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    HA*13157 Search Results

    HA*13157 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    77313-157-08LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions Visit Amphenol Communications Solutions
    77313-157-26LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions Visit Amphenol Communications Solutions
    85713-157LF Amphenol Communications Solutions 4 Row Signal Header, Straight, Press-Fit, 1 Mod Visit Amphenol Communications Solutions
    77313-157-72LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions Visit Amphenol Communications Solutions
    77313-157-12LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 12 Positions Visit Amphenol Communications Solutions
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    HA*13157 Price and Stock

    Hitachi Ltd HA13157

    Electronic Component
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA HA13157 105
    • 1 -
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    • 1000 -
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    		Get Quote

    HA*13157 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HA13157 Renesas Technology 33 W x 4-Channel BTL Power IC Original PDF