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    13B1

    Abstract: LH5116D-10F
    Text: PRODUCT SPECIFICATION Integrated Circuits Group LH5116D-10F 16K SRAM Model Number: LH5116D2 Spec. Issue Date: Oct. 5, 2004 Spec No: EL16X049 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited


    Original     		PDF LH5116D-10F LH5116D2) EL16X049 13B1 LH5116D-10F

    LH28F640BFHE-PBTLDY

    Abstract: lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10
    Text: Product Change Notice PCN : Lead (Pb)–free Packages October 15, 2004 This document updates PCN: ST-03-Z-06E issued January 23, 2004. Objective: Existing Memory ICs are changing from a lead (Pb) process to a lead-free process. Process Change Key Points 1) SHARP is changing the lead plating process from lead (Pb) to lead-free to meet the demands


    Original     		PDF ST-03-Z-06E connectiH5116D-10F LH5116H-10F LH5116NA-10F LH5164A-10LF LH5164AD-10LF LH5164AHN-10LF LH516AN0 LH28F640BFHE-PBTLDY lh28f320s5hns-zp LH28F160S5T-L70A LH28F016 LH28F008SAT-ZW lh5116na-10 LH28F640BFHE-PBTL90 LH5164A-10L LH5164AN-80L lh5116-10

    LH6116

    Abstract: No abstract text available
    Text: SHARP | SPEC No. ISSUE: E L I 6 X 0 4 9 Oct. 5. 2004 T o ; S P E C I F I C A T I O N S 16k Product Type S RAM L H 5 1 1 6 D — 1 0 F Model No. L H 5 1 1 6 D 2 *This specifications contains 1 7 pages including the cover and appendix. If you have any objections, please contact us before issuing purchasing order.


    OCR Scan     		PDF ma5348535353480000 LH5116D2 LH6116