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    LAND PATTERN FOR SOIC 16 Search Results

    LAND PATTERN FOR SOIC 16 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR SOIC 16 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    max232 free

    Abstract: MAX249 AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw
    Text: 19-4323; Rev 15; 1/06 +5V-Powered, Multichannel RS-232 Drivers/Receivers Next-Generation Device Features The MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communications interfaces, particularly applications where ±12V is


    Original     		PDF RS-232 MAX220 MAX249 EIA/TIA-232E MAX225, MAX233, MAX235, MAX245/MAX246/MAX247 MAX3222E/MAX3232E/MAX3237E/MAX3241E/ MAX3246E: max232 free AUO-M201.1F pdf MAX222CPN 90-0108 MAX232EJE 8 PIN Plastic DIP land pattern max233acw

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    si8540

    Abstract: IA2410 sot-23 MARKING CODE G1 marking 611 mark G1 SOT-23
    Text: Si8540 H I G H - S ID E C URRENT S ENSE A MPLIFIER Features  Complete, unidirectional high-side current sense capability  0.2% full-scale accuracy  +5 to +36 V supply operation  85 dB power supply rejection  90 µA max supply current 9 µA shutdown current


    Original     		PDF Si8540 OT-23 OT-23 Si8540 IA2410 sot-23 MARKING CODE G1 marking 611 mark G1 SOT-23

    SC1302A

    Abstract: SC1302B SC1302C
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F 1000pf SC1302A/B/C/D/E/F MS-012, IPC-SM-782A, SC1302A SC1302B SC1302C

    1206 land pattern

    Abstract: NOMCA MPMA HTRN
    Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin


    Original     		PDF IPC-SM-782 M/D55342 12-Jun-15 1206 land pattern NOMCA MPMA HTRN

    D8025

    Abstract: SC1302A SC1302B SC1302C
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F 1000pf SC1302A/B/C/D/E/F MS-012, IPC-SM-782A, D8025 SC1302A SC1302B SC1302C

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    land pattern for TSsOP 16

    Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
    Text: 19-1539; Rev 0; 2/00 High-Speed, Single-Supply, Quad, SPST Analog Switches Features Applications Test Equipment Sample-and-Hold Circuits Disk Drives Guidance and Control Systems Tape Drives Military Radios Audio and Video Communications Systems Switching PBX, PABX


    Original     		PDF MAX4591/MAX4592/MAX4593 MAX4591 MAX4592 MAX4593 100pA MAX4581, MAX4582, MAX4583 MAX4617, land pattern for TSsOP 16 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16

    SOIC127P1032X265-16AN

    Abstract: soic16 land pattern SI8606 RF transmitter SOIC 8 narrow body pcb pattern narrow body SOIC 8 pcb pattern
    Text: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage


    Original     		PDF Si860x AEC-Q100 Si8605, Si8606) SOIC-16 60-year SOIC127P1032X265-16AN soic16 land pattern SI8606 RF transmitter SOIC 8 narrow body pcb pattern narrow body SOIC 8 pcb pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    Untitled

    Abstract: No abstract text available
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F SC1302A/B/C SC1302A SC1302B SC1302C SC1302D/E/F SC1302A/ IPC-SM-782A,

    SI8606

    Abstract: Si86 SOIC127P1032X265-16AN
    Text: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage


    Original     		PDF Si860x AEC-Q100 Si8605, Si8606) SOIC-16 60-year SI8606 Si86 SOIC127P1032X265-16AN

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    Untitled

    Abstract: No abstract text available
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F SC1302A/B/C SC1302A SC1302B SC1302C SC1302D/E/F SC1302A/ MS-012, IPC-SM-782A,

    SOIC127P1032X265-16AN

    Abstract: No abstract text available
    Text: Si860x B IDIRECTIONAL I 2 C I SOLA TORS WITH U NIDIRECTIONAL D IGITA L C HANNELS Features  Independent, bidirectional SDA and SCL isolation channels Open drain outputs with 35 mA sink current  High electromagnetic immunity  Wide operating supply voltage


    Original     		PDF Si860x AEC-Q100 Si8605, Si8606) SOIC-16 60-year SOIC127P1032X265-16AN

    SC1302E equivalent

    Abstract: No abstract text available
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F SC1302A/B/C SC1302A SC1302B SC1302C SC1302D/E/F SC1302A/ IPC-SM-782A, SC1302E equivalent

    SC1302A

    Abstract: SC1302B SC1302C
    Text: SC1302A/B/C/D/E/F Dual High Speed Low-Side MOSFET Driver POWER MANAGEMENT Description Features ‹ +4.5V to +16.5V operation ‹ Fast rise and fall times 20ns typical with 1000pf load ‹ Dual MOSFET driver ‹ 2A peak drive current ‹ 40ns propagation delay


    Original     		PDF SC1302A/B/C/D/E/F 1000pf SC1302A/B/C/D/E/F MS-012, IPC-SM-782A, SC1302A SC1302B SC1302C

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    si87xx

    Abstract: LGA8 si8710 SI8710CD-B-IS si8711 GW marking code diode K 2611 MOSFET VOLTAGE RATING HCPL-261X ACPL-W611 Pin-compatible, drop-in upgrades for popular
    Text: Si87xx 5 K V L E D E M U L A T O R I N P U T , O P E N C O LL EC TO R OUTPUT ISOLATORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 


    Original     		PDF Si87xx si87xx LGA8 si8710 SI8710CD-B-IS si8711 GW marking code diode K 2611 MOSFET VOLTAGE RATING HCPL-261X ACPL-W611 Pin-compatible, drop-in upgrades for popular

    A 3120 opto

    Abstract: A 3120 opto coupler HPCL 3120 narrow body SOIC 8 pcb pattern AVAGO MARKING E4 IGBT driver hcpl3120 HPCL0302 SI8221CC-A-IS HPCL3120 HPCL-0302
    Text: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I V E R S W I T H O PT O I N P U T 2.5, 3.75, AND 5.0 KVRMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)


    Original     		PDF HCPL-0302, HCPL-3120, TLP350, SOIC-16 A 3120 opto A 3120 opto coupler HPCL 3120 narrow body SOIC 8 pcb pattern AVAGO MARKING E4 IGBT driver hcpl3120 HPCL0302 SI8221CC-A-IS HPCL3120 HPCL-0302

    HPCL-3120

    Abstract: HPCL3120 A 3120 opto HPCL 3120 SOIC127P1032X265-16AN 3120 8 pin optocoupler A 3120 opto coupler opto cross reference avago si8220bb-a-is 60601-1
    Text: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)


    Original     		PDF HCPL-0302, HCPL-3120, TLP350, SOIC-16 HPCL-3120 HPCL3120 A 3120 opto HPCL 3120 SOIC127P1032X265-16AN 3120 8 pin optocoupler A 3120 opto coupler opto cross reference avago si8220bb-a-is 60601-1

    Untitled

    Abstract: No abstract text available
    Text: S i 8 7 1 x/2x 5 K V L E D E MU LAT OR I NPUT , L O G I C O UTPUT I SOLATORS Features  High Speed: dc to 15 Mbps   2.5 to 5.5 V logic output  Pin-compatible, drop-in upgrades for popular high-speed digital  optocouplers   Performance and reliability


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Si87xx 5 K V LED E MULATOR I N PU T , O PEN C OLLECTOR O UTPUT I SOLA TORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 


    Original     		PDF Si87xx

    Untitled

    Abstract: No abstract text available
    Text: S i 8 2 2 0/21 0 . 5 A N D 2 . 5 A M P I S O D R I VE R S W I T H O P T O I N P U T 2.5, 3.75, AND 5.0 KV RMS Features  Functional upgrade for HCPL-0302, HCPL-3120, TLP350, and similar opto-drivers  60 ns propagation delay max (independent of input drive current)


    Original     		PDF HCPL-0302, HCPL-3120, TLP350, AEC-Q100