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    LAND PATTERN FOR SSOP Search Results

    LAND PATTERN FOR SSOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR SSOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    land pattern for TSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,


    Original     		PDF OT-23 O-263 MA05A land pattern for TSOP TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    1206 land pattern

    Abstract: NOMCA MPMA HTRN
    Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin


    Original     		PDF IPC-SM-782 M/D55342 12-Jun-15 1206 land pattern NOMCA MPMA HTRN

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT339-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF SSOP20 OT339-1 OT339-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of SSOP20 package SOT266-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF SSOP20 OT266-1 OT266-1

    noaa weather radio circuit diagram

    Abstract: Si47xx Si470x AMI Semiconductor AN383 Si4737 Si473x si4738 FM receiver CIRCUIT DIAGRAM and specification Si4736
    Text: Si4736/37/38/39-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features    Integrated LDO regulator  2.0 to 5.5 V supply voltage SSOP  2.7 to 5.5 V supply voltage (QFN)  Wide range of ferrite loop sticks and air loop antennas supported  QFN and SSOP packages


    Original     		PDF Si4736/37/38/39-C40 Si4737/39 Si4736/37/38/39 noaa weather radio circuit diagram Si47xx Si470x AMI Semiconductor AN383 Si4737 Si473x si4738 FM receiver CIRCUIT DIAGRAM and specification Si4736

    SI4734

    Abstract: Si4735 Si4735-C40-GU Si4734-35-C40 am sw fm radio PCB schematic diagram Si473x Si4735 receiver chip si4735-c40 Si47xx FM radio CIRcuit DIAGRAM Shortwave
    Text: Si4734/35-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features       RDS/RBDS processor Si4735  Optional digital audio out (Si4735)  2-wire and 3-wire control interface Ordering Information: See page 32.  Integrated LDO regulator  2.0 to 5.5 V supply voltage (SSOP)


    Original     		PDF Si4734/35-C40 Si4735) Si4734/35 EN55020 SI4734 Si4735 Si4735-C40-GU Si4734-35-C40 am sw fm radio PCB schematic diagram Si473x Si4735 receiver chip si4735-c40 Si47xx FM radio CIRcuit DIAGRAM Shortwave

    4730C40GU

    Abstract: 4730C40 SI4731 SI4730 Si473x Si47xx marking code AE -transformer SDIO CARD PCB PAD SIZE SI4730-C40-GU SI4730-C40-GM
    Text: Si4730/31-C40 B ROADCAST AM/FM R ADIO R ECEIVER Features    Integrated LDO regulator  2.0 to 5.5 V supply voltage SSOP  2.7 to 5.5 V supply voltage (QFN) air loop antennas supported     Modules  Clock radios  Mini HiFi  Entertainment systems


    Original     		PDF Si4730/31-C40 Si4730/31 4730C40GU 4730C40 SI4731 SI4730 Si473x Si47xx marking code AE -transformer SDIO CARD PCB PAD SIZE SI4730-C40-GU SI4730-C40-GM

    land pattern for SSOP

    Abstract: DATA SHEET 7402 ed 7402-2
    Text: SSOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 0.80 0.65 α β1 β2 γ 0.20 0.30 0.20 0.30 0.20 0.30 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e −γ Unit : mm 0.50 Remark 0.20 0.30 0.20 0.25 Washability of the printed-circuit board


    Original     		PDF ED-7402-2 land pattern for SSOP DATA SHEET 7402 ed 7402-2

    max232 free

    Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
    Text: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is


    Original     		PDF RS-232 MAX220 MAX249 EIA/TIA-232E MAX225, MAX233, MAX235, MAX245/MAX246/MAX247 MAX3222E/MAX3232E/MAX3237E/MAX3241E/ MAX3246E: max232 free AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw

    Untitled

    Abstract: No abstract text available
    Text: 19-1339; Rev 9; 2/07 ±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V, RS-232 Transceivers with AutoShutdown Plus The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and V.28/V.24 communications interfaces with automatic shutdown/wakeup features, high data-rate capabilities, and enhanced electrostatic discharge ESD


    Original     		PDF RS-232 MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E EIA/TIA-232 MAX3225EETP T2055 mvp/id/1847/t/or 26-Jul-2010

    CY8C28000-24PVXI

    Abstract: QFN48 108X108
    Text: 15.88mm [0.625"] 24.77mm [0.975"] 286XXQ rev * 27.57mm [1.085"] McMaster/Carr 91185A558 CY3250-286XXQFN Description: POD 56 pin SSOP OCD with Hirose cable connector P/N: DF12-5.0-20DP-0.5V-81 with retension mechanism included. Compatible with: SF-QFN48A-L-02B, QFN foot, 48 pin, 0.5mm pitch, 5mm body


    Original     		PDF 286XXQ 91185A558 CY3250-286XXQFN DF12-5 0-20DP-0 SF-QFN48A-L-02B, XT-PSoC-15-20H-10-01 CY8C28000-24PVXI EA-8C286XX-Q48-01 CY8C28000-24PVXI QFN48 108X108

    SSOP24

    Abstract: land pattern ssop24
    Text: 24-Pin Shrink Small Outline Package SSOP24 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 7.6 ±0.3 +0.03 0.15 -0.01 13 5.6 ±0.2 24 0 ～10゜ 0.45 ±0.2 0.325 typ. 0.65 12 0.22 +0.09 –0.06 0.1 Land Pattern Example 0.13 M Enlarged view of A


    Original     		PDF 24-Pin SSOP24 SSOP24 LSSOP24 land pattern ssop24

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


    Original     		PDF SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing M24.15 24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE QSOP/SSOP 0.150” WIDE BODY Rev 3, 2/13 24 6.19 5.80 INDEX 3.98 3.81 AREA 5 4 0.25(0.010) M B M -B- 1 TOP VIEW DETAIL “X” SEATING PLANE


    Original     		PDF 95and 5M-1982.

    Untitled

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Package Outline Drawing M16.15A 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE QSOP/SSOP 0.150” WIDE BODY Rev 3, 8/12 16 INDEX AREA 3.99 3.81 6.20 5.84 4 0.25(0.010) M B M -B- 1 TOP VIEW DETAIL “X” SEATING PLANE


    Original     		PDF 5M-1994.

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		PDF DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint

    lcd cross reference

    Abstract: No abstract text available
    Text: Chip Bead Array Chip Bead Array Type: EXC28B • Features ■ Recommended Applications ● Space saving ● Compatible line pitch with SSOP package 0.5 mm pitch ● Small size and light weight ● Pb Free (Terminal plating, conductor) ● Small digital equipment such as Personal computers, Printer, HDD, DVD-ROM, CD-ROM, LCD.


    Original     		PDF EXC28B EXC28BB EXC28BA lcd cross reference

    lcd cross reference

    Abstract: EXC28BA121U EXC28BA221U EXC28BB121U HP4291A
    Text: Chip Bead Array Chip Bead Array Type: EXC28B n Features l Space saving l Compatible line pitch with SSOP package 0.5 mm pitch l Small size and light weight Type: EXC28BB l Suitable for high speed signal (over 50 MHz) l Excellent cross talk characteristics (100 MHz:<-25 dB)


    Original     		PDF EXC28B EXC28BB EXC28BA lcd cross reference EXC28BA121U EXC28BA221U EXC28BB121U HP4291A