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    Untitled

    Abstract: No abstract text available
    Text: LC Modules MULTILAYER CHIP IFTS, MIA AND MIF SERIES FEATURES • Closed magnetic circuit configuration eliminates cross coupling. Suitable for high density applications. • Monolithic inorganic material construction for high reliability. PC BOARD PATTERNS


    OCR Scan     		PDF MIA3225AR455 MIF3225F25R0 MIF3225F25R0 MIF3225F10R7 BBE-016, EVE-001

    tdk marking code

    Abstract: TDK EL
    Text: Multilayer Chip IFTs MIA and MIF Series FEATURES PRODUCT IDENTIFICATIONS MIA 3225 AR455 O □ □ □ • Shielded construction to minimize crosstalk in density mounting applications. • Adjustment free IFTs are well suited for high volume automated assembly.


    OCR Scan     		PDF AR455 F10R7 455kHz 25MHz F10R7 F25R0 MIA3225 tdk marking code TDK EL

    10.7MHz, shielded IF transformer

    Abstract: No abstract text available
    Text: Multilayer Chip IFTs MIA and MIF Series TDK has produced the world’s smallest Chip IFT. This adjustment free monolithic circuit is packaged in 3225 3.2L x 2.5W mm [.126 x .098 inches] size. The internal capacitor and transformer are multilayered and cofired resulting in high reliability parts.


    OCR Scan     		PDF AR455 F10R7 MIA3225 MIF3225 10.7MHz, shielded IF transformer