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    MQFP SHIPPING TRAYS Search Results

    MQFP SHIPPING TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSP50214BVI Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    HSP50214BVC Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    ISL54100CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    ISL54102CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    HSP50415VI Renesas Electronics Corporation Wideband Programmable Modulator (WPM), MQFP-HS, /Tray Visit Renesas Electronics Corporation

    MQFP SHIPPING TRAYS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TQFP Shipping Trays

    Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
    Text: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity


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    PDF PB1084 1-888-ISP-PLDS TQFP Shipping Trays LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel

    TQFP Shipping Trays

    Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
    Text: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will


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    PDF PB1083 1-888-ISP-PLDS TQFP Shipping Trays MQFP Shipping Trays PB1083 Lattice PLSI

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


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    PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


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    PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Text: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


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    PDF CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray

    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    Intersil

    Abstract: MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


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    PDF JM38510/ 1-888-INTERSIL Intersil MOSFET TRANSISTOR SMD MARKING CODE ZA TSMC 0.13um process specification transistor smd marking za sot-23

    transistor smd za

    Abstract: smd transistor HX smd transistor HX 45 transistor smd xc transistor smd xb smd diode code T7 INTERSIL CROSS REFERENCE clocks ceramic pin grid array CPGA solder wire HMP CA3260
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


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    PDF JM38510/ 1-888-INTERSIL transistor smd za smd transistor HX smd transistor HX 45 transistor smd xc transistor smd xb smd diode code T7 INTERSIL CROSS REFERENCE clocks ceramic pin grid array CPGA solder wire HMP CA3260

    transistor smd za

    Abstract: smd transistor HX SMD transistor Mu CD4000 cross REFERENCE TEPQFN CERAMIC LEADLESS CHIP CARRIER transistor smd za 28 SMD TRANSISTOR 1B t S14 SMD CA3260
    Text: Ordering Nomenclature 19 2009 P RODUCT S ELECTION GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    PDF JM38510/ 1-888-INTERSIL transistor smd za smd transistor HX SMD transistor Mu CD4000 cross REFERENCE TEPQFN CERAMIC LEADLESS CHIP CARRIER transistor smd za 28 SMD TRANSISTOR 1B t S14 SMD CA3260

    L-band Tuner

    Abstract: Single Chip zero IF L-band Tuner DVB Satellite satellite tuners BPSK DEMODULATORS BPSK demodulator SNIM5 MT312 SL1925 SL1935 SP5769
    Text: MT312 - Satellite Channel Demodulator Zarlink Semiconductor Search MyZarlink: Sign In Product & Design | Register | Purchasing | Company | Careers PAGE CONTENTS products > product profiles > MT312 Features Typical Applications MT312 Satellite Channel Demodulator


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    PDF MT312 MT312 01-AUG-01 profiles/MT312 L-band Tuner Single Chip zero IF L-band Tuner DVB Satellite satellite tuners BPSK DEMODULATORS BPSK demodulator SNIM5 SL1925 SL1935 SP5769

    transistor smd marking za sot-23

    Abstract: MOSFET TRANSISTOR SMD MARKING CODE ZA TRANSISTOR SMD MARKING CODE KE sot-23 MARKING CODE ZA TRANSISTOR SMD MARKING CODE TK SMD MARKING CODE sdp intersil MARKING CODE ZA RF TRANSISTOR SMD MARKING CODE TK TW6817-LA1-GR smd transistor marking code XC
    Text: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2


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    PDF JM38510/ 1-888-INTERSIL transistor smd marking za sot-23 MOSFET TRANSISTOR SMD MARKING CODE ZA TRANSISTOR SMD MARKING CODE KE sot-23 MARKING CODE ZA TRANSISTOR SMD MARKING CODE TK SMD MARKING CODE sdp intersil MARKING CODE ZA RF TRANSISTOR SMD MARKING CODE TK TW6817-LA1-GR smd transistor marking code XC

    lqfp 64 Shipping Trays

    Abstract: DS310H
    Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging


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    ST 358

    Abstract: "network interface cards"
    Text: Advance Data Sheet October 1998 FASTCAT TM LU3X51FT Ethernet Transceiver 10/100Base-TX/FX Features 100 Mbits/s FX Transceiver 10 Mbits/s Transceiver • Compatible with IEEE 802.3u 100Base-FX standard ■ Reuses existing twisted-pair I/O pins for compatible fiber-optic transceiver pseudo-ECL PECL


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    PDF LU3X51FT 10/100Base-TX/FX 100Base-FX 10Base-T DS99-032LAN DS98-064LAN) ST 358 "network interface cards"

    INCOMING RAW MATERIAL INSPECTION checklist

    Abstract: INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION report format HPC 3022 INCOMING RAW MATERIAL INSPECTION procedure internal audit checklist raw material inventory forms ISO calibration certificate formats QCP0010 pressure gauge ISO calibration certificate format
    Text: ZONE REV .XX Unless otherwise specified, dimensions are in inches. DRAWN APP’VD DATE Initial Release per DCN 1570 05/03/90 02 Change per DCN 1680 05/22/90 JFC SA 02a S/W App Conversion per DCN 4004 01/13/93 KB RT 03 Change per DCN 4925 12/29/93 YN FM 04


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    PDF MAC0071 MAC0072) QAP0002 INCOMING RAW MATERIAL INSPECTION checklist INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION report format HPC 3022 INCOMING RAW MATERIAL INSPECTION procedure internal audit checklist raw material inventory forms ISO calibration certificate formats QCP0010 pressure gauge ISO calibration certificate format

    100base

    Abstract: No abstract text available
    Text: Advance Data Sheet December 1998 LU3X31T-T64 FASTCAT TM Single-Port 3 V 10/100 Ethernet Transceiver TX Overview The LU3X31T-T64 is a fully integrated 10/100 Mbits/s physical layer device with an integrated transceiver. It is provided in a 64-pin TQFP package with a low


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    PDF LU3X31T-T64 64-pin LU3X31TT64 DS99-011LAN 100base

    hd103

    Abstract: HD10 LU3X34FTR HD-1000 RMII PHY FD1000 HD100
    Text: Advance Data Sheet June 1999 LU3X34FTR Quad 3 V 10/100 Ethernet Transceiver TX/FX Overview The LU3X34FTR is a fully integrated, 4-port 10/100 Mbits/s physical layer device with an integrated transceiver. This part was designed specifically for 10/100 Mbits/s switches. These applications


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    PDF LU3X34FTR DS99-247LAN DS98-296LAN) hd103 HD10 LU3X34FTR HD-1000 RMII PHY FD1000 HD100

    Untitled

    Abstract: No abstract text available
    Text: Preliminary Data Sheet May 1999 LU3X54FT QUAD-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Introduction The LU3X54FT is a four-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and 100Base-FX repeaters


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    PDF LU3X54FT 10Base-T/100Base-TX/FX 10Base-T, 100Base-TX, 100Base-FX 100Base-FX. DS99-246LAN

    transistor w2d

    Abstract: transistor W1A 78 R-PDSO-G16 Package transistor w1d f 7914 b texas transistor w2a wirebond die flag lead frame CPU 414-2 Processor Module DATASHEET OF 8 pin DIP IC 741 transmitter tube 807
    Text: HighĆPerformance FIFO Memories European Edition Designer’s Handbook 1995 Advanced System Logic Printed in U.S.A. 0195 – CP SCAA024 Designer’s Handbook HighĆPerformance FIFO Memories European Edition 1995 HighĆPerformance FIFO Memories European Edition


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    PDF SCAA024 transistor w2d transistor W1A 78 R-PDSO-G16 Package transistor w1d f 7914 b texas transistor w2a wirebond die flag lead frame CPU 414-2 Processor Module DATASHEET OF 8 pin DIP IC 741 transmitter tube 807

    transistor w2d

    Abstract: LG monitor 14 inch wiring diagram picture tube transistor w1A 3000 Watt BTL Audio Amplifier R-PDSO-G56 Package PQFP 64 PM64 transmitter tube 807 R-PDSO-G16 Package transistor w2a laptop inverter SCHEMATIC TRANSISTOR
    Text: HighĆPerformance FIFO Memories Designer’s Handbook 1996 Advanced System Logic Products Printed in U.S.A. 0496 – CP SCAA012A Designer’s Handbook HighĆPerformance FIFO Memories 1996 HighĆPerformance FIFO Memories Designer’s Handbook 1996 Advanced System Logic Products


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    PDF SCAA012A transistor w2d LG monitor 14 inch wiring diagram picture tube transistor w1A 3000 Watt BTL Audio Amplifier R-PDSO-G56 Package PQFP 64 PM64 transmitter tube 807 R-PDSO-G16 Package transistor w2a laptop inverter SCHEMATIC TRANSISTOR

    intersil DATE CODE MARKING

    Abstract: pin diagram details of CD4015 y2010 R4573 B TA3842 wafer fab control plan TA388* transistor ESD test plan ta5142 R4573
    Text: Status of Document is: RELEASED Effective from: 07-AUG-2000 09:48:23 to Date Printed: 07-Aug-2000 10:33:38 Controlled Document QML QUALITY MANAGEMENT PLAN Title: QML QUALITY MANAGEMENT PLAN Specification Type: DOCS Specification Number :999015 Issue :24 Page :1 of 100


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    PDF 07-AUG-2000 28-SEP-1995 03-NOV-1995 21-SEP-1995 28-SEP-1995 intersil DATE CODE MARKING pin diagram details of CD4015 y2010 R4573 B TA3842 wafer fab control plan TA388* transistor ESD test plan ta5142 R4573

    manual FW82801BA motherboard

    Abstract: intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard
    Text: NOTE: PLEASE ADJUST SPINE TO PROPER WIDTH Europe Intel Corporation UK Ltd. Pipers Way Swindon Wiltshire SN3 1RJ UK Phone: England (44) 1793 403 000 France (33) 1 4694 7171 Germany (49) 89 99143 0 Italy (39) 02 575 441 Israel (972) 2 589 7111 Netherlands (31) 20 659 1800


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    PDF USA/2004/10K/MD/HP manual FW82801BA motherboard intel chipset 845 motherboard repair circuit Intel 815 FW82815 motherboard review INTEL FW82801BA motherboard INTEL FW82801BA microtek inverter service manual National SG 250w audio amplifier circuit diagram lcd power board schematic hp 1502 rg82855gme Msi 533 845gv Motherboard

    MQFP 28x28

    Abstract: No abstract text available
    Text: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS


    OCR Scan
    PDF 5M-1994. 1X1012 28X28 28X28 MQFP 28x28