mmc_write
Abstract: onenand xsr SAMSUNG NAND FTL KFAT XSR Porting Guide SAMSUNG NAND FLASH TRANSLATION LAYER samsung xsr abstract fore system m.a hindi K9K2G16U0M
Text: TFS4 Porting Guide 2007.08.16 , Version 1.4.2 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC(or HSMMC) host device driver.
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samsung tfs4
Abstract: samsung xsr Flash Translation Layer XSR Extended Sector Remapper XSR Porting Guide onenand xsr FAT32 NAND XSR SAMSUNG NAND FLASH TRANSLATION LAYER S3C2410
Text: TFS4 v1.5.0 Porting Guide 2006.05.02 , Version 1.5.0 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.
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samsung xsr
Abstract: FAT32 SAMSUNG NAND FTL XSR Porting Guide onenand xsr samsung tfs4 Nucleus RTOS 0x00000025 samsung sector remapper SAMSUNG NAND FLASH TRANSLATION LAYER
Text: TFS4 v1.6 Porting Guide 2006.05.29, Version 1.6 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.
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agreement1250
samsung xsr
FAT32
SAMSUNG NAND FTL
XSR Porting Guide
onenand xsr
samsung tfs4
Nucleus RTOS
0x00000025
samsung sector remapper
SAMSUNG NAND FLASH TRANSLATION LAYER
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48-PIN
Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
Text: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,
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W86L488
W86L488
48-QFN
48-PIN
FR30
GIO10
W86L488AY
W86L488Y
ase qfn 48
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K9F1G08U0A
Abstract: SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics
Text: W86L157 WINBOND MMC CARD CONTROLLER -I- Publication Release Date: December 2, 2004 Revision 0.7 W86L157 Preliminary Revision History VERSION ON WEB PAGES DATES VERSION 1 - 2/2004 0.5 First published. 2 16 4/6/2004 0.6 Add 48-pin LQFN package 3 18, 19 12/2/2004
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W86L157
W86L157
48-pin
produ480,
K9F1G08U0A
SAMSUNG 413 K9F1G08U0M
SAMSUNG 413 K9K1G08U0A
48-LQFN
2936A
K9F5608U0C
Flash Memory mmc
"Flash Memory select"
CSDN
cdi schematics
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"MMC CARD COMMANDS"
Abstract: 48-PIN FR30 GIO10 W86L488 W86L488AY W86L488Y MMC Electronics America CSD1146
Text: Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 Aug. 2002 0.50 First published. 2 Dec. 2002 0.60 Add QFN package. 3 P6, P8, P10, P11, P24, P25, P26, P41, P42,
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W86L488
W86L488
"MMC CARD COMMANDS"
48-PIN
FR30
GIO10
W86L488AY
W86L488Y
MMC Electronics America
CSD1146
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iCreate Technologies
Abstract: icreate
Text: i5141-TG i5141-TG SD/MMC Memory Card Controller Datasheet Version 1.1 iCreate Technologies Corporation 2006/9/28 2006 iCreate Technologies Corporation Page 1 / 20 iCreate Technologies Corporation reserves the right to change the specification in any manner without notice.
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i5141-TG
i5141-TG
iCreate Technologies
icreate
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DIM800DCM12-A000
Abstract: 4E26
Text: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS
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DIM800DCM12-A000
DS5548-2
DS5548-
DIM800DCM12-A000
4E26
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DIM800DCM12-A000
Abstract: No abstract text available
Text: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces July 2002 version DS5548-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548- KEY PARAMETERS
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DIM800DCM12-A000
DS5548-2
DS5548-
DIM800DCM12-A000
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DIM400DDM12-A000
Abstract: No abstract text available
Text: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5532-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM400DDM12-A000
DS5532-1
DS5532-2
DIM400DDM12-A000
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DIM1600FSM12-A000
Abstract: No abstract text available
Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5533-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM1600FSM12-A000
DS5533-1
DS5533-2
DIM1600FSM12-A000
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DIM2400ESM12-A000
Abstract: No abstract text available
Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5536-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM2400ESM12-A000
DS5536-1
DS5529-2
DIM2400ESM12-A000
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DIM1800ESM12-A000
Abstract: No abstract text available
Text: DIM1800ESM12-A000 DIM1800ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue April 2002, version DS5529-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM1800ESM12-A000
DS5529-1
DS5529-2
DIM1800ESM12-A000
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DIM800FSM12-A000
Abstract: No abstract text available
Text: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue March 2002, version DS5531-1.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM800FSM12-A000
DS5531-1
DS5531-2
DIM800FSM12-A000
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DIM800DDM12-A000
Abstract: No abstract text available
Text: DIM800DDM12-A000 DIM800DDM12-A000 Dual Switch IGBT Module Preliminary Information Replaces issue March 2002, version DS5528-1.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM800DDM12-A000
DS5528-1
DS5528-2
DIM800DDM12-A000
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Untitled
Abstract: No abstract text available
Text: DIM1200FSM12-A000 DIM1200FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5547-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM1200FSM12-A000
DS5547-1
DS5547-2
1050g
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DIM2400ESM12-A000
Abstract: No abstract text available
Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003
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DIM2400ESM12-A000
DS5536-2
DS5529-3
33arantee
DIM2400ESM12-A000
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DIM1600FSM12-A000
Abstract: 6x transistor
Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003
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DIM1600FSM12-A000
DS5533-2
DS5533-3
DIM1600FSM12-A000
6x transistor
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DIM1200FSM17-A000
Abstract: No abstract text available
Text: DIM1200FSM17-A000 DIM1200FSM17-A000 Single Switch IGBT Module Replaces May 2002, version DS5456-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5456-3.1 July 2002
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DIM1200FSM17-A000
DS5456-2
DS5456-3
3300Varantee
DIM1200FSM17-A000
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bi-directional switches IGBT
Abstract: DIM400PBM17-A000 bidirectional switch igbt matrix converter
Text: DIM400PBM17-A000 DIM400PBM17-A000 IGBT Bi-Directional Switch Module Preliminary Information Replaces issue June 2002, version DS5524-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates
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DIM400PBM17-A000
DS5524-2
bi-directional switches IGBT
DIM400PBM17-A000
bidirectional switch igbt matrix converter
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DIM1800ESM12-A000
Abstract: No abstract text available
Text: DIM1800ESM12-A000 DIM1800ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5529-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003
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DIM1800ESM12-A000
DS5529-2
DS5529-3
33arantee
DIM1800ESM12-A000
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DIM1800ESM12-A000
Abstract: LM 949 DS5529-2
Text: DIM1800ESM12-A000 DIM1800ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5529-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003
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DIM1800ESM12-A000
DS5529-2
DS5529-3
33arantee
DIM1800ESM12-A000
LM 949
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DIM800DDM17-A000
Abstract: No abstract text available
Text: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5433-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-4.1 July 2002
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DIM800DDM17-A000
DS5433-3
DS5433-4
240arantee
DIM800DDM17-A000
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Untitled
Abstract: No abstract text available
Text: DIM800DCM12-A000 DIM800DCM12-A000 IGBT Chopper Module Replaces issue May 2002 version DS5548-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5548-2.0 July 2002
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DIM800DCM12-A000
DS5548-1
DS5548-2
DIM800DCM12-A000
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