Untitled
Abstract: No abstract text available
Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb
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DPDD32MX4RSAY5
DPDD32MX4RSAY5
128Mb
30A222-00
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Untitled
Abstract: No abstract text available
Text: 128 Megabit CMOS DDR SDRAM DPDD32MX4RSAY5 PRELIMINARY PIN-OUT DIAGRAM DESCRIPTION: The is a Dense-Pac core technology used to create 3-Dimensional solid state memory arrays. The DPDD32MX4RSAY5 is a member of the LP-Stack family which applies the Dense-Pac technology to create a 128Mb
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DPDD32MX4RSAY5
DPDD32MX4RSAY5
128Mb
30A222-00
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DENSE-PAC
Abstract: SO-DIMM 144-pin
Text: 16Mx64, 66MHz, SODIMM 30A185-00 C 128 Megabyte SDRAM SODIMM DPSD16MX64RSW5 DESCRIPTION: PIN-OUT DIAGRAM The JEDEC compatible DPSD16MX64RSW5 is a high speed 128 Megabyte CMOS Synchronous DRAM Small Outline DIMM utilizing Dense-Pac’s new and innovative 3-D space saving
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16Mx64,
66MHz,
30A185-00
DPSD16MX64RSW5
DPSD16MX64RSW5
DPSD16MXRSW5
DENSE-PAC
SO-DIMM 144-pin
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC Programmable Logic DPL22V10A MICROSYSTEMS DESCRIPTION: The Dense-Pac Programmable Logic Module DPL is a 48-pin Pin Grid Array (PGA) designed to support two "22V10" field programmable array logic, 22 input, 10 macrocell output devices (DPL22V10A), including decoupling capacitors, at a
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DPL22V10A
48-pin
22V10"
DPL22V10A)
DPL22V1
24-pin
28-pad
22V10
L22V10
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DPV12832V
Abstract: 4-00J1 Dense-Pac Microsystems
Text: DENSE-PAC MICR OSY STEMS 2ÔE D • £75=1415 OOQQIBb ? «] >PC DPV12832V Dense-Pac Microsystems, Inc. ^ 128K X 32 UVEPROM VERSAPAC X 4 ¿ ,- / 3 '2 9 DESCRIPTION: The DPV12832V is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in
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DPV12832V
DPV12832V
66-pin
200ns
250ns
512KX8,
256KX16
128KX32
30A014-32
4-00J1
Dense-Pac Microsystems
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Untitled
Abstract: No abstract text available
Text: v DENSE-PAC 4 Programmable Logic M I C R O S Y S T E M S \ D P L 2 2 V 1 OA DESCRIPTION: The Dense-Pac Programmable Logic M odule DPL is a 48-pin
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48-pin
DPL22V10A)
L22V10
3OAO41-O0
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40-pin EPROM pinout
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS CDPM 2ÔE D Dense-Pac Microsystems, Inc. • 575^415 OGOQ^Sa 5 WËVPC DPV128X16A ^ H IG H SPEED 128K X 16 U V EP R O M PG A M O D U LE PRELIMINARY DESCRIPTIO N: The DPV128X16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPRO M devices in
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DPV128X16A
DPV128X16A
40-pin
256KX8
250ns
StaX16
T-46-13-29
V128X16
120ns
150ns
40-pin EPROM pinout
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Untitled
Abstract: No abstract text available
Text: Advance Data Sheet April 1998 microelectronics group Lucent Technologies Bell Labs Innovations A370-Type Analog Uncooled Flat-PAC Laser Module Features • Eight-pin flat-PAC package suitable for CATV applications ■ Frequency range up to 1.5 GHz ■ MQW F-P 1.3 fim laser with single-mode fiber
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A370-Type
TA-983
370-T
DS98-111LWP
DS97-317LWP)
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20-PAD
Abstract: 26LS32 pin diagram
Text: DENSE-PAC LOGIC MODULE MICROSYSTEMS 36-PIN PGA LOGIC DESCRIPTION: The Dense-Pac LO G IC M O DULE consists of two logic devices in standard JEDEC 20-pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired ceramic substrate. The 36 pins of the LOGIC M ODULE are
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20-pad
26LS32 pin diagram
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26LS32 pin diagram
Abstract: No abstract text available
Text: DENSE-PAC LOGIPAC M O D U LE 40-PIN PGA LOGIC MODULE M I C R O S Y S T E M S DESCRIPTION: The second Dense-Pac Logic module, the LOGIPAC consists of two logic devices in standard JED EC 20 pad ceramic LCC Leadless Chip Carrier packages, surface-mounted on a co-fired
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40-PIN
AHCT244
26LS32
30A027-00
26LS32 pin diagram
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Untitled
Abstract: No abstract text available
Text: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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DPV32X16A
40-pin
250ns
120ns
150ns
170ns
200ns
250ns
64KXB
32KX16
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit UVEPROM MICROSYSTEMS DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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DPV256X32V
DPV256X32V
66-pin
1024KX8,
512KX
256KX
250ns
120ns
150ns
200ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit U VEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV256X32V
66-pin
1024KX8,
512KX
256KX32
250ns
512KX16
30A014-33
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit UVEPROM DPV256X32V DESCRIPTION: The DPV256X32V is a 66-pin Pin Grid Array PGA consisting of four 256K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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DPV256X32V
DPV256X32V
66-pin
1024KX8,
512KX
256KX32
250ns
125-C
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 0.5 Megabit UVEPROM MICROSYSTEMS DPV32X16A DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of tw o 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.
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DPV32X16A
DPV32X16A
40-pin
250ns
120ns
150ns
200ns
64KX8
32KX16
00G138S
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 256 Megabyte SDRAM D IM M DPSD32ML64RW5 PIN-OUT DIAGRAM I— DESCRIPTION: The JEDEC compatible DPSD32ML64RW5 is a high speed 256 Megabyte CMOS Synchronous DRAM DIMM, consisting of thirty-two 2Mx8x4 SDRAM devices configured as 16 stacked
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DPSD32ML64RW5
3Q\207-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV3232VA
DPV3232VA
66-pin
32Kx32
250ns
128KX8,
64KX16
275R41S
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 2 Megabit UVEPROM MICROSYSTEMS DPV128X16A DESCRIPTION: The D P V 128X 16A is a 40-pin Pin Grid Array PGA consisting of two 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.
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DPV128X16A
40-pin
250ns
120ns
150ns
170ns
200ns
QDD1311
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit CMOS UVEPROM MICROSYSTEMS DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting o f four 128K X 8 CMOS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate w ith matched thermal
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DPV12832VA
DPV12832VA
66-pin
250nsC
30A014-62
27ST41S
000140b
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0-32k
Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
Text: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired
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dpv32XI6A
DPV32X16A
40pin
250ns
l/OO-1/015
30a04902
0-32k
CERAMIC PIN GRID ARRAY 120 pins
6A14
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs
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DPS3232V
DPS3232V
66-pin
128Kx32
256Kx32,
128KX8,
64KX16
32KX32
30A014-10
275T415
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Untitled
Abstract: No abstract text available
Text: 128 Megabit C M O S D D R SDRAM DPDD16MX8RLBY5 DPDD16MX8RSBY5 DENSE-PAC MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: PIN-OUT DIAGRAM The PL-Sack series is a family of interchangeable memory devices The 128 Megabit Double Data Rate Synchronous D RAM isa member
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DPDD16MX8RLBY5
DPDD16MX8RSBY5
DPDD16MX8R3BY5,
53A001-00
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS UVEPROM DPV256S32W DESCRIPTION: PIN-OUT DIAGRAM The DPV256S32W is a 256K x 32 high-speed CMOS UVEPROM module comprised of eight 128K x 8 monolithic CMOS UVEPROM's, an advanced high-speed CM OS decoder, resistor network and
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DPV256S32W
DPV256S32W
Organization10.
30A09400
150ns
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing
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DPS512X32ML/DPS512X32MW
DPS512X32ML/DPS512X32MW
72-Pin
PS512X32MW
30A14Ã
0001fl3M
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