saw 36,125 mhz 16 mhz
Abstract: D469 MT5100 microtune
Text: M I C R O T U RF SILICON AND SUBSYTEMS SOLUTIONS FOR BROADBAND COMMUNICATIONS AND AUTOMOTIVE ELECTRONICS N E VIDEOCASTER MT5100 SINGLE-CHANNEL UPCONVERTER MICROMODULE PRODUCT BRIEF channel upconverter designed to reduce space, power and costs for Satellite Master Antenna Television
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MT5100
MT5100
PB-00061
saw 36,125 mhz 16 mhz
D469
microtune
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200B
Abstract: 24LC01B 24LC02B DK-2750 RG41
Text: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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24LC01B/02B
200B
24LC01B
24LC02B
DK-2750
RG41
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ATA5577M2
Abstract: ATA5577M1 11785 rfid ATA5577M ATA5567 ATA5577 ATA2270-EK1 ATAK2270 T5557 11785 fdx-b
Text: RF IDENTIFICATION RFID Multifunctional 363-Bit Read/Write RFID IDIC ATA5577 Atmel offers a broad range of RFID devices for contactless read/write RF identification systems, delivered as die on wafer, die in tray, die on tape, micromodule, or complete transponder in a plastic package. Our
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363-Bit
ATA5577
e5550/51
T5557
ATA5567
4612B-RFID-03/08/00M
ATA5577M2
ATA5577M1
11785 rfid
ATA5577M
ATA5567
ATA5577
ATA2270-EK1
ATAK2270
11785 fdx-b
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ST23ZL48
Abstract: TV TRANSMITTER PROJECT stmicroelectronics eeprom ST23
Text: ST23ZL48 Smartcard MCU with enhanced security, crypto-processor and 48 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■
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ST23ZL48
8/16-bit
30-year
ST23ZL48
TV TRANSMITTER PROJECT
stmicroelectronics eeprom
ST23
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mcu st23
Abstract: ST23ZL34 TV TRANSMITTER PROJECT ST23
Text: ST23ZL34 Smartcard MCU with enhanced security, crypto-processor and 34 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■
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ST23ZL34
8/16-bit
30-year
AIS-31
mcu st23
ST23ZL34
TV TRANSMITTER PROJECT
ST23
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24LC08B
Abstract: 200B 24LC16B
Text: M 24LC08B/16B MODULES 8K/16K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V
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24LC08B/16B
8K/16K
400kHz
DS21224A-page
24LC08B
200B
24LC16B
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Untitled
Abstract: No abstract text available
Text: MicroModule USB Integration Guide Interlink Electronics FSR Force Sensing Resistors® USB MicroModule Integration Guide Document P/N: 94-00025 Rev. B Interlink Electronics and the six dot logo are registered trademarks of Interlink Electronics, Inc. www.interlinkelectronics.com
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10F/1004
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SMARTCARD micromodule assembly
Abstract: No abstract text available
Text: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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SMARTCARD micromodule assembly
Abstract: emv 7816 smartcard
Text: D3, D4 MICROMODULES Smartcard MCU Modules General Information on D3 and D4 Packaging DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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SMARTCARD micromodule assembly
Abstract: sgs thomson ST14C04C
Text: MICROMODULES SMART CARD IC’s EMBEDDING PROCESS BRIEF DATA INTRODUCTION The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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ST33F1M
Abstract: ST33F1M NESCRYPT ST33F1M package ST33F768 MIFARE DESFire software Desfire ev1 implementation NFC Protocol ARM SecurCore SC300 iso 7816-2 ST33F896
Text: ST33F1M, ST33F1M0, ST33F896, ST33F768, ST33F640, ST33F512 Secure MCU with 32-bit ARM SC300 CPU, SWP interface, NESCRYPT cryptoprocessor and high-density Flash memory Data brief Micromodule Wafer 259a.ai DFN8 package WLCSP package CSP Software features • Secure Flash Loader
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ST33F1M,
ST33F1M0,
ST33F896,
ST33F768,
ST33F640,
ST33F512
32-bit
SC300
ST33F1M
DocID18396
ST33F1M NESCRYPT
ST33F1M package
ST33F768
MIFARE DESFire software
Desfire ev1 implementation
NFC Protocol
ARM SecurCore SC300
iso 7816-2
ST33F896
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mm 105k capacitor
Abstract: 12V, 350mA LED driver SCHEMATIC led driver 200mA 4.5V TO 100V INPUT REGULATOR
Text: TPS92550 450mA 14W Constant Current Buck LED Driver MicroModule General Description Package Highlights The TPS92550 Constant Current Buck LED Driver MicroModule drives maximum 450mA LED current up to 10 LEDs in a single string maximum 14W . It integrates all the power
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TPS92550
450mA
350mA
300mA
mm 105k capacitor
12V, 350mA LED driver SCHEMATIC
led driver 200mA
4.5V TO 100V INPUT REGULATOR
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4614b
Abstract: transponder car key immobilizer transponder ic ISO 11784/85 Animal ID atmel t5557 RFID RF Identification Devices RF Identification Devices RFID immobilizer for alarm RF ICs RFID immobilizer car
Text: 125-kH Z RF I D E N T I F I C AT I O N Read/ Write Transponder Device Family Identification IC For 125-kHz contactless readwrite RF identification systems, Atmel offers a broad range of RFID devices, delivered as dieon-wafer, die-in-tray, die-ontape, micromodule or complete
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125-kH
125-kHz
4614B-RFID-10/03/10M
Rf/16,
Rf/32,
T5552-PAE
224-bit
TK5552
96-bit
TMEB8704
4614b
transponder car key
immobilizer transponder
ic ISO 11784/85 Animal ID
atmel t5557
RFID RF Identification Devices
RF Identification Devices RFID
immobilizer for alarm
RF ICs RFID
immobilizer car
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GRM32ER72A225KA35L
Abstract: 105k capacitor 4.5V TO 100V INPUT REGULATOR
Text: TPS92551 450mA 23W Constant Current Buck LED Driver Micro-Module General Description ● -40˚C to +125˚C junction temperature range The TPS92551 Constant Current Buck LED Driver MicroModule drives maximum 450mA LED current up to 16 LEDs in a single string maximum 23W . It integrates all the power
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TPS92551
450mA
TPS92551
350mA
300mA
800kHz)
complGRM32ER72A225KA35L
GRM32ER72A225KA35L
105k capacitor
4.5V TO 100V INPUT REGULATOR
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st23yr80
Abstract: iso 3309 ST23YR mcu st23 AIS-31 ST23 DSASW0037395
Text: ST23YR80 Dual contactless smartcard MCU with 80 Kbyte EEPROM, enhanced security, cryptoprocessor and optimized RF performance Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory 259a.ai Micromodule
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ST23YR80
8/16-bit
30-year
st23yr80
iso 3309
ST23YR
mcu st23
AIS-31
ST23
DSASW0037395
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atmel 1215
Abstract: Atmel 540 e5551 e5551 atmel t5551 T5551-PAE 2594 micromodule T555101-PAE E5551 preliminary
Text: T5551 Micromodule Description The micromodule T5551 is the standard package for Atmel Wireless & Microcontrollers’ contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 µm thin, thus opening the way
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T5551
T5551
e5551
D-74025
30-Mar-01
atmel 1215
Atmel 540
e5551 atmel
T5551-PAE
2594
micromodule
T555101-PAE
E5551 preliminary
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24LC02B Modules
Abstract: 24lc01b 200B 24LC02B 24LC01B Modules I2C EEPROM 1kbit
Text: M 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules FEATURES • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 10 µA standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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DS21222A-page
24LC02B Modules
24lc01b
200B
24LC02B
24LC01B Modules
I2C EEPROM 1kbit
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24LC32A
Abstract: 200B
Text: M 24LC32A MODULE 32K I2C Serial EEPROM in ISO Micromodule FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation down to 2.5V - Maximum write current 3 mA at 6.0V - Maximum read current 150 µA at 6.0V - Standby current 1 µA max at 2.5V
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24LC32A
DS21225A-page
200B
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ISO 14443-1
Abstract: SMARTCARD micromodule assembly MICROMODULES SMARTCARD micromodule ST16R820 ST16RF52 ST16RF58 ST19RF08
Text: D5, D7 MICROMODULES Smartcard MCU Dual Modules General Information on D5 and D7 Packages DATA BRIEFING The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product: – a plastic card into which a cavity is made for micromodule embedding.
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24LC02B Modules
Abstract: No abstract text available
Text: 24LC01B/02B MODULES 1K/2K I2C Serial EEPROMs in ISO Micromodules CROCHIP FEATURES ISO MODULE LAYOUT • ISO 7816 Compliant pad locations • Low power CMOS technology - 1 mA active current typical - 1 0 ^ standby current typical at 5.5V • Organized as a single block of 128 bytes 128 x 8
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24LC01B/02B
DS21222A-page
24LC02B Modules
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73M9001
Abstract: 73M9001/UCJ
Text: SSI 73M9001 M M S lIS Ím * V.32bis DAA Micromodule A TDK Group/Company Preliminary Data D ecem ber DESCRIPTION FEATURES The SSI 73M9001 DAA Data Access Arrangement Micromodule provides all the necessary line monitor ing, filtering, isolation, protection, and signal conver
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73M9001
32bis
73M9001
73M9001/UCJ
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Untitled
Abstract: No abstract text available
Text: 24LC32A MODULE M ic ro c h ip 32KI2C Serial EEPROM in ISO Micromodule FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation down to 2.5V - Maximum write current 3 mA at 6.0V - Maximum read current 150 iA at 6.0V
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24LC32A
32KI2CTM
DS21225A-page
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Untitled
Abstract: No abstract text available
Text: 24LC08B/16B MODULES M ic r o c h ip 8K/16K I 2C Serial EEPROMs in ISO Micromodules FEATURES ISO MODULE LAYOUT • ISO 7816 compliant contact locations • Single supply with operation from 2.5-5.5V • Low power CMOS technology - 1 mA active current typical
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24LC08B/16B
8K/16K
400kHz
DS21224A-page
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8 PIN SMD IC L02
Abstract: GLOBESPAN SEMICONDUCTOR L02 SMD FUSE SMD tm
Text: bel defining a degree of excellence CO DCN HV001T S M D P a c k a g e M e c h a n ic a l In fo rm a tio n — I [— 0.080 _L JT 1 0803 - 1439-00 9752 CO RADSL-LP DCN TM MicroModule -1 .1 3 0 - PCB FOOTPRINT TOP VIEW T LI 0.350 D im ensions are in inches
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HV001T
GT31XX
8 PIN SMD IC L02
GLOBESPAN SEMICONDUCTOR
L02 SMD
FUSE SMD tm
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