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    Mil-Std-202F 215j

    Abstract: Polyimide
    Text: Polyimide Component Labels SPECIFICATION SHEET specifications Thermal transfer polyimide adhesive label material shall be specially designed for circuit board manufacturing where there will be direct contact with wave solder and IR flow. The label shall withstand flash temperatures as high as 617°F for up


    Original     		PDF IDSP02 SA-IDSP02 Mil-Std-202F 215j Polyimide