land pattern 0805
Abstract: 0402 land pattern land pattern 1812 0402 0603 0805 1206 0402 0603 0805 land
Text: APPLICATION NOTE RECOMMENDED LAND PATTERN NMC CHIP CERAMIC CAPACITOR Land Pattern NMC C < >< D > A < > B Solder Resist 1. Flow Soldering SIZE 0402 0603 0805 1206 1210 1812 2225 A NA 0.8 ~ 1.0 0.8 ~ 1.4 1.8 ~ 2.4 1.8 ~ 2.4 2.5 ~ 3.2 N/A B NA 2.6 ~ 3.2 3.0 ~ 4.0
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1206 land pattern
Abstract: NOMCA MPMA HTRN
Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin
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IPC-SM-782
M/D55342
12-Jun-15
1206 land pattern
NOMCA
MPMA
HTRN
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land pattern 0805
Abstract: 0402 0603 0805 land
Text: 4/2/02 http:www.niccomp.com Technical Inquiries: [email protected] SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4
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01005 land pattern
Abstract: 0402 land pattern
Text: NMC SERIES - LAND PATTERN DIMENSIONS Component Outline D Solder Resist A C Land Pads B 1. Flow Soldering Dimension mm A B C D 0603 0.8 ~ 1.0 2.6 ~ 3.2 0.7 ~ 0.8 0.8 ~ 1.2 Size 1206 1.8 ~ 2.4 4.2 ~ 5.2 1.2 ~ 1.6 0.9 ~ 1.7 1210 1.8 ~ 2.4 4.2 ~ 5.2 1.8 ~ 2.5
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W709
Abstract: 0805FT
Text: 0805FT MINIATURE RF CHIP INDUCTORS Designed for Wireless Products Wirewound ferrite core construction High Inductance values and low RDC Tin/lead terminations Industry standard 0805 2012 surface mount land pattern Electrical Specifications @ 25°C Part Number
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0805FT
PE-0805FT102KTT
PE-0805FT152KTT
PE-0805FT222KTT
PE-0805FT332KTT
PE-0805FT472KTT
PE-0805FT682KTT
PE-0805FT103KTT
PE-0805FT153KTT
PE-0805FT223KTT
W709
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Untitled
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 0805FT SERIES Wirewound ferrite core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C
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0805FT
PE-0805FT102KTT
96MHz
PE-0805FT152KTT
PE-0805FT222KTT
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Untitled
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 0805CD SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C
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0805CD
PE-0805CD2N8KTT
PE-0805CD3N0KTT
PE-0805CD030KTT
PE-0805CD050KTT
PE-0805CD060KTT
PE-0805CD7N5KTT
PE-0805CD080KTT
PE-0805CD100KTT
PE-0805CD120KTT
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Untitled
Abstract: No abstract text available
Text: Ver. 201306 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21L
CIG21LR47MNE
CIG21L1R0MNE
CIG21L1R2MNE
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Untitled
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Electrical Specifications @ 25°C Part Number
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0805CM
PE-0805CM030KTT
PE-0805CM060KTT
PE-0805CM080KTT
PE-0805CM100KTT
PE-0805CM120KTT
PE-0805CM150KTT
PE-0805CM180KTT
PE-0805CM220KTT
PE-0805CM270KTT
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0071.3061.A2
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self-resonant frequency Industry standard 0805 2012 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C
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0805CM
PE-0805CM030KTT
PE-0805CM060KTT
PE-0805CM080KTT
PE-0805CM120KTT
PE-0805CM150KTT
PE-0805CM180KTT
PE-0805CM220KTT
PE-0805CM270KTT
PE-0805CM330KTT
0071.3061.A2
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Untitled
Abstract: No abstract text available
Text: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self-resonant frequency Industry standard 0805 2012 surface mount land pattern Refer to page 3 for Competition Cross Reference Electrical Specifications @ 25°C
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0805CM
2000/reel
WC701
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Untitled
Abstract: No abstract text available
Text: Ver. 201207 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure
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CIG21F
CIG21FR47MNC
CIG21F1R0MNC
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Untitled
Abstract: No abstract text available
Text: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.
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CIB/CIM21
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Untitled
Abstract: No abstract text available
Text: Ver. 201007 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure
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CIG21F
CIG21FR47MNC
CIG21F1R0MNC
CIG21F1R5MNC
CIG21F2R2MNC
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Untitled
Abstract: No abstract text available
Text: Ver. 201306 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure
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CIG21F
CIG21FR47MNC
CIG21F1R0MNC
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Untitled
Abstract: No abstract text available
Text: Ver. 201207 Multilayer Power Inductor CIG21W Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low Profile (1.0mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21W
CIG21W1R0MNE
CIG21W1R5MNE
CIG21W2R2MNE
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A1t smd
Abstract: A2t diode smd SMD a1T Transistor A1t smd transistor smd A1T a1t diode RFBLN2012090A1T smd diode A1T smd transistor a1t VINCENT
Text: Walsin Technology Corporation SMD Balun-Unbalance Transformer RFBLN2012090A□T Series Patent Pending Multi Layer Chip BALUN – 2012 0805 For ISM Band 2.4GHz Application SOLDER LAND PATTERN FEATURES Figure LTCC ( Low Temperature Cofired Ceramics ) Technology
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RFBLN2012090AT
A1t smd
A2t diode smd
SMD a1T Transistor
A1t smd transistor
smd A1T
a1t diode
RFBLN2012090A1T
smd diode A1T
smd transistor a1t
VINCENT
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Untitled
Abstract: No abstract text available
Text: Ver. 201306 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21C
CIG21C2R2MNE
CIG21C4R7MNE
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inductor 2r2
Abstract: CIG21C2R2MNE
Text: Ver. 201011 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21C
CIG21C2R2MNE
CIG21C4R7MNE
inductor 2r2
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land pattern 0805
Abstract: CIG21LR47MNE CIG21L4R7MNE CIG21LR47M CIG21L1R0MNE CIG21L3R3MNE land pattern 0805 inductor land pattern inductor 0805 CIG21L2R2MNE
Text: Ver. 201007 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21L
CIG21LR47MNE
CIG21L1R0MNE
CIG21L1R5MNE
CIG21L2R2MNE
CIG21L3R3MNE
CIG21L4R7MNE
land pattern 0805
CIG21LR47M
land pattern 0805 inductor
land pattern inductor 0805
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Untitled
Abstract: No abstract text available
Text: Ver. 201207 Chip Bead For High Current CIC21 Series 2012/ EIA 0805 APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm CIC series is used for high current. ) 0.9~1.6mm 0.6~1.2mm 0.6~1.2mm DIMENSION Type 21 Dimension [mm]
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CIC21
100MHz
CIC21P110
CIC21P300
CIC21P600
CIC21P800
CIC21P101
CIC21P11000
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Untitled
Abstract: No abstract text available
Text: Ver. 201207 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21C
CIG21C2R2MNE
CIG21C4R7MNE
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Untitled
Abstract: No abstract text available
Text: Ver. 201207 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances
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CIG21L
CIG21LR47MNE
CIG21L1R0MNE
CIG21L1R2MNE
0805/2tics
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Untitled
Abstract: No abstract text available
Text: A Dimensions: [mm] B Recommended land pattern: [mm] D Absolute Maximum Ratings Ambient Temperature 25°C : Properties Test conditions Power dissipation Peak Forward Current duty/10@1kHz Continuous Forward Current Reverse Voltage ESD Threshold/ Human Body Modell
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duty/10
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