22V10A
Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
sizCMOS25
LVCMOS18
ispGAL22V10A
1800adapter
1-800-LATTICE
LVCMOS33
QFN PACKAGE thermal resistance
LVCMOS25
QFN footprint
amkor mlf qfn
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22V10
Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is
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ispGAL22V10A
AN8074
22V10A
22V10
1800adapter
1-800-LATTICE
22V10
LVCMOS25
LVCMOS33
ABEL
plastron
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LC4064V
Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch
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32-Pin
100-Ball
132-Ball
56-Ball
269-Ball
208-Ball
256-Ball
100-Pin
128-Pin
44-Pin
LC4064V
Lattice ispmach LC4064V
ispMACH 4A5
flip chip bga 0,8 mm
OR3T80
LC4064
OR3C80
OR3T20
OR3T30
OR3T55
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Untitled
Abstract: No abstract text available
Text: PA1048-T128-01A Data Sheet 128 pin TQFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in TQFP packages can be programmed on 28 pin DIP programmers. This socket will only work for the TQFP package.
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PA1048-T128-01A
socket/28
pLSI1048C
ispLSI1048C
pLSI2096
ispLSI2096
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Lattice PLSI
Abstract: lattice semiconductor tape and reel
Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for
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EIA-RS481.
Lattice PLSI
lattice semiconductor tape and reel
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16-mm
Abstract: 16MM TAPE PACKAGE
Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for
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EIA-RS481.
44-pin
84-pin
48-pin
100-pin
128-pin
176-pin
160-pin
16-mm
16MM TAPE PACKAGE
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LED43
Abstract: No abstract text available
Text: LED43 v 2.0 24.11.2014 Description LED43 series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 4.15 µm and optical power of typ. 0.01 mW qCW. It comes in TO-18 package a with a glass window.
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LED43
LED43
150mA
200mA
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LATTICE SEMICONDUCTOR Tape and Reel Specification
Abstract: No abstract text available
Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel
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EIA-RS481.
moun481.
44-pin
68-pin
84-pin
28-pin
20-pin
LATTICE SEMICONDUCTOR Tape and Reel Specification
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LED21
Abstract: No abstract text available
Text: LED21 v 1.0 12.02.2014 Description LED21 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.15 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package a with a glass window.
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LED21
LED21
150mA
200mA
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LED38
Abstract: No abstract text available
Text: LED38 v 2.0 01.12.2014 Description LED19-PR series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 3.75 µm and optical power of typ. 30 µW qCW. It comes in TO-18 package, with cap and without window on request .
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LED38
LED19-PR
LED38
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Untitled
Abstract: No abstract text available
Text: LED23 rev 2.0 29.04.2015 Description LED23 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.35 µm and optical power of typ. 0.8 mW qCW. It comes in TO-18 package, with cap and without window on request .
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LED23
LED23
150mA
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LED19-PR
Abstract: No abstract text available
Text: LED19-PR v 2.0 24.11.2014 Description LED19-PR series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 1.95 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package, with a parabolic reflector and a without window on request .
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LED19-PR
LED19-PR
150mA
200mA
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LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
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64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
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84 pin plcc lattice dimension
Abstract: C045
Text: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE
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C045
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14.5M 1982
Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
Text: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL
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20-Pin
300-Mil)
1020-ball
1152-ball
1704-ball
492-Ball
208-ball
25-ball
332-ball
100-pin
14.5M 1982
AC12
MO-220
MO-275
ANSI Y14.5
FCBGA304
fcbga-304
ansi-y14.5m-1982
LAttice bottom marking
SCM40
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Lattice Semiconductor Package Diagrams 256-Ball fpBGA
Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
Text: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL
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20-Pin
300-Mil)
208-ball
25-ball
332-ball
100-pin
120-pin
128-pin
160-pin
208-pin
Lattice Semiconductor Package Diagrams 256-Ball fpBGA
LAttice top marking
BB 1704
672-BALL
SCM40
AC12
MO-220
MO-275
84 pin plcc lattice dimension
fcbga-304
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TMS 3880
Abstract: vantis jtag schematic e2cmos technology jtag cable lattice Schematic NT 407 F lattice electrically erasable gal 1985 Vantis ISP cable lattice 1996
Text: L A T T I C E S E M I C O N D U C T O R New Dimensions in ISP Programmable Analog Circuits Programmable Analog Circuits WORLD LEADER FOR IN-SYSTEM PROGRAMMABILITY ISP from LATTICE—THE Digital Lattice ispPACTM—Programmable Analog Devices that are custom designed and
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functio268-8000
I0104
TMS 3880
vantis jtag schematic
e2cmos technology
jtag cable lattice Schematic
NT 407 F
lattice electrically erasable gal 1985
Vantis ISP cable
lattice 1996
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JESD22-A108-A
Abstract: JESD22-A104-A JESD22*108 EIA-671 JEDS22-C101-A doc-70 ISO14000 J-STD-035 8110014 Distributors and Sales Partners
Text: Reliability and Quality Assurance February 2002 Introduction Lattice Semiconductor Corporation LSC designs, develops and markets high performance programmable logic devices (PLDs) and related development system software. Lattice Semiconductor is the inventor and world's leading supplier of in-system programmable (ISPtm) CPLDs. PLDs are standard semiconductor components that can
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MIL-STD-883,
MIL-STD-883E,
J-STD-035
JESD22-A108-A
JESD22-A104-A
JESD22*108
EIA-671
JEDS22-C101-A
doc-70
ISO14000
J-STD-035
8110014
Distributors and Sales Partners
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Date Code restriction
Abstract: On semiconductor date Code shelf life JESD22-B102-C J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
Text: Technical Bulletin July 2002 PB# 1146 Date Code Restriction and Product Shelf Life High Performance Programmable Logic Products Introduction Date Code Restrictions and the associated shelf life of products are commonly raised issues for advanced semiconductor products. The common concern is for the fitness of use of product that has been held in
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1-888-ISP-PLDS
Date Code restriction
On semiconductor date Code
shelf life
JESD22-B102-C
J-STD-033
GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
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ISPVM embedded
Abstract: post card schematic with ispgal Supercool TQFP-100 footprint matrix converting circuit VHDL or CPLD code low pass Filter VHDL code microcontroller using vhdl ISPVM ieee 1532 ispPAC80
Text: Lattice Semiconductor Corporation • Fall 2000 • Volume 7, Number 1 In This Issue ispGDX 240VA Completes Popular 3.3V Family The SuperFAST Family Just Got Faster! Entire ispMACH™ 4A Family Now Released to Production ispPAC®80 Operating Frequency Extended to
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240VA
750kHz
I0117
ISPVM embedded
post card schematic with ispgal
Supercool
TQFP-100 footprint
matrix converting circuit VHDL or CPLD code
low pass Filter VHDL code
microcontroller using vhdl
ISPVM
ieee 1532
ispPAC80
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Recommended land pattern smd-0.5
Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout
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TN1074
Recommended land pattern smd-0.5
"x-ray machine"
Lattice Semiconductor Package Diagrams 256-Ball fpBGA
pcb fabrication process
ultra fine pitch BGA
LC4064ZE
package dimension 256-FTBGA
nomenclature pcb hdi
of BGA Staggered Pins package
BN256
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LCMXO2-1200
Abstract: CEL-9750ZHF CEL-9750ZHF10
Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The
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LCMXO2-1200-25WLCSP
LCMXO2-1200
CEL-9750ZHF
CEL-9750ZHF10
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spartan3 fpga development boards
Abstract: M25PXX XCF08S ddr spi flash XCF16S PLCC-48 footprint spi flash m25pxx W25PXX XC3S1000 XC3S1500
Text: LOW-COST FPGA CONFIGURATION VIA INDUSTRY-STANDARD SPI SERIAL FLASH & LatticeECP/EC FPGAs A Lattice Semiconductor White Paper June 2004 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com
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J-STD-033
Abstract: Date Code restriction JESD22-B102 jstd for msl 3
Text: Product Bulletin #PB1146b Date Code Restriction and Product Shelf Life High Performance Programmable Logic Products Introduction Date Code Restrictions and the associated shelf life of products are commonly raised issues for advanced semiconductor products. The common concern is for the fitness of use of product that has been held in
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PB1146b
1-800-LATTICE
J-STD-033
Date Code restriction
JESD22-B102
jstd for msl 3
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