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    LFPAK FOOTPRINT Search Results

    LFPAK FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    RJK03C1DPB-00#J5 Renesas Electronics Corporation Nch Single Power Mosfet 30V 60A 2.2Mohm Lfpak, LFPAK, /Embossed Tape Visit Renesas Electronics Corporation
    HAT2143H-EL-E Renesas Electronics Corporation Nch Single Power Mosfet 30V 40A 6.1Mohm Lfpak, LFPAK, /Embossed Tape Visit Renesas Electronics Corporation
    HAT2261H-EL-E Renesas Electronics Corporation Nch Single Power Mosfet 30V 45A 3.8Mohm Lfpak, LFPAK, /Embossed Tape Visit Renesas Electronics Corporation
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5ADNE#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    LFPAK FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: UM10178 25 Amp LFPAK demonstration board Rev. 2.0 — 16 February 2011 User manual Document information Info Content Keywords LFPAK, Point of Load, demonstration board Abstract The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP NextPower LFPAK


    Original     		PDF UM10178

    Philips 1812 footprints

    Abstract: UM10178 DXM1306-R40 LTST-C190UBKT PH2625L PH6325L TPS40071 TPS40071PWP
    Text: UM10178 25 A LFPAK demonstration board Rev. 01 — 2 March 2006 User manual Document information Info Content Keywords LFPAK, FET, demo board Abstract The 25 A LFPAK demo board is a single-phase buck converter design to demonstrate the performance of Philips LFPAK MOSFETs in a small form


    Original     		PDF UM10178 UM10178 Philips 1812 footprints DXM1306-R40 LTST-C190UBKT PH2625L PH6325L TPS40071 TPS40071PWP

    PH2525L

    Abstract: PH2625L PH5525L PH6325L TPS40071 LFPAK footprint NXP resistor
    Text: NXP LFPAK MOSFETs PH2525L and PH5525L application 25-A POL converter with over 90% efficiency using LFPAK MOSFETs This small, low-cost design, which combines NXP MOSFETs in LFPAK packages with a PWM controller from Texas Instruments, uses industry-standard construction and operating conditions


    Original     		PDF PH2525L PH5525L PH2525L TPS40071 PH2625L PH5525L PH6325L TPS40071 LFPAK footprint NXP resistor

    LFPAK footprint

    Abstract: PH3830L PH2520U PH2925U PH3120L PH3230S PH4530L PH4840S PH5330E PH7030L
    Text: Extending our LFPAK portfolio MOSFETs in Loss Free PAcKaging - smaller, faster, more efficient Delivering superior thermal properties from a compact footprint, Philips’ extended range of power MOSFETs in LFPAK improves the power and space efficiency of designs across


    Original     		PDF OT669 LFPAK footprint PH3830L PH2520U PH2925U PH3120L PH3230S PH4530L PH4840S PH5330E PH7030L

    LFPAK footprint

    Abstract: PH2920 sot669 lfpak
    Text: PH2920 N-channel enhancement mode field-effect transistor M3D748 Rev. 01 — 13 June 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a SOT669 LFPAK package. Product availability: PH2920 in SOT669 (LFPAK).


    Original     		PDF PH2920 M3D748 OT669 PH2920 LFPAK footprint sot669 lfpak

    LQFP64. footprint

    Abstract: forklift motor speed control P98LPC935 LQFP64 so8 footprint LQFP64 package PH533 LPC900 PH4530L PH5330E
    Text: LFPAK power MOSFETs and LPC microcontrollers Combined power and and control that Combined power control benefits motor control applications With LFPAK you have a high efficiency and high reliability power package in an SO8 footprint that delivers thermal and electrical performance comparable with a DPAK. Combined with our LPC


    Original     		PDF 8/10bit LQFP64 LQFP64. footprint forklift motor speed control P98LPC935 LQFP64 so8 footprint LQFP64 package PH533 LPC900 PH4530L PH5330E

    PH8230

    Abstract: MO-235 FOOTPRINT LFPAK package
    Text: PH8230 N-channel enhancement mode field-effect transistor M3D748 Rev. 01 — 23 June 2003 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a SOT669 LFPAK package. Product availability: PH8230 in SOT669 (LFPAK).


    Original     		PDF PH8230 M3D748 OT669 PH8230 MO-235 FOOTPRINT LFPAK package

    BUK9Y08-30B

    Abstract: sot669 package 27 55b BUK9Y19-55B LFPAK footprint SOT669 BUK9Y11-30B BUK9Y30-75B BUK9Y40-55B BUK7Y09-40B
    Text: HPA TrenchMOS in LFPAK MOSFETs that pack-a-punch in automotive power Delivering the ultimate in performance, Philips’ new range of High Performance Automotive HPA MOSFETs in the compact, thermally enhanced LFPAK provides reduced on-resistance along with improved ruggedness and thermal


    Original     		PDF

    injector MOSFET driver

    Abstract: fuel injector mosfet injector MOSFET injector diesel diesel solenoid solenoid injector mosfet 803 injector driver DRIVER MOSFET fuel injector test
    Text: New NXP Automotive LFPAK MOSFETs High Reliability LFPAK MOSFETs for Automotive Power Applications As automotive applications become more complex, additional real-estate is required within the same module size. In applications such as engine controllers, the additional functionality requires


    Original     		PDF AEC-Q101 injector MOSFET driver fuel injector mosfet injector MOSFET injector diesel diesel solenoid solenoid injector mosfet 803 injector driver DRIVER MOSFET fuel injector test

    sot669 footprint

    Abstract: PSMN1R1-25YLC PSMN3R7-25YLC 25YLC
    Text: NextPower MOSFETs Smaller, Faster, Cooler NextPower 25 V & 30 V MOSFETs in LFPAK Power-SO8 NXP introduces a range of high performance N-channel, logic-level MOSFETs in LFPAK As a power design engineer, compromise is never far from your mind. Do I choose a low RDS(on) device and accept the


    Original     		PDF

    sot669 package

    Abstract: LFPAK footprint 7.5B 35 BUK7Y80-150B BUK9Y19-55B SOT669 BUK7Y13-40B BUK9Y11-30B BUK9Y14-40B NXP MOSFETs
    Text: HPA TrenchMOS in LFPAK MOSFETs that pack-a-punch in automotive power Delivering the ultimate in performance, NXP’s new range of High Performance Automotive HPA MOSFETs in the compact, thermally enhanced LFPAK provides reduced on-resistance along with improved ruggedness and thermal performance. All this in a very small package


    Original     		PDF

    so8 footprint

    Abstract: sot669 package SO8 package PSMN026-80YS sot669 PSMN012-100YS PSMN1R2-25YL PSMN1R3-30YL PSMN1R5-25YL PSMN1R7-30YL
    Text: New Trench 6 MOSFETs in a Power-SO8 package 25 V to 100 V MOSFETs in Power-SO8 We’ve extended our range of Trench 6 MOSFETs with new devices at 60 V and 100 V in the LFPAK SOT669 package. NXP leads the way with its range of Trench 6 MOSFETs in LFPAK (Loss Free PAcKage). By combining Trench 6 silicon


    Original     		PDF OT669) PSMN5R5-60YS) so8 footprint sot669 package SO8 package PSMN026-80YS sot669 PSMN012-100YS PSMN1R2-25YL PSMN1R3-30YL PSMN1R5-25YL PSMN1R7-30YL

    diagram and of s08 ic package

    Abstract: lfpak graphic card circuit diagram sot669 footprint LFPAK package 5 LFPAK footprint SOT669 PH5330E ph53 PH7030L
    Text: MOSFETs in LFPAK Compact, high performance power for notebook PC and graphic cards Part of an ever expanding portfolio that combines innovative packaging and TrenchMOS technologies, Philips’ latest MOSFETs offer excellent power performance in the compact,


    Original     		PDF OT669 diagram and of s08 ic package lfpak graphic card circuit diagram sot669 footprint LFPAK package 5 LFPAK footprint SOT669 PH5330E ph53 PH7030L

    Low Capacitance MOS FET

    Abstract: Pch MOS FET HAT2068R HAT2096H Low Input Capacitance MOS FET Hitachi DSA0015 f200k
    Text: New Products Hitachi Develops LFPAK Thin Power MOS FET Package Employing Bonding-Wire-Less Construction and Enabling 20% Reduction in On-Resistance < Typical Applications > • CPU power supplies in notebook PCs, etc. • Power supplies for communication devices


    Original     		PDF HAT2096H, HAT2096H HAT2096H Low Capacitance MOS FET Pch MOS FET HAT2068R Low Input Capacitance MOS FET Hitachi DSA0015 f200k

    PH2520U

    Abstract: 11406
    Text: PH2520U TrenchMOS ultra low level FET Rev. 01 — 02 May 2003 M3D748 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology. Product availability: PH2520U in SOT669 LFPAK .


    Original     		PDF PH2520U M3D748 PH2520U OT669 11406

    Untitled

    Abstract: No abstract text available
    Text: PH8230E TrenchMOS enhanced logic level FET Rev. 01 — 04 March 2003 M3D748 Preliminary data 1. Product profile 1.1 Description The latest generation N-channel enhancement mode field-effect power transistor in a SOT669 LFPAK package using TrenchMOS™ technology.


    Original     		PDF PH8230E M3D748 OT669 PH8230E

    motor driver full bridge mosfet 10A 100V

    Abstract: Arm7 lpc2103 circuit diagram Brushed TO Brushless Converter circuit diagram 12V DC brushed MOTOR CONTROL MICROCONTROLLER 12v 10A dc motor mosfet driver ARM7 development kit ARM7 MICROCONTROLLER dc brushed motor 60v 12v brushless motor driver PWM motor control arm7
    Text: NXP Mini ARM7/LFPAK motion-control development kit Quick, cost-effective development of brushed/brushless DC motor controllers Use this plug-and-play kit to develop high-performance motor controllers for brushed or brushless DC motors. The modular design supports power boards with various power ratings.


    Original     		PDF 8-/10-bit RS-232, PH20100S motor driver full bridge mosfet 10A 100V Arm7 lpc2103 circuit diagram Brushed TO Brushless Converter circuit diagram 12V DC brushed MOTOR CONTROL MICROCONTROLLER 12v 10A dc motor mosfet driver ARM7 development kit ARM7 MICROCONTROLLER dc brushed motor 60v 12v brushless motor driver PWM motor control arm7

    PH9025L

    Abstract: sot669 footprint PH2530L PH2030AL LFPAK footprint PCI compact PCB footprint lfpak sot669 package ph43 PH6530
    Text: LFPAK MOSFETs for computing applications Compact, high performance power for notebook and desktop PC, graphics cards and servers Part of an ever expanding portfolio that combines innovative packaging and TrenchMOS technologies NXP’s latest MOSFETs offer excellent power performance in the compact,


    Original     		PDF bra167 PH9025L sot669 footprint PH2530L PH2030AL LFPAK footprint PCI compact PCB footprint lfpak sot669 package ph43 PH6530

    circuit diagram of mosfet based speed control

    Abstract: 12v 10A dc driver motor control mosfet LPC935 motor driver full bridge 10A 100V ZENER 232 P89LPC935 PH20100S 250 dc motor controller PRTR5V0U2X PMBF170
    Text: NXP LPC935/LFPAK motion-control development kit Quick, cost-effective development of brushed DC motor controllers Use this plug-and-play kit to develop high-performance motor controllers for brushed DC motors. The modular design supports power boards with various power ratings.


    Original     		PDF LPC935/LFPAK S-232 LPC935/LFPAK PH20100S circuit diagram of mosfet based speed control 12v 10A dc driver motor control mosfet LPC935 motor driver full bridge 10A 100V ZENER 232 P89LPC935 PH20100S 250 dc motor controller PRTR5V0U2X PMBF170

    SOT669

    Abstract: PH2925U MO-235 MO-235 FOOTPRINT
    Text: PH2925U TrenchMOS ultra low level FET Rev. 01 — 02 May 2003 M3D748 Product data 1. Product profile 1.1 Description N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS™ technology. Product availability: PH2925U in SOT669 LFPAK .


    Original     		PDF PH2925U M3D748 PH2925U OT669 SOT669 MO-235 MO-235 FOOTPRINT

    HAT2166N

    Abstract: LFPAK footprint Renesas HAT2165H HAT2165N HAT2166H HAT2168H HAT2168N HAT216*N
    Text: Renesas Technology Releases LFPAK -i Top-Surface-Radiation Type Package for Power MOSFETs as New Package Offering 40% Reduction in Mounted Thermal Resistance  Offering higher thermal radiation characteristics and larger current enabling reduction in size of server DC-DC power supplies, plus compatibility with SOP -8 


    Original     		PDF HAT2165N HAT2166N HAT2168N HAT2166N LFPAK footprint Renesas HAT2165H HAT2165N HAT2166H HAT2168H HAT2168N HAT216*N

    Untitled

    Abstract: No abstract text available
    Text: NXP transistors in LFPAK56 – the true power package for smart efficiency Full power in half the footprint First bipolar transistors in LFPAK/Power-SO8 These high-power bipolar transistors, housed in LFPAK56 Power-SO8 packages, deliver DPAK-like thermal and electrical performance in just half the footprint. Offering reliable,


    Original     		PDF LFPAK56 AEC-Q101 OT223, com/group/12466

    to220 pcb footprint

    Abstract: "thermal via" PCB D2PAK LFPAK footprint Renesas LFPAK footprint POWERPAK SO8 TO220 HEATSINK DATASHEET thermal PCB D2PAK sot669 lfpak LFPAK package
    Text: LFPAK The Toughest Power-SO8 The evolution of Power MOSFET packages Typical TO220 construction TO220 is the ‘original’ through-hole power package. It is suitable for through-hole mounting and low-cost wave soldering. It also provides very low thermal resistances when mounted to a suitable heatsink.


    Original     		PDF soldering/sot669 to220 pcb footprint "thermal via" PCB D2PAK LFPAK footprint Renesas LFPAK footprint POWERPAK SO8 TO220 HEATSINK DATASHEET thermal PCB D2PAK sot669 lfpak LFPAK package

    LFPAK footprint

    Abstract: PowerPAK 1212-8 stencil LFPAK footprint Renesas PSMN8R2-80YS POWERPAK SO8 LFPAK56 DFN 3.3X3.3 PSMN7R0-30MLC PSMN012-60YS SOT223 nxp
    Text: Ultra-reliable LFPAK56 and LFPAK33 Tougher just got smaller NXP’s LFPAK – Designed for reliability Designing a complex automotive system, a high efficiency industrial power supply or a slimline portable PC ? NXP has a range of smaller, faster, cooler MOSFETs to help you deliver maximum reliability.


    Original     		PDF LFPAK56 LFPAK33 LFPAK56, LFPAK footprint PowerPAK 1212-8 stencil LFPAK footprint Renesas PSMN8R2-80YS POWERPAK SO8 DFN 3.3X3.3 PSMN7R0-30MLC PSMN012-60YS SOT223 nxp