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    kester r256

    Abstract: 62Sn36Pb2Ag
    Text: ,QILQHRQ technologies Assembly & Interconnect Technology Version 1.0 Recommendations for the board assembly of the ECSP- 4 package Application Note 1 Target 2) Board pad design 3) Solder paste printing process 4) Placement of components 5) Reflow soldering process


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    kester r256

    Abstract: paste profile NB 40 smd transistor kester Re SOLDER PASTE smd transistor marking PA
    Text: P - T S L P - 2 - 1 / P - T S L P - 3 - 1 Recommendations for the Board Assembly Ta rge t T h e t a r g e t of this document is to provide guidelines for our customers to successfully introduce Infineon's leadless packages P-TSLP2-1 / P-TSLP-3-1 into production. This includes recommendations for board pad design, stencil layout, component placement, and soldering process. Generally standard SMT equipment and processes are suitable for


    Original     		PDF B000-H0000-X-X-7600 kester r256 paste profile NB 40 smd transistor kester Re SOLDER PASTE smd transistor marking PA