BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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SG-MLF-7010
Abstract: TL-TORQUEDRIVER-05
Text: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer
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225mm
TL-TORQUEDRIVER-05
MLF20A
025mm
SG-MLF-7010
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DG-QFN20A-01
Abstract: No abstract text available
Text: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable connection Minimum real estate required 12.225mm Compression plate distributes forces evenly Easily removable swivel socket lid
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225mm
DG-QFN20A-01
MLF20A
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MLF24
Abstract: SG-MLF-7003
Text: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 12.225mm IC guide prevents over compression of elastomer
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225mm
esLF24C
MLF16B
MLF12C
MLF28E
MLF28D
MLF20A
SG-MLF-7003
MLF24
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