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    ABT8996

    Abstract: BCT8244 SN54ABT8996 SN54ACT8990 SN54LVT8980 SN74ABT8996 SN74ACT8990 SN74LVT8980 SCBS676
    Text: Chapter 7 Applications This chapter presents a number of testing problems and shows how boundary-scan testing and TI products can be used to solve them. Board-Etch and Solder-Joint Testing The current approach to detecting board-etch and solder-joint faults in today’s electronics industry uses two


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    12v inverter

    Abstract: 90nm 90nm ROM Etch Microelectronics 90nm cmos CS101SN CS101 10-Layer CHIP IPS serdes hsif
    Text: 90nm CMOS Standard Cell CS101 ASIC Series High-performance transistors • Advanced lithography and etch technology to achieve 40nm gate length • Low temperature process for shallow junction • Process optimization for high carrier mobility 9Cu/1Al interconnect


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    PDF CS101 10-layer CS101HU WFS-FS-20164-9/2004 12v inverter 90nm 90nm ROM Etch Microelectronics 90nm cmos CS101SN CHIP IPS serdes hsif

    MIL-STD-275E

    Abstract: resistor cross reference TI Cross Reference Search DN-71 MIL-STD275E MILSTD-275E
    Text: DN-71 Design Note Using Copper PCB Etch for Low Value Resistance by Larry Spaziani INTRODUCTION Current sensing in power supplies and motor controls demand the use of a very low value resistor. Each application varies in need for resistance value, power rating, size, form factor, inductance,


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    PDF DN-71 MIL-STD-275E resistor cross reference TI Cross Reference Search DN-71 MIL-STD275E MILSTD-275E

    Microtherm

    Abstract: statistical process control failure rate TDDB
    Text: ADI Reliability Handbook interconnects and deposition of tungsten probe pads to isolate failures and allow electrical characterization. Deposition of tungsten interconnects to implement circuit fixes Fluorescent Microthermal Imaging FMI This technique is currently under development within ADI. It is a thermal imaging technique that relies


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    kla5300

    Abstract: No abstract text available
    Text: Overlay accuracy – a metal layer study Andrew Habermas1, Brad Ferguson1, Joel Seligson2, Elyakim Kassel2, Pavel Izikson2 1 Cypress Semiconductor, 2401 East 86th St, Bloomington, MN 55425, USA 2 KLA-Tencor, P.O.B. 143, Migdal HaEmek 23100, Israel ABSTRACT


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    slla020a

    Abstract: No abstract text available
    Text: Application Report SLLA020A Recommendations for PHY Layout Ron Raybarman 1394 Applications Group Abstract This document makes recommendations for the layout of the PHY and Link layer devices in an IEEE 1394 environment. The optimal performance of an IEEE 1394 bus can depend on good


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    PDF SLLA020A slla020a

    walkie-talkie

    Abstract: SLUA460 walkie-talkie circuit
    Text: Application Report SLUA460 – March 2008 ESD and RF Mitigation in Handheld Battery Pack Electronics Bill Jackson . HVAL ABSTRACT It is imperative to protect the electronics in a consumer-removable battery pack from


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    PDF SLUA460 walkie-talkie SLUA460 walkie-talkie circuit

    SLLA020

    Abstract: TMS320
    Text: PHY Layout APPLICATION REPORT: SLLA020 Ron Raybarman Burke S. Henehan 1394 Applications Group Mixed Signal and Logic Products Bus Solutions November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any


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    PDF SLLA020 SLLA020 TMS320

    SLLA020

    Abstract: 9 pin connector 1394
    Text: PHY Layout APPLICATION REPORT: SLLA020 Ron Raybarman Burke S. Henehan 1394 Applications Group Mixed Signal and Logic Products Bus Solutions November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any


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    PDF SLLA020 SLLA020 9 pin connector 1394

    diaphragm pressure sensor

    Abstract: "capacitive pressure sensor" asme capacitive pressure sensor capacitive pressure sensors linear displacement sensor Relief Valve DATA SHEET Capacitive Pressure Transducer Velocity Sensors Silicon Designs
    Text: Custom Product Papers and Briefs The Fabrication and Use of Micromachined, Corrugated Silicon Diaphragms J. H. Jerman—IC Sensors, Milpitas, CA May 2, 1989 INTRODUCTION FLAT DIAPHRAGMS The vast majority of micromachined silicon diaphragms have The deflection of a flat, clamped, circular diaphragm is given


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    Revalpha

    Abstract: Nitto* revalpha Nitto Denko Revalpha Revalpha NO.3195H etch uv tape and furukawa magnetron X-band microwave oven magnetron Mitsui chemicals X-band antenna
    Text: Benefits and Challenges in Decreasing GaAs Through Substrate Via Size and Die Thickness Henry Hendriks, Allen Hanson, Thomas Lepkowski, Anthony Quaglietta, and Bharat Patel M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA Phone: 978 656-2562, Fax: (978) 656-2900, Email: [email protected]


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    Evaluation of Material and Process Contributions to BiFET Variation Using Design of Experiments

    Abstract: No abstract text available
    Text: Evaluation of Material and Process Contributions to BiFET Variation Using Design of Experiments Peter J. Zampardi, Bin Li*, Cristian Cismaru, Hal Banbrook, and Andre Metzger Skyworks Solutions, Inc., 2427 Hillcrest Drive, Newbury Park, CA 91320 [email protected], 805.480.4728, *Teledyne Scientific, 1049 Camino Dos Rios, Thousand Oaks, CA 91360


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    permittivity FR 4 PCB

    Abstract: MIL-P-13949G loss tangent of FR4 permittivity FR 4 Copper clad laminate e385 double sided pcb FR4 FR4 epoxy pcb double sided MIL-P-13949 94vo fr4
    Text: Blank Copper Laminate MASTER REFERENCE OF ALL “PULSAR” PRODUCTS: PCB “Fab-In-A-Box” - TTS Transfer Paper - GreenTRF film - WhiteTRF film - PCB Single Sided - PCB (Double Sided) 182-1027-ND 182-1003-ND 182-1021-ND 182-1022-ND 182-1017-ND (Shown Here)


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    PDF 182-1027-ND 182-1003-ND 182-1021-ND 182-1022-ND 182-1017-ND 182-1018-ND 182-1026-ND 182-1028-ND FR-4/G10 182-1029-ND permittivity FR 4 PCB MIL-P-13949G loss tangent of FR4 permittivity FR 4 Copper clad laminate e385 double sided pcb FR4 FR4 epoxy pcb double sided MIL-P-13949 94vo fr4

    SLMA004

    Abstract: SLMA002 SLMA002 LAND PATTERN powerPAD "exposed pad" PCB via
    Text: Application Brief PowerPAD Made Easy What is PowerPAD The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using


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    PDF SLMA002 SLMA004 SLMA004 SLMA002 LAND PATTERN powerPAD "exposed pad" PCB via

    ASTM-D-1308-87

    Abstract: sodium hydroxide ASTM-D-F-1598-95 MIL-C-675 microtouch capacitive touchscreen ClearTek microtouch controller High Resolution Optical Reflective Sensor lcd touchscreen
    Text: S P E C I F I C AT I O N S ClearTek 3000 Profile FLAT CAPACITIVE TOUCHSCREENS The Profile sensor, MicroTouch’s innovative design for flat capacitive touchscreens, incorporates advanced design and production techniques that result in the highest quality capacitive touchscreen on the market. Profile’s thin, sleek design provides ease-of-installation for LCD panels


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    PDF CT3KPROFILE-0002-0101 ASTM-D-1308-87 sodium hydroxide ASTM-D-F-1598-95 MIL-C-675 microtouch capacitive touchscreen ClearTek microtouch controller High Resolution Optical Reflective Sensor lcd touchscreen

    GaAs wafer

    Abstract: photoresist F. S. TSAI ED34 J.B. Ferguson
    Text: Costas Varmazis, Gerald S. D’Urso, Henry Hendriks Process Engineering Group, M/A-COM Inc., Lowell, Mass. How to Process the Backside of GaAs At a Glance The background details of backside GaAs process steps for wafers with through-substrate via holes are reviewed. Process step changes that have recently been implemented in


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    BQ24070 "application note"

    Abstract: TDS220 bq24070 BQ24071 HPA180 SLUS694 bq24070RHL bq24071RHL
    Text: User's Guide SLUU248A – May 2006 – Revised August 2006 bq24070/1 1.5-A Single-Chip Li-Ion and Li-Pol Charge Management IC EVM This user’s guide describes the bq24070/1 evaluation module EVM . The EVM provides a convenient method for evaluating the performance of a charge management


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    PDF SLUU248A bq24070/1 BQ24070 "application note" TDS220 bq24070 BQ24071 HPA180 SLUS694 bq24070RHL bq24071RHL

    ATF-34143

    Abstract: No abstract text available
    Text: Low Noise Amplifiers for 1500 MHz through 2500 MHz using the ATF-34143 Low Noise PHEMT Preliminary Applications Information [Version 34143e.doc dated 06-10-99] _ _ Introduction Hewlett Packard’s ATF-34143 is a low noise PHEMT designed for use in low cost commercial


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    PDF ATF-34143 34143e OT-343) amplifier43

    SANYO ALUMINIUM CAPACITORS

    Abstract: deadbeat control 6MV1500GX AN-1145
    Text: National Semiconductor Application Note 1145 Dongbing Zhang Steven Hunt July 2000 Abstract total tolerance of the resistance will be increased to about 20% including the effect of temperature. Second, the resistor itself is free. So the amount of savings in output caps is the


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    PDF AN-1145 SANYO ALUMINIUM CAPACITORS deadbeat control 6MV1500GX AN-1145

    ATF-33143

    Abstract: ATF-36163 LL1608-FH10NK LL1608-FH22NK TL21
    Text: A Low Noise High Intercept Point Amplifier for 1930 to 1990 MHz using the ATF-33143 PHEMT Application Note 1195 Introduction The Agilent Technologies ATF-33143 is one of a family of high dynamic range, low noise PHEMT devices designed for use in low cost commercial applications in the VHF through 6 GHz


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    PDF ATF-33143 ATF-33143 SC-70 OT-343) ATF-34143 5968-9877E ATF-36163 LL1608-FH10NK LL1608-FH22NK TL21

    bq2403x

    Abstract: TDS220 bq24030 bq24032 bq24035 HPA073 TDS-220 160-1181-1-ND SLUU207 HPA07
    Text: User's Guide SLUU207 – OCTOBER 2004 bq2403x bqTiny-III 1.5-A Single-Chip Li-Ion and Li-Pol Charge Management IC EVM This user’s guide describes the bq2403x (bqTiny-III™) Evaluation Module. The EVM provides a convenient method for evaluating the performance of a charge management


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    PDF SLUU207 bq2403x TDS220 bq24030 bq24032 bq24035 HPA073 TDS-220 160-1181-1-ND SLUU207 HPA07

    SLMA002

    Abstract: SLMA004 SLMA002 LAND PATTERN powerPAD TEXAS INSTRUMENTS, MOUNT COMPOUND, EPOXY
    Text: Application Brief PowerPAD Made Easy What is PowerPAD The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using


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    ETCH RESISTOR

    Abstract: SANYO ALUMINIUM CAPACITORS AN-1145 deadbeat control 6MV1500GX deadbeat
    Text: National Semiconductor Application Note 1145 Dongbing Zhang Steven Hunt July 2000 Abstract The relatively large steady-state window and the relatively small transient window for the core voltage of a modern advanced microprocessor make attractive implementation of


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    PDF AN-1145 ETCH RESISTOR SANYO ALUMINIUM CAPACITORS AN-1145 deadbeat control 6MV1500GX deadbeat

    DM-500-1

    Abstract: DM5003 DM-500 089h 2-DIGIT 7-SEGMENT LED DISPLAY EX205 "7 Segment Displays" potentiometer
    Text: Mn D M -500 3Va DIGIT, LED DISPLAY MINI PANEL METER PRODUCT DATA SHEET ^ g o c E T 6 f,O M |£ T Not available for sale FEATURES • Ultra-small size 0.89"H x 1.80"W x 1.89"D • DIN case and panel cutout • 31/2 Digit, bright LED (0.3" character) display


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    PDF DM-500 DM-500â 999mA DM-500-1; DM-500-1 DM5003 089h 2-DIGIT 7-SEGMENT LED DISPLAY EX205 "7 Segment Displays" potentiometer