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    INTEL MARK 164997 Search Results

    INTEL MARK 164997 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EN80C188XL-12 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    EN80C188XL-20 Rochester Electronics LLC 80C188XL - MPU Intel 186 CISC 16-Bit Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy

    INTEL MARK 164997 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    intel g31 chipset motherboard

    Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
    Text: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


    Original
    82G35 OTH97; D29081 intel g31 chipset motherboard BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 PDF

    foxconn g41

    Abstract: g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002
    Text: Intel 4 Series Chipset Thermal and Mechanical Design Guidelines September 2008 Document Number: 319972-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT


    Original
    D29081 foxconn g41 g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002 PDF

    d9258

    Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
    Text: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR


    Original
    82X38 d9258 d92580 Loctite 7452 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN PDF

    E11663-001

    Abstract: Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force
    Text: Intel 3210 and 3200 Chipset Thermal/Mechanical Design Guide November 2007 Reference Number: 318465 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS


    Original
    5M-1994 E11663-001 Loctite 7452 honeywell pcm45 DDR2-667 DDR2-800 PCM45F FLUKE 79 intel chipset g 41 motherboard no display chipset dual core intel BGA heatsink compressive force PDF

    UL1439

    Abstract: intel mark 164997 intel marking 00C863501A
    Text: gX 58.6 47 NDTESi FULL ROUND- \ / D n s \ A X ;e e d e t a il b EE DETAIL A 1. THIS DRAWING TD BE USED IN CONJUNCTION WITH SUPPLIED 31] DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS


    OCR Scan
    6063-T5 UL1439 00C863501A intel mark 164997 intel marking 00C863501A PDF

    intel mark 164997

    Abstract: TDP 245 Y
    Text: NOTES' 1. CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PROCESS. 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FROM CENTERLINE DF HEATSINK. Ld I- 1 1 1 3 2 1 TDP 335C872401A 334C872401A 333C872401A 00C872401


    OCR Scan
    335C872401A 334C872401A 333C872401A 00C872401 PCM45F 20X20 00C872401A 334C87E401A intel mark 164997 TDP 245 Y PDF

    intel mark 164997

    Abstract: PCM45F c623 marking UL1439
    Text: NOTES: 1, CLIP MUST STAY ATTACHED TD HEATSINK 2. CLIP SHDULD NDT BE ABLE TD ROTATE 360 DEGREES AFTER CRIMPING PRDCESS, 3. CRIMPING FEATURES SHDULD BE EQUAL DISTANCE FRDM CENTERLINE DF HEATSINK, 4, TD LERANCEi U N LESS OTHERW ISE S P E C IF IE D Ld IC PI >m


    OCR Scan
    335C877001A 334C877001A 333C877001A PCM45F intel mark 164997 c623 marking UL1439 PDF