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    PACKAGE 12 Search Results

    PACKAGE 12 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE 12 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    QTLP690-AG

    Abstract: QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B
    Text: Analog Discrete Interface & Logic Optoelectronics Surface Mount LED Lamps • 0603 Package • 0606 Package • Right Angle Package • 0805 Package • 1206 Package • 1210 Package • 1.8 mm Dome Lens Package • PLCC-2 Package • PLCC-4 Package • Reflector Package


    Original     		PDF QTLP690C-E QTLP690C-O QTLP690C-Y QTLP690-AG QTLP690-AG QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B

    PACKAGE DIMENSIONS

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Ball caBGA Package . 12 120-Pin PQFP Package . 12 128-Pin PQFP Package . 13 128-Pin TQFP Package . 13


    Original     		PDF 20-Pin 20-Pin 300-Mil) 24-Pin 24-Pin 28-Pin PACKAGE DIMENSIONS

    3528 LED

    Abstract: led 3528 female PCB connector 2x5 HP LED 5mm 100nF 50V X7R MC7805CD2T 1B01S HSDL1001 HSMG-T400 "yellow led" 5mm
    Text: Bill of Materials Qty Ref Description 4 R8-R11 22R, 1%, 0.125W, 1206 Package 5 R3-R7 330R, 1%, 0.125W, 1206 Package 1 R2 10K, 1%, 0.125W, 1206 Package 1 R1 33K, 1%, 0.125W, 1206 Package 2 C3,C9 100nF, 50V, X7R Ceramic, 1206 Package 5 C4-C8 2.2uF, 16V, Tantalum, 3216 Package


    Original     		PDF R8-R11 100nF, 150uF, 1B01S HSMS-T400 HSMY-T400 HSMG-T400 MC7805CD2T SX28ACSMS-T400 3528 LED led 3528 female PCB connector 2x5 HP LED 5mm 100nF 50V X7R HSDL1001 "yellow led" 5mm

    SAMSUNG 834

    Abstract: No abstract text available
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD131 SAMSUNG 834

    pcb design 0,5 mm pitch

    Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD150 pcb design 0,5 mm pitch PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153

    SAMSUNG 834

    Abstract: pcb design 0,5 mm pitch STD130
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130

    D 4242

    Abstract: pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STDH150 D 4242 pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance

    pcb design 0,5 mm pitch

    Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
    Text: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm


    Original     		PDF STDL130 pcb design 0,5 mm pitch SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-48P-M15 48-pin FPT-48P-M15) F48025S-1C-1

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M16 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-48P-M16 48-pin FPT-48P-M16) F48026S-1C-1

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 46 PIN PLASTIC To Top / Package Lineup / Package Index LCC-46P-M02 46-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 12.00 mm Sealing method Plastic mold LCC-46P-M02


    Original     		PDF LCC-46P-M02 46-pin LCC-46P-M02) C46002S-4C-3

    TQFP 80 PACKAGE

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-80P-M15 80-pin FPT-80P-M15) F80028S-1C-1 TQFP 80 PACKAGE

    QFP-120P

    Abstract: 120-pin
    Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm


    Original     		PDF FPT-120P-M05 QFP120-P-1414-1 120-pin FPT-120P-M05) F120006S-2C-3 QFP-120P

    TQFP120

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape


    Original     		PDF FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3 TQFP120

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


    Original     		PDF FPT-100P-M18 100-pin FPT-100P-M18) F100029S-1C-1

    FPT-120P-M04

    Abstract: QFP120
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing


    Original     		PDF FPT-120P-M04 QFP120-P-2828-4 120-pin FPT-120P-M04) F120005S-3C-2 FPT-120P-M04 QFP120

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat


    Original     		PDF FPT-120C-C01 120-pin FPT-120C-C01) F120011SC-3-2

    FPT-64P-M09

    Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing


    Original     		PDF FPT-64P-M09 QFP064-P-1212-1 64-pin FPT-64P-M09) F64018S-1C-2 FPT-64P-M09 fujitsu 64-Pin Plastic QFP QFP064-P-1212-1

    FPT-120P-M03

    Abstract: QFP120
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing


    Original     		PDF FPT-120P-M03 QFP120-P-2828-3 120-pin FPT-120P-M03) F120004S-3C-2 FPT-120P-M03 QFP120

    QFP080-P-1212-1

    Abstract: No abstract text available
    Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M05 EIAJ code :∗QFP080-P-1212-1 80-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm


    Original     		PDF FPT-80P-M05 QFP080-P-1212-1 80-pin FPT-80P-M05) F80008S-2C-5 QFP080-P-1212-1

    Ablebond 8380

    Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
    Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that


    Original     		PDF CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping

    16MM TAPE PACKAGE

    Abstract: No abstract text available
    Text: Micrel Semiconductor Designing With LDO Regulators Package Orientation Feed Direction Feed Direction Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed Direction Feed Direction SOT-23 Package Orientation


    Original     		PDF OT-143 OT-223 OT-23 O-263 OT-23-5 16MM TAPE PACKAGE

    16MM TAPE PACKAGE

    Abstract: No abstract text available
    Text: Package O rientation Feed D irection Feed D irection Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed D irection Feed D irection SOT-23 Package Orientation 8mm Carrier Tape SOT-223 Package Orientation


    OCR Scan     		PDF OT-143 OT-223 OT-23 O-263 OT-23-5 16MM TAPE PACKAGE

    R604A

    Abstract: diode r207 R605A 60 diode R702 erg28 AF91-471 R205A R606A
    Text: DIODE MODULES Dimensions mm ERG28-12 ERG78-12 2 in one-package R201 19.6m >•> 017" AF89-692 (AF88-456) + ERG28 4-ERG78 1 1n one-package R101 (AF91-473) 2 in one-package R204 1 in one-package R102 (AF91-471) 3 M5<10 p" 59 mm 2 in one-package R207 2 in one-package


    OCR Scan     		PDF ERG28-12 ERG78-12 AF89-692) AF88-456) ERG28 4-ERG78 AF91-473) AF91-471) R205A AF89-746) R604A diode r207 R605A 60 diode R702 AF91-471 R606A