Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
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C36000
ASTM-B16-00.
SAE-AMS-QQ-N-290.
XX-651000-10
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PDF
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18065
Abstract: No abstract text available
Text: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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Original
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36-Pin
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
24-651000-10-P
18065
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PDF
|
Untitled
Abstract: No abstract text available
Text: P/N 36-651000-10 36-Pin SSOP-to-0.6 DIP Adapter GENERAL SPECIFICATIONS • PCB: FR-4, 0.062 [1.56] or 0.094 [2.39] thick • PADS: bare Cu protected with Entek by Enthone or Omikron® white Sn to eliminate co-planarity concerns and solder bridges • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
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Original
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36-Pin
C36000,
B16/B16M
B579-73
SAE-AMS-QQ-N-290
24-651000-10-P
|
PDF
|
enthone
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
|
Original
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C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
enthone
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate co-planarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
|
Original
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
|
Original
|
C36000
ASTM-B16-85.
MIL-T10727
MIL-P-81728
QQ-N-290.
XX-651000-10
|
PDF
|
entek Cu-56
Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array
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Original
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Cu-56
5989-0491EN
AV02-0770EN
entek Cu-56
pcb warpage* in smt reflow
pcb warpage after reflow
Solder Paste, Indium, Type 3
thick bga die size
bga thermal cycling reliability
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PDF
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Untitled
Abstract: No abstract text available
Text: 36-651000-10 36 PIN SSOP TO .6DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
XX-651000-10
|
PDF
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schematic diagram offline UPS
Abstract: schematic diagram UPS schematic diagram 110v dc charger 220v AC to 110v AC transformer circuit diagram tr 220V Automatic Voltage Regulator schematic on line ups circuit schematic diagram step down transformer 220V to 12V 220V ac Automatic Voltage Regulator circuit ups circuit schematic diagram ups 220v 50hz circuit diagram
Text: UPS Controller CY8C0102/3 By: ENTEK Elektronik & Yazılım Ltd. Şti. Perpa Ticaret Merkezi A Blok Kat:5 No:120 Okmeydani-Istanbul/TURKEY Tel: +902123200743/ Fax :+902123200744 Cypress Disclaimer Please Note: Cypress MicroSystems guarantees that this chip conforms to CY8C26443-24PVI specifications and has
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Original
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CY8C0102/3
CY8C26443-24PVI
schematic diagram offline UPS
schematic diagram UPS
schematic diagram 110v dc charger
220v AC to 110v AC transformer circuit diagram tr
220V Automatic Voltage Regulator schematic
on line ups circuit schematic diagram
step down transformer 220V to 12V
220V ac Automatic Voltage Regulator circuit
ups circuit schematic diagram
ups 220v 50hz circuit diagram
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PDF
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BGA PROFILING
Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte
Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array
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Original
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J-STD-020.
AV02-0767EN
BGA PROFILING
pcb warpage* in smt reflow
thick bga die size
BGA PACKAGE thermal profile
bga thermal cycling reliability
fine BGA thermal profile
Avago cross
JEDEC SMT reflow profile
am-5534
BGA cte
|
PDF
|
ASTM-B16-85
Abstract: No abstract text available
Text: 1111687 36 PIN SSOP TO .6 DIP ADAPTER SPECIFICATIONS: • PCB is Black FR-4,.062 [1.56 or .094 [2.39] thick. • Pads are bare Copper protected with Entek by Enthone or Omikron® white tin to eliminate coplanarity concerns and solder bridges. • Male pin is Brass Alloy 360 1/2 hard per UNS C36000
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Original
|
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
ASTM-B16-85
|
PDF
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p0406fc
Abstract: P0406FCxxC Series
Text: 05155 P0406FC3.3C - P0406FC36C Only One Name Means ProTek’Tion 250w flip chip tvs array Description The P0406FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge ESD and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
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Original
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P0406FC3
P0406FC36C
P0406FCxxC
p0406fc
P0406FCxxC Series
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PDF
|
schematic diagram of ip camera
Abstract: CSP marking code CM1230-02 CM1230-08CP CM1230-J2CP CM1230-02CP cm1-23024
Text: CM1230 2, 4, and 8-Channel Low-Capacitance ESD Protection Array Product Description The CM1230 is a family of 2, 4 and 8 channel, very low capacitance ESD protection diode arrays in a CSP form factor. It is ideal for protecting systems with high data and clock rates or for circuits that
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Original
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CM1230
CM1230/D
schematic diagram of ip camera
CSP marking code
CM1230-02
CM1230-08CP
CM1230-J2CP
CM1230-02CP
cm1-23024
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PDF
|
Untitled
Abstract: No abstract text available
Text: CM1415 3 Channel Headset EMI Filter with ESD Protection Features Product Description • The CM1415 is a low-pass filter array integrating three pi-style filters C-R-C that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides
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Original
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CM1415
CM1415
178mm
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PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: CM1401-03 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB Features Product Description • The CM1401-03 is a multichannel array with four lowpass filter + ESD channels and four ESD-only channels. They reduce EMI/RFI emissions on a data port
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Original
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CM1401-03
CM1401-03
CSPEMI307A
178mm
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PDF
|
Untitled
Abstract: No abstract text available
Text: CM1424 MultiMedia Card EMI Filter Array with ESD Protection Features Product Description • The CM1424 is an EMI filter array integrating 3 pi-filters C-R-C and 2 channels of ESD protection. The CM1424 has component values of 12pF - 100Ω - 12pF. The parts include avalanche-type ESD diodes on every
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Original
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CM1424
CM1424
IEC61000-4-2
MILSTD-883
CM1424-01
178mm
CM1424-03
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PDF
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N223
Abstract: a5 marking
Text: CM1420, CM1422 LCD EMI Filter Array with ESD Protection Description The CM1420 and CM1422 are EMI filter arrays with ESD protection, which integrate six and eight Pi−filters C−R−C , respectively. The CM1420/22 has component values of 15 pF − 100 W − 15 pF. These devices include ESD protection diodes on every
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Original
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CM1420,
CM1422
CM1420
CM1420/22
MIL-STD-883
CM1420/D
N223
a5 marking
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PDF
|
CLASS 2500 VALVE PRESSURE CHART
Abstract: smc itv2000 itv2030 ITV003 4DSX ITV001 COMMON RAIL SOLENOID DIRECT INJECTION IITV20-02-3 ITV1000 ITV3000
Text: SMC REGULATOR Electro-pneumatic Regulator Electronic Vacuum Regulator ITV2000 Series Series Model ITV Regulating pressure range Port size Page F.R.L. AV Series ITV0000 With a simplified high-density circuit board design, an extremely compact size has been achieved.
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Original
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ITV2000
ITV0000
ITV001
ITV003
ITV005
ITV009
ITV1000
ITV101
ITV103
to-107
CLASS 2500 VALVE PRESSURE CHART
smc itv2000
itv2030
ITV003
4DSX
ITV001
COMMON RAIL SOLENOID DIRECT INJECTION
IITV20-02-3
ITV1000
ITV3000
|
PDF
|
SMC zse40
Abstract: ISE40 ZSE40 ZSE40F smc zse 40 SMC Pneumatics zse40 3M EMC Products SMC Pneumatics ZS-22-A Hitech Displays Sdn Bhd
Text: High Precision, Digital Pressure Switch Series ZSE40/ISE40 ZSE ISE PSE Z I SE3 PS Z I SE 12 ZSP ISA2 IS ZSM PF2 IF Data 16-2-15 Pressure → High speed response: 2.5 ms or less Momentary change With anti-chattering function Anti-chattering function
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Original
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ZSE40/ISE40
shippe-107
Jeddah-21471,
SMC zse40
ISE40
ZSE40
ZSE40F
smc zse 40
SMC Pneumatics zse40
3M EMC Products
SMC Pneumatics
ZS-22-A
Hitech Displays Sdn Bhd
|
PDF
|
p0404fc
Abstract: P0404FCxxC Series
Text: 05154 P0404FC3.3C - P0404FC36C Only One Name Means ProTek’Tion 250w flip chip tvs array Description The P0404FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge ESD and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
|
Original
|
P0404FC3
P0404FC36C
P0404FCxxC
p0404fc
P0404FCxxC Series
|
PDF
|
p0408fc
Abstract: P0408FCxxC Series
Text: 05156 P0408FC3.3C - P0408FC36C Only One Name Means ProTek’Tion 250w flip chip tvs array Description The P0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge ESD and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
|
Original
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P0408FC3
P0408FC36C
P0408FCxxC
p0408fc
P0408FCxxC Series
|
PDF
|
lc0404fc
Abstract: LC0404FCxxC Series
Text: 05157 LC0404FC3.3C - LC0404FC36C Only One Name Means ProTek’Tion 200W LOW CAPACITANCE flip chip tvs array Description The LC0404FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge ESD and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
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Original
|
LC0404FC3
LC0404FC36C
LC0404FCxxC
lc0404fc
LC0404FCxxC Series
|
PDF
|
lc0408fc
Abstract: LC0408FCxxC Series
Text: 05153 LC0408FC3.3C - LC0408FC36C Only One Name Means ProTek’Tion 200w low capacitance flip chip tvs array Description The LC0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge ESD and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
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Original
|
LC0408FC3
LC0408FC36C
LC0408FCxxC
lc0408fc
LC0408FCxxC Series
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 153 PART NO. SPECIFICATIONS BODY: BRASS, ENTEK CU-55 ANT I-TARNISH TREATMENT INSERT: NYLON TERMINAL: CRS, ELECTRO-TIN PLATING INSULATING WASHER: XXXP PAPER BASE PHENOLIC SPRINGS: NICKEL SILVER, GOLD PLATED GROUND CLIP: PHOSPHER BRONZE SPRING TEMP. -9/16 12 UNC-2A THD REF
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OCR Scan
|
CU-55
|
PDF
|
