CHIP TANTAL
Abstract: SOT-143 tantal 1206 melf
Text: PCB for Introduction to SMD Surface Mounting RE711001-LF - board for introducing solder practice, suitable for pick & place - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air levelling HAL-leadfree - solder stop mask and additional print
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RE711001-LF
SOM16:
CHIP TANTAL
SOT-143
tantal
1206 melf
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"Vibration Sensor"
Abstract: VIBRATION SENSOR Micro Sensor mvs-0608 VIBRATION SWITCH "Vibration switch" corrosion sensor VIBRATION SENSOR, vibrations sensor D-76133
Text: Data Sheet Micro Vibration Sensor MVS 0608.02 omnidirectional Version: V 2.0 The ball bridges two contacts reducing the resistance between the two external connection pads from several mega ohms (>30MOhm) to below 100 ohms. Material Package PCB laminate material (FR4, epoxy glass
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30MOhm)
300Hz,
500Hz;
500Hz,
D-76133
"Vibration Sensor"
VIBRATION SENSOR
Micro Sensor
mvs-0608
VIBRATION SWITCH
"Vibration switch"
corrosion sensor
VIBRATION SENSOR,
vibrations sensor
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TSOP32
Abstract: No abstract text available
Text: PCB for Soldering Practice for SMD Standard, Fine Pitch and Discrete Components RE712001-LF - PCB for solder practices for SMD standard, fine pitch, and discrete components, also very well suitable for pick-and-place - EPOXY resin FR4 1.50 mm single-sided 35 µm CU
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RE712001-LF
0805te
TSOP32
TSOP32
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX152
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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solder stop mask
Abstract: No abstract text available
Text: PCBs for SMD Solder Practice RE715001-LF - PCB for pick-and-place of fine pitch QFP 256 - a challenge to the solder equipment - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE715001-LF
solder stop mask
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O
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518-77-NNNMXX-XXX105
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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Untitled
Abstract: No abstract text available
Text: PCB for Pick and Place Soldering Practice for BGA 169 and 225 RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU
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RE713001-LF
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smd transistor 2x
Abstract: SMD transistor 2x sot 23 2x smd
Text: TSSOP-SMD Multiadapter thin shrink small outline package RE710001-LF - PCB for SMD standard and fine pitch solder practices - also suitable for pick-and-place. - EPOXY resin FR4 1.50 mm, single-sided 35 µm CU - Solder side hot air leveling coated (HAL-leadfree), solder stop mask and additional print
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RE710001-LF
smd transistor 2x
SMD transistor 2x sot 23
2x smd
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stop-off
Abstract: gerber RE901
Text: SOT 23 SMD Multiadapter RE901 - multiadapter circuit board with six micro-miniature semiconductor circuits - EPOXY fibre-glass FR4 1.50 mm single-sided 35 µm CU - component side chem. NI/AU, solder stop-off mask and board assembly print - the PCB can be equipped with twenty different types of semiconductors listed
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RE901
stop-off
gerber
RE901
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R223.424
Abstract: No abstract text available
Text: M01 MMBX ASSEMBLY INSTRUCTIONS Part number R223 424 000 R223 424 800 R223 434 000 R223 434 800 COPLANAR LINE Pattern and signal are on the same side. The material of PCB is epoxy resin FR4 (Er = 4.6). The solder resist should be printed except for the land pattern on the PCB.
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epoxy resin
Abstract: No abstract text available
Text: PCB for Pick and Place of Fine Pitch QFP 256 RE715001-LF - PCB for pick-and-place of fine pitch QFP 256 - a challenge to the solder equipment - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree , solder stop mask and additional print
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RE715001-LF
epoxy resin
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Untitled
Abstract: No abstract text available
Text: PCBs for SMD Solder Practice RE713001-LF - PCB for solder practices pick-and-place for BGA 169 and 225 grid 1.50 mm including daisychain test points - introduction into trend-setting technology - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE713001-LF
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RE714001-LF
Abstract: Re714
Text: PCBs for SMD Solder Practice RE714001-LF - PCB for solder practices for SMD fine pitch QFP 208 - the new standard technology 0.50 mm - for manual soldering and pick-and-place very well suitable - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print
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RE714001-LF
RE714001-LF
Re714
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Untitled
Abstract: No abstract text available
Text: PCB for Introduction to SMD Surface Mounting HP = FR2 - P henolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido DS = doppelseitig
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BGA-169
Abstract: No abstract text available
Text: PCB for Pick and Place Soldering Practice for BGA 169 and 225 HP = FR2 - P henolharzhartpapier / S RBP-Paper / Résine phénolplaste / papel duro a base de résina fenôlica EP = FR4 - E poxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido
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BQFP-132
Abstract: No abstract text available
Text: DS = doppelseitig / double-sided / double face / de dos lados EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epôxido a base de résina fenolica HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel dura
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D-555P5
PLCC68
BQFP132
5OL20
S0T23
PLCC20
PLCC20
PLCC44
PLCC44
BQFP-132
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Untitled
Abstract: No abstract text available
Text: PCB Mounted Receptacle Assemblies 2.54 mm 0.100 in. Description 95 mm MAX (3.740 in.) CONTACT 8.5 mm M AX (0.335 in.) T L i PC Board Specification Material Glass epoxy (G10, FR4-) 1.60 mm (0.063 in.) min 3.20 mm (0.126 in.) max 1.15 ±0.025 mm Drilled (0.045 ±0.001 in.)
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R00S411
00027L
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MOXA
Abstract: D13-26 WE353 1024K CSI EPROM a652 D2637
Text: APR 2 0 19W PUMA 3F8003 moXaic PUMA 3F8003-15/17/20 Issue 1 .0 : M arc h 1991 ADVANCE PRODUCT INFORMATION Mosaic Sem iconductor inc. 8,388,608 bit CMOS FLASH Memory Module Pin Definition Features Fast access times of 150/170/200 ns Utilizes 66 PGA FR4 epoxy substrate
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10jis,
A0-A17
D8-15
D16-23
D24-31
1024K
3F8003I-15
MOXA
D13-26
WE353
1024K CSI EPROM
a652
D2637
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