high power fet amplifier schematic
Abstract: GaAs MESFET amplifier fet amplifier schematic x-band mmic core chip MMIC X-band amplifier x-band microwave fet HPA Ku x-band core chip "high power microwave" fet small signal
Text: Application of Loadline Simulation to Microwave High Power Amplifiers Edward L. Griffin Abstract Loadline theory is described as applied to high power microwave amplifiers. An example design with simulation is presented. Introduction The design of microwave GaAs high power amplifiers HPAs to demanding
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30FETs
20FETs
12-Watt
high power fet amplifier schematic
GaAs MESFET amplifier
fet amplifier schematic
x-band mmic core chip
MMIC X-band amplifier
x-band microwave fet
HPA Ku
x-band core chip
"high power microwave"
fet small signal
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CLX34
Abstract: CLX34-00 CLX34-05 CLX34-10
Text: CLX34 HiRel X-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 10 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLX34
CLX34-00
MWP-25
CLX34-05
CLX34-10
CLX34-nn:
QS9000
CLX34
CLX34-00
CLX34-05
CLX34-10
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CLY35
Abstract: CLY35-00 CLY35-05 CLY35-10
Text: CLY35 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 4.5 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLY35
CLY35-00
MWP-35
CLY35-05
CLY35-10
CLY35-nn:
QS9000
CLY35
CLY35-00
CLY35-05
CLY35-10
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CLY38
Abstract: CLY38-00 CLY38-05 CLY38-10
Text: CLY38 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 4.2 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLY38
CLY38-00
MWP-35
CLY38-05
CLY38-10
CLY38-nn:
QS9000
CLY38
CLY38-00
CLY38-05
CLY38-10
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CLY32
Abstract: CLY32-00 CLY32-05 CLY32-10
Text: CLY32 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 6 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLY32
CLY32-00
MWP-25
CLY32-05
CLY32-10
CLY32-nn:
QS9000
CLY32
CLY32-00
CLY32-05
CLY32-10
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CLX32
Abstract: CLX32-00 CLX32-05 CLX32-10
Text: CLX32 HiRel X-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 12.5 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLX32
CLX32-00
MWP-25
CLX32-05
CLX32-10
CLX32-nn:
QS9000
CLX32
CLX32-00
CLX32-05
CLX32-10
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CLX27
Abstract: CLX27-00 CLX27-05 CLX27-10
Text: CLX27 HiRel X-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 15 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLX27
CLX27-00
MWP-25
CLX27-05
CLX27-10
CLX27-nn:
QS9000
CLX27
CLX27-00
CLX27-05
CLX27-10
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CLY29
Abstract: CLY29-00 CLY29-05 CLY29-10
Text: CLY29 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 8 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLY29
CLY29-00
MWP-25
CLY29-05
CLY29-10
CLY29-nn:
QS9000
CLY29
CLY29-00
CLY29-05
CLY29-10
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CLY29
Abstract: CLY29-00 CLY29-05 CLY29-10 GMW05880 IDp12
Text: CLY29. HiRel C-Band GaAs Power- MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 8 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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CLY29.
CLY29-00
MWP-25
CLY29-05
CLY29-10
CLY29
CLY29-00
CLY29-05
CLY29-10
GMW05880
IDp12
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CLX27
Abstract: CLX27-00 CLX27-05 CLX27-10 GMW05880 049 01169
Text: CLX27. HiRel X- Band GaAs Power- MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 15 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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PDF
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CLX27.
CLX27-00
MWP-25
CLX27-05
CLX27-10
CLX27
CLX27-00
CLX27-05
CLX27-10
GMW05880
049 01169
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CLX30
Abstract: CLX30-00 CLX30-05 CLX30-10
Text: CLX30 HiRel X-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 12.5 GHz • Hermetically sealed microwave power package • Low thermal resistance for high voltage application
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PDF
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CLX30
CLX30-00
MWP-25
CLX30-05
CLX30-10
CLX30-nn:
QS9000
CLX30
CLX30-00
CLX30-05
CLX30-10
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CLY38
Abstract: CLY38-00 CLY38-05 CLY38-10
Text: CLY38 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 4.2 GHz • Hermetically sealed microwave power package • • Low thermal resistance for high voltage application
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Original
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PDF
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CLY38
CLY38-00
MWP-35
CLY38-05
CLY38-10
CLY38-nn:
QS9000
CLY38
CLY38-00
CLY38-05
CLY38-10
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CLY29
Abstract: CLY29-00 CLY29-05 CLY29-10
Text: CLY29 HiRel C-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 100 MHz to 8 GHz • Hermetically sealed microwave power package • • Low thermal resistance for high voltage application
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Original
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PDF
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CLY29
CLY29-00
MWP-25
CLY29-05
CLY29-10
CLY29-nn:
QS9000
CLY29
CLY29-00
CLY29-05
CLY29-10
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CLX30
Abstract: CLX30-00 CLX30-05 CLX30-10 siemens 230 98 O
Text: CLX30 HiRel X-Band GaAs Power-MESFET • HiRel Discrete and Microwave Semiconductor • For professional power amplifiers • For frequencies from 500 MHz to 12.5 GHz • Hermetically sealed microwave power package • • Low thermal resistance for high voltage application
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Original
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PDF
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CLX30
CLX30-00
MWP-25
CLX30-05
CLX30-10
CLX30-nn:
QS9000
CLX30
CLX30-00
CLX30-05
CLX30-10
siemens 230 98 O
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TPM2626-60
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TPM2626-60 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES n High Power P1dB=48.0dBm TYP. at 2.6GHz n n Partially Matched Type n Hermetically Sealed Package High Power Gain G1dB=10dB(TYP.) at 2.6GHz RF PERFORMANCE SPECIFICATIONS (Ta=25 o C)
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TPM2626-60
TPM2626-60
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S9G66A
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET N on-M atched MICROWAVE SEMICONDUCTOR S9G66A Preliminary TECHNICAL DATA SPECIFICATIONS CHARACTERISTICS Output Power at ldB Compression Point Power Gain at ldB Compression Point Drain Current Power Added Efficiency SYMBOL PldB
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S9G66A
S9G66A
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371 fet
Abstract: TIM1414-4LA-371
Text: TOSHIBA MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TECHNICAL DATA TIM1414-4LA-371 RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at ldB Compression Point Linear Gain SYMBOL PldB Drain Current Power Added Efficiency 3rd Order Intermodulation
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TIM1414-4LA-371
371 fet
TIM1414-4LA-371
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TIM1414-4LA-371
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TECHNICAL DATA TIM1414-4LA-371 RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at ldB Compression Point Linear Gain SYMBOL PldB Drain Current Power Added Efficiency 3rd Order Intermodulation
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TIM1414-4LA-371
TIM1414-4LA-371
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TOSHIBA TIM1414-8-252 MICROWAVE SEMICONDUCTOR TECHNICAL DATA CHARACTERISTICS Output Power at ldB Gain Compression Point Power Gain at ldB Gain Compression Point Drain Current Power Added Efficiency SYMBOL PldB G ldB CONDITION VDD=9V
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120mA
2-11C1B)
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE SEMICONDUCTOR TECHNICAL DATA MICROWAVE POWER GaAs FET Non-Matched S9666A Preliminary 1. RF PERFORMANCE SPECIFICATIONS Ta= 25° C Ì CHARACTERISTICS Output Power at IdB Compression Point Power Gain at IdB Compression Point Drain Current
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S9666A
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JS9P05-AS
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TOSHIBA MICROWAVE SEMICONDUCTORS TECHNICAL DATA JS9P05-AS FEATURES: •HIG H POWER P1dB=28dBm ■C H IP FORM IHIGH GAIN GldB= 6. 5dB f = 38GHz RF PERFORMANCE SPECIF CATIONS CHARACTERISTICS Output Power at 1dB Compression Point Power Gain at 1dB
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JS9P05-AS
28dBm
38GHz
JS9P05-AS
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JS9P04-AS
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TOSHIBA MICROWAVE SEMICONDUCTORS TECHNICAL DATA JS9P04-AS FEATURES: •HIGH POWER P1dB=26. OdBm @ f = 38GHz ■CHIP FORM BHIGH GAIN GldB= 6. 5dB @ f =38GHz RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at 1dB Compression Point
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JS9P04-AS
38GHz
38GHz
JS9P04-AS
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TOSHIBA MICROWAVE SEMICONDUCTORS TECHNICAL DATA JS9P05-AS FEATURES: •H IG H POWER P1dB=28dBm ■C H IP FORM IHIGH GAIN GldB= f = 38GHz RF PERFORMANCE SPECIF CATIONS CHARACTERISTICS Output Power at 1dB Compression Point Power Gain at 1dB
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28dBm
JS9P05-AS
38GHz
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S9G67A
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET Non-Matched MICROWAVE SEMICONDUCTOR TECHNICAL DATA S9G67A Preliminary 1. RF PERFORMANCE SPECIFICATIONS Ta= 25°C Ì CHARACTERISTICS O utput Power at ldB Compression Point Power Gain at ldB Compression Point D rain C urrent
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S9G67A
S9G67A
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