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    IRGC75B60

    Abstract: IRGC75 5646
    Text: PD - 94656 HF75E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR Benefits • • • • • • Benchmark Efficiency for UPS and Welding Applications Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation


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    PDF HF75E060ACE 125mm 12-Mar-07 IRGC75B60 IRGC75 5646