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    LATTICE PACKAGE DIMENSION Search Results

    LATTICE PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    LATTICE PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    22V10A

    Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
    Text: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		PDF ispGAL22V10A AN8074 22V10A 22V10 sizCMOS25 LVCMOS18 ispGAL22V10A 1800adapter 1-800-LATTICE LVCMOS33 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn

    22V10

    Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
    Text: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is


    Original     		PDF ispGAL22V10A AN8074 22V10A 22V10 1800adapter 1-800-LATTICE 22V10 LVCMOS25 LVCMOS33 ABEL plastron

    LC4064V

    Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
    Text: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch


    Original     		PDF 32-Pin 100-Ball 132-Ball 56-Ball 269-Ball 208-Ball 256-Ball 100-Pin 128-Pin 44-Pin LC4064V Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55

    Untitled

    Abstract: No abstract text available
    Text: PA1048-T128-01A Data Sheet 128 pin TQFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in TQFP packages can be programmed on 28 pin DIP programmers. This socket will only work for the TQFP package.


    Original     		PDF PA1048-T128-01A socket/28 pLSI1048C ispLSI1048C pLSI2096 ispLSI2096

    Lattice PLSI

    Abstract: lattice semiconductor tape and reel
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for


    Original     		PDF EIA-RS481. Lattice PLSI lattice semiconductor tape and reel

    16-mm

    Abstract: 16MM TAPE PACKAGE
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel quantities. Once loaded, the tape is wound onto a plastic reel for


    Original     		PDF EIA-RS481. 44-pin 84-pin 48-pin 100-pin 128-pin 176-pin 160-pin 16-mm 16MM TAPE PACKAGE

    LED43

    Abstract: No abstract text available
    Text: LED43 v 2.0 24.11.2014 Description LED43 series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 4.15 µm and optical power of typ. 0.01 mW qCW. It comes in TO-18 package a with a glass window.


    Original     		PDF LED43 LED43 150mA 200mA

    LATTICE SEMICONDUCTOR Tape and Reel Specification

    Abstract: No abstract text available
    Text: Tape and Reel Specifications cover tape seals the carrier tape and holds the devices in the pockets. Once loaded, the tape is wound onto a plastic reel for labeling and packing. A full reel holds a maximum quantity of devices depending on the package size. Lattice Semiconductor requires ordering in full reel


    Original     		PDF EIA-RS481. moun481. 44-pin 68-pin 84-pin 28-pin 20-pin LATTICE SEMICONDUCTOR Tape and Reel Specification

    LED21

    Abstract: No abstract text available
    Text: LED21 v 1.0 12.02.2014 Description LED21 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.15 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package a with a glass window.


    Original     		PDF LED21 LED21 150mA 200mA

    LED38

    Abstract: No abstract text available
    Text: LED38 v 2.0 01.12.2014 Description LED19-PR series are fabricated from narrow band-gap InAsSb/InAsSbP heterostructures lattice matched to InAs substrate. This Mid-IR LED provides a typical peak wavelength of 3.75 µm and optical power of typ. 30 µW qCW. It comes in TO-18 package, with cap and without window on request .


    Original     		PDF LED38 LED19-PR LED38

    Untitled

    Abstract: No abstract text available
    Text: LED23 rev 2.0 29.04.2015 Description LED23 series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 2.35 µm and optical power of typ. 0.8 mW qCW. It comes in TO-18 package, with cap and without window on request .


    Original     		PDF LED23 LED23 150mA

    LED19-PR

    Abstract: No abstract text available
    Text: LED19-PR v 2.0 24.11.2014 Description LED19-PR series are fabricated from narrow band-gap GaInAsSb/AlGaAsSb heterostructures lattice matched to GaSb substrate. This Mid-IR LED provides a typical peak wavelength of 1.95 µm and optical power of typ. 1 mW qCW. It comes in TO-18 package, with a parabolic reflector and a without window on request .


    Original     		PDF LED19-PR LED19-PR 150mA 200mA

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    84 pin plcc lattice dimension

    Abstract: C045
    Text: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE


    Original     		PDF 16-Pin 84 pin plcc lattice dimension C045

    14.5M 1982

    Abstract: AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40
    Text: Package Diagrams November 2010 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B 1 N/2 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL


    Original     		PDF 20-Pin 300-Mil) 1020-ball 1152-ball 1704-ball 492-Ball 208-ball 25-ball 332-ball 100-pin 14.5M 1982 AC12 MO-220 MO-275 ANSI Y14.5 FCBGA304 fcbga-304 ansi-y14.5m-1982 LAttice bottom marking SCM40

    Lattice Semiconductor Package Diagrams 256-Ball fpBGA

    Abstract: LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304
    Text: Package Diagrams October 2011 Data Sheet 20-Pin 300-Mil CERDIP Package Dimensions in Inches (DATUM A) B N/2 1 4 E E1 N E3 e/2 E DETAIL A D A 4 BASE PLANE (DATUM B) A2 A1 A C SEATING PLANE e b2 Z b .010 M L Z E2 C A B b1 (c) 4X WITH LEAD FINISH c1 BASE METAL


    Original     		PDF 20-Pin 300-Mil) 208-ball 25-ball 332-ball 100-pin 120-pin 128-pin 160-pin 208-pin Lattice Semiconductor Package Diagrams 256-Ball fpBGA LAttice top marking BB 1704 672-BALL SCM40 AC12 MO-220 MO-275 84 pin plcc lattice dimension fcbga-304

    TMS 3880

    Abstract: vantis jtag schematic e2cmos technology jtag cable lattice Schematic NT 407 F lattice electrically erasable gal 1985 Vantis ISP cable lattice 1996
    Text: L A T T I C E S E M I C O N D U C T O R New Dimensions in ISP Programmable Analog Circuits Programmable Analog Circuits WORLD LEADER FOR IN-SYSTEM PROGRAMMABILITY ISP from LATTICE—THE Digital Lattice ispPACTM—Programmable Analog Devices that are custom designed and


    Original     		PDF functio268-8000 I0104 TMS 3880 vantis jtag schematic e2cmos technology jtag cable lattice Schematic NT 407 F lattice electrically erasable gal 1985 Vantis ISP cable lattice 1996

    3006d

    Abstract: J1 3009-2 3004c 30054 3005A STM-1 Physical interface PHY A transistor which is related with H1 3003A ort8850h-2bm680c 30042 pad 3006A
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver February 2008 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 3006d J1 3009-2 3004c 30054 3005A STM-1 Physical interface PHY A transistor which is related with H1 3003A ort8850h-2bm680c 30042 pad 3006A

    Untitled

    Abstract: No abstract text available
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver April 2006 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 ORT8850L ORT8850H ORT8850L-2BMN680I ORT8850L-1BMN680I ORT8850H-1BMN680I

    300b0

    Abstract: No abstract text available
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver August 2004 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 ORT8850L ORT8850H ORT8850L-2BMN680I ORT8850L-1BMN680I ORT8850H-1BMN680I 300b0

    Untitled

    Abstract: No abstract text available
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver November 2003 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 channel50H-1BM680C ORT8850H ORT8850L ORT8850H ORT8850L-2BM680I ORT8850L-1BM680I ORT8850H-1BM680I

    diode D32

    Abstract: J1 3009-2
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver October 2003 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 channels50H-1BM680C ORT8850H ORT8850L ORT8850H ORT8850L-2BM680I ORT8850L-1BM680I ORT8850H-1BM680I diode D32 J1 3009-2

    Untitled

    Abstract: No abstract text available
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver November 2002 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 ORT8850L ORT8850H M-ORT8850L2BM680-DB M-ORT8850L1BM680-DB M-ORT8850H2BM680-DB M-ORT8850H1BM680-DB

    30054

    Abstract: driver 30090 pt35c 30021 30042 30046 3006A 3006d 30079 30080 468
    Text: ORCA ORT8850 Field-Programmable System Chip FPSC Eight-Channel x 850 Mbits/s Backplane Transceiver October 2005 Data Sheet Introduction Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Programmable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed


    Original     		PDF ORT8850 ORT8850 ORT8850L ORT8850H ORT8850L-2BMN680I ORT8850L-1BMN680I ORT8850H-1BMN680I 30054 driver 30090 pt35c 30021 30042 30046 3006A 3006d 30079 30080 468