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    PACKAGE MARKING Search Results

    PACKAGE MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE MARKING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    820 marking

    Abstract: top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code
    Text: Package Description How Package Dimensions Are Indicated/Codes/Marking 1. How Package Dimensions Are Indicated 2. Package Codes 3. Marking DB81-10003-1E 1 Package Description (How Package Dimensions Are Indicated/Codes/Marking) 1. How Package Dimensions Are Indicated


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    PDF DB81-10003-1E 820 marking top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code

    FX609LG

    Abstract: FX609 FX609J FX609L2 FX609P6
    Text: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant


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    PDF FX609P6 FX609 FX609J 22-pin FX609LG FX609J FX609L2

    Untitled

    Abstract: No abstract text available
    Text: FX609P6 package discontinued 1 FX609P6 package discontinued 2 FX609P6 package discontinued 3 FX609P6 package discontinued 4 FX609P6 package discontinued 5 Package Outlines Handling Precautions The FX609 is available in the package styles outlined below. Pin 1 identification marking is shown on the relevant


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    PDF FX609P6 FX609 FX609J 22-pin

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


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    PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    FX315P2

    Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
    Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number


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    PDF FX315 FX315LG 24-pin FX315P2 mX 1524 pin diagram CML marking

    date code marking samsung

    Abstract: samsung date code samsung samsung year code
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ date code marking samsung samsung date code samsung samsung year code

    samsung date code

    Abstract: samsung year code date code marking samsung
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ samsung date code samsung year code date code marking samsung

    KS88P0424

    Abstract: KS88P0416
    Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS88P_ KS88P0424 KS88P0416

    date code marking samsung

    Abstract: samsung date code functions of remocon
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ date code marking samsung samsung date code functions of remocon

    date code samsung

    Abstract: date code marking samsung telephone microcontroller caller id
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ date code samsung date code marking samsung telephone microcontroller caller id

    samsung year code

    Abstract: No abstract text available
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ samsung year code

    date code marking samsung

    Abstract: KS57P samsung date code
    Text: KS57 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS57P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS57P_ date code marking samsung KS57P samsung date code

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9203101M2A OBSOLETE LCCC


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    PDF 26-Aug-2013 5962-9203101M2A 5962-9203101MEA 5962-9203102MEA 5962-9203103Q2A 59629203103Q2A UC1863L/ 5962-9203103QEA

    JM38510/01405BEA

    Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
    Text: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP


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    PDF 21-Mar-2013 5962-9687802QEA 5962-9687802QFA JM38510/16303BEA JM38510/16304BEA JM38510/32201B2A JM38510/01405BEA SN74368A SN54LS367A-SP M38510 SN74367A SN54365A

    samsung 2416

    Abstract: eprom 2416 samsung date code date code marking samsung date code samsung samsung year code
    Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS88P_ samsung 2416 eprom 2416 samsung date code date code marking samsung date code samsung samsung year code

    samsung date code

    Abstract: date code marking samsung samsung date code marking samsung year code date code samsung
    Text: KS88 SERIES OTP FACTORY WRITING ORDER FORM 1/2 Product Description: Device Number: KS88P_-_(write down the ROM code number) Product Order Form: Package If the product order form is package: Pellet Package Type: Wafer _ Package Marking (Check One):


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    PDF KS88P_ samsung date code date code marking samsung samsung date code marking samsung year code date code samsung

    FX315P2

    Abstract: FX315 FX315LG
    Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number


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    PDF FX315 FX315LG 24-pin FX315LG FX315P2 14-pin FX315P2

    JM38510/01405BEA

    Abstract: M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/07006BCA ACTIVE CDIP


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    PDF 23-Apr-2013 JM38510/07006BCA JM38510/ 07006BCA JM38510/07006BDA 07006BDA JM38510/01405BEA M38510

    LS27

    Abstract: JM38510/01405BEA M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00404BCA OBSOLETE CDIP


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    PDF 11-Apr-2013 JM38510/00404BCA JM38510/30302B2A JM38510/ 30302B2A JM38510/30302BCA LS27 JM38510/01405BEA M38510

    JM38510/01405BEA

    Abstract: SN74368A SN54LS367A-SP M38510 SN74367A SN54365A
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9687802QEA OBSOLETE CDIP


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    PDF 11-Apr-2013 5962-9687802QEA 5962-9687802QFA JM38510/16303BEA JM38510/1630ti JM38510/01405BEA SN74368A SN54LS367A-SP M38510 SN74367A SN54365A

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) JM38510/30607B2A OBSOLETE LCCC


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    PDF 11-Apr-2013 JM38510/30607B2A JM38510/30607BEA SN54LS395AJ SN74LS395AD

    Untitled

    Abstract: No abstract text available
    Text: SDLS946 – PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) SN5496J OBSOLETE


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    PDF SDLS946 11-Apr-2013 SN5496J SN7496N SN74LS96D SN74LS96DR SN74LS96J SN74LS96N

    JM38510/01405BEA

    Abstract: M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00903BCA OBSOLETE CDIP


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    PDF 11-Apr-2013 JM38510/00903BCA JM38510/30605B2A JM38510/ 30605B2A JM38510/30605BCA JM38510/01405BEA M38510

    JM38510/01405BEA

    Abstract: SN74LS02N M38510/01401BJB M38510
    Text: PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) JM38510/00401BCA ACTIVE CDIP


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    PDF 11-Apr-2013 JM38510/00401BCA JM38510/00401BDA JM38510/07301BCA JM38510/07301BDA JM38510/30301B2A JM38510/01405BEA SN74LS02N M38510/01401BJB M38510