transistor smd transistor A1 smd transistor a4 top mark smd A9
Text: WS128K32-XXX 128Kx32 SRAM MODULE FEATURES • Access Times of 70, 85, 100, 120nS ■ MIL-STD-883 Compliant Devices Available ■ Commercial, Industrial and Military Temperature Ranges ■ 5 Volt Power Supply ■ Low Power CMOS ■ Packaging • 66-pin, PGA Type, 1.075 inch square, Hermetic
|
Original
|
WS128K32-XXX
128Kx32
120nS
MIL-STD-883
66-pin,
01HYX
100nS
02HYX
03HYX
A016 SMD
Mark A12 SMD
smd a7 transistor
smd transistor A1
smd transistor a4
top mark smd A9
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Module no:2774017 LabelId:2774017 Operator:Phoenix 17:43:56, Donnerstag, 28. Juni 2001 UKK 5 Terminal width 6.2 IEC 2 [mm ] IEC 947-7-1 rigid solid flexible stranded AWG 0.2-4 0.2-4 24-12 I U [A] [V] 32 500 H CAgE IL F Description Type Order No. Pcs. Pkt.
|
Original
|
|
PDF
|
smd g2U
Abstract: WF512K32N-XH1X5 WF512K32-XG1UX5 WF512K32-XG2UX5 WF512K32-XG4TX5 WF512K32-XXX5
Text: WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES • Access Times of 60, 70, 90, 120, 150ns ■ Organized as 512Kx32 ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic
|
Original
|
WF512K32-XXX5
512Kx32
150ns
512Kx32
04HNX
01HZX
120ns
02HZX
03HZX
smd g2U
WF512K32N-XH1X5
WF512K32-XG1UX5
WF512K32-XG2UX5
WF512K32-XG4TX5
WF512K32-XXX5
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WF512K32-XXX5 HI-RELIABILITY PRODUCT 512Kx32 5V FLASH MODULE, SMD 5962-94612 FEATURES • Access Times of 60, 70, 90, 120, 150ns ■ Organized as 512Kx32 ■ Packaging ■ Commercial, Industrial and Military Temperature Ranges • 66 pin, PGA Type, 1.075" square, Hermetic
|
Original
|
WF512K32-XXX5
512Kx32
150ns
64KBytes
01HUX
02HUX
03HUX
04HUX
01HTX
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WF128K32-XXX5 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES • Access Times of 50*, 60, 70, 90, 120, 150ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400
|
Original
|
WF128K32-XXX5
128KX32
150ns
16KBytes
05HMX
120ns
|
PDF
|
SMKDSP 1.5/ 8-5.08
Abstract: smkdsp 17-33 phoenix contact 17 11 08 33
Text: Module no:1733415 LabelId:1733415 Operator:Phoenix 16:19:22, Donnerstag, 28. Juni 2001 SMKDSP 1,5 Angled connection of 35° with test connection Pitch 5.0 or 5.08 IEC rigid I U stranded AWG [A] [V] Connection data 0.14-2.5 0.14-1.5 26-14 22 250 2 [mm ] solid
|
Original
|
|
PDF
|
V5-001
Abstract: din 4007
Text: Module no:2791016 LabelId:2791016 Operator:Phoenix 17:49:33, Donnerstag, 28. Juni 2001 UKK 5-DIO with diode from top to bottom Terminal width 6.2 IEC rigid [mm ] solid 2 Connection data 0.2-4 flexible stranded AWG 0.2-4 24-12 I U [A] [V] 32 500 ) 1 Diode type fitted 1N 4007
|
Original
|
|
PDF
|
4Mx8
Abstract: No abstract text available
Text: WF512K64-XG4WX5 Page 1 of 10 WF512K64-XG4WX5 HI-RELIABILITY PRODUCT 512Kx64 5V FLASH MODULEPRELIMINARY* FEATURES • Access Times of 70, 90, 120, 150ns ■ 5 Volt Programming. 5V ± 10% Supply. ■ Packaging ■ Low Power CMOS, 6.5mA Standby 116 lead, 40mm square, Hermetic CQFP Package 504
|
Original
|
WF512K64-XG4WX5
512Kx64
150ns
64KBytes
512Kx64,
1Mx32,
2Mx16,
512K64
/datasheets/517056/data-WF512K64-150G4WI5
4Mx8
|
PDF
|
MSTBA 2.5 -5.08
Abstract: phoenix 17 33 67 7 MSTBVA 2.5 3 g
Text: Module no:1755516 LabelId:1755516 Operator:Phoenix 11:34:29, Mittwoch, 1. März 2000 MSTBVA 2,5/…-G Header with side panels, plug-in direction vertical to the p.c.b. Pitch 5.0 or 5.08 I U [A] [V] 12 250 No. of positions Dim. a [mm] 2 Connection data H CAK
|
Original
|
5/10-G
5/11-G
5/12-G
MSTBA 2.5 -5.08
phoenix 17 33 67 7
MSTBVA 2.5 3 g
|
PDF
|
mvstbw
Abstract: Phoenix Contact 17 92 53 7 MVSTBW 2.5/3-ST MVSTBW 2.5/4-ST MVSTBW 2.5/16-ST-5.08
Text: Module no:1792524 LabelId:1792524 Operator:Phoenix 16:33:57, Donnerstag, 28. Juni 2001 MVSTBW 2,5/…-ST Plug-in direction vertical to the conductor axis, connection point facing the rippled wall W of the header Pitch 5.0 or 5.08 (IEC) 2 [mm ] Connection data
|
Original
|
|
PDF
|
CS466
Abstract: No abstract text available
Text: WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5 Volt Power Supply ■ Packaging ■ Low Power CMOS 66 pin, PGA H Type, 1.185 inch square, Hermetic Ceramic HIP (Package 401).
|
Original
|
512Kx32
120ns
512Kx32,
1Mx16
WS512K32-XXX
WS512K32-XG2TX
WS512K32N-XHX
120ns
CS466
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: m WS512K32-XCJX M/HITE M IC R O E L E C T R O N IC S 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15,17, 20, 25ns Two pinout options ■ Packaging • Standard commercial pinout M aster W E • 68 Lead, JLCC (Package 701) • G2 p in o u t fo r upgrade path to m ilita ry grad e d ev ices
|
OCR Scan
|
WS512K32-XCJX
512Kx32
512Kx32
512K32
0Q020b3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: f i - YZÀ WS512K32B-XXXE WHITE / M I C R O E L E C T R O N I C S 512Kx32 SRAM MODULE ADVANCED* FEATURES • A ccess Tim es o f 1 5 ,1 7 , 20, 25ns ■ Low P ow er BiCMOS ■ ■ BiCM O S: • R a d ia tio n T o le ra n t w ith E p ita x ia l Layer Die Packaging
|
OCR Scan
|
WS512K32B-XXXE
512Kx32
S512K
512K32B-XG
|
PDF
|
Untitled
Abstract: No abstract text available
Text: V Z À I/VHITE /MICROELECTRONICS WPD8M72-XMDC 8Mx72 DRAM D IM M FEATURES GENERAL DESCRIPTION • The WPD8M72-XMDC is a 8M x 72 bit Dynamic RAM high density memory module. The module consists of thirty-six 4M x 4 bit DRAMs in 24-pin TSOP packages. The DRAMs are
|
OCR Scan
|
WPD8M72-XMDC
8Mx72
WPD8M72-XMDC
24-pin
168-pin
WPD8M72-60MDC
110ns
WPD8M72-70MDC
130ns
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 512Kx32 3.3V SRAM MODULE ADVANCED* FEATURES • Commercial Temperature Range ■ Access Times of 15, 17, 20ns ■ Low Voltage Operation: ■ TTL Compatible Inputs and Outputs • 3.3V ± 1 0% Po w er Supply ■ Fully Static Operation: ■ Packaging • 68-lead, JLCC/PLCC, Package 701
|
OCR Scan
|
512Kx32
68-lead,
512Kx32;
1Mx16
WS512K32BV-XCJC
300000Q
WS512K32BV-XCJC
512Kx32
|
PDF
|
ct 5066
Abstract: 617 610 372 A ST 9727 semelec denso toyota
Text: [sO OPTOELECTHOWICS AUTHORIZED REPRESENTATIVES AND DISTRIBUTORS North American Technical Representatives ALABAMA Com Rep Madison Tel: 256-772-9982 Fax: 256-772-8693 CANADA Cont. Canadian Source Corp Kanata, Ontario Tel: 613-599-5882 Fax: 613-599-5886 INDIANA (Cont.)
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a M/HITE /M ICRO ELECTRO N ICS 256Kx32 SRAM MODULE WPS256K32-XPJX ADVANC ED ' FEATURES • Access Tim es of 1 5 ,1 7 ,2 0 , 25ns TTL C om patible Inputs and CM OS Outputs I/O Com patible w ith 3 .3 V Devices ■ Organized as 256K x32, User Configurable as 5 1 2Kx16
|
OCR Scan
|
256Kx32
WPS256K32-XPJX
|
PDF
|
I01b-1
Abstract: 01b SMD
Text: WHITE /M IC R O E L E C T R O N IC S Ç 2 W S512K32-XXX 512Kx32 SRAM MODULE. SMD 5962-94611 PRELIMINARY* FEATURES • A ccess Tim es o f 70, 8 5 , 1 0 0 , 120ns ■ C om m ercial, In d u stria l and M ilita ry T e m pe ratu re Ranges ■ Packaging ■ TTL C om p atible Inputs and O utputs
|
OCR Scan
|
S512K32-XXX
512Kx32
120ns
66-pin,
512Kx32,
1024Kx16
01HXX
02HXX
03HXX
04HXX
I01b-1
01b SMD
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WPS128K32V-XPJC WHITE /VI IC ROE LECT RON IC S 128Kx32 SRAM MODULE ADVANCED* FEATURES • A ccess T im es o f 1 5 ,1 7 , 20, 25ns ■ Packaging ■ ■ Fully S ta tic O p e ra tio n : • 6 8 - le a d , P la stic PLCC, 2 5 .15 mm 0.990 inch square ■ Three S ta te O utputs
|
OCR Scan
|
WPS128K32V-XPJC
128Kx32
4-------------------------24mm
128K32
|
PDF
|
Untitled
Abstract: No abstract text available
Text: I/I/HITE /MICROELECTRONICS WPD32M72-XMDC 32Mx72 DRAM DIMM GENERAL DESCRIPTION FEATURES • The WPD32M72-XMDC is an 32M x 72 bit Dynamic RAM high density memory module. The module consists of thirty-six 16M x 4 bit DRAMs in 32-pin TSOP packages. The DRAMs are
|
OCR Scan
|
WPD32M72-XMDC
32Mx72
WPD32M72-XMDC
32-pin
168-pin
WPD32M72-60MDC
WPD32M72-70MDC
130ns
32M72
|
PDF
|
Untitled
Abstract: No abstract text available
Text: a WS512K32BV-XXXE WHITE /M ICROELECTRONICS 512Kx32 3.3V SRAM MODULE PRELIMINARY* FEATURES • A c c e s s T i m e s o f 1 5f , 1 7, 2 0 n s ■ C o m m e r c i a l , In d u s tr ia l and M i l i t a r y T e m p e r a t u r e R a ng e s ■ M IL - S T D - 8 8 3 C o m p l i a n t D e v ic e s A v a i l a b l e
|
OCR Scan
|
WS512K32BV-XXXE
512Kx32
|
PDF
|
