ebonol
Abstract: 260-4TH5B 260-6SH5B ebonol c black "beryllium oxide" 260-6SH5 260-10SH5E 260-4TH5E 256-DM 260-6SH5E
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height Less Mounting Tab in. (mm) 0.190 (4.0) Standard P/N 256-DM ̆ 260 SERIES 256-DM Material Beryllium Copper Weight lbs. (grams) 0.0005 (0.23) Cup Clips for TO-5 Case Style Semiconductors
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256-DM
260-4T5E
260-4TH5E
260-6SH5E
260-10SH5E
260-4TH5B
260-6SH5B
260-10SH5B
ebonol
260-4TH5B
260-6SH5B
ebonol c black
"beryllium oxide"
260-6SH5
260-10SH5E
260-4TH5E
256-DM
260-6SH5E
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ebonol
Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
215CB
647-25ABP
217-36CT6
230-75AB-10
MO-169
205-CB
281-2AB
204CB
1134 sot dm
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ebonol
Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
260-4TH5B
ebonol c black
205cb
AB-275
204-CB
TUBE 1625
5 lead dd pak weight
260-6SH5B
205-CB
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ebonol
Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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O-220,
OT-223,
SOL-20
ebonol
217-36CT6
218-40CT3
218-40CT5
MO-169
204sb
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Wakefield Thermal Solutions TYPE 120
Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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ebonol
Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION
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N10015
Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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O-220,
OT-223,
SOL-20
292-AB
292-AB
N10015
218-40cte3
ebonol
outline of the heat sink for JEDEC
217-36CT6
MO-169
218-40CTE5
217-36CTTE6
unc screw
230-75ABE-01
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217-36CTT6
Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
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Original
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O-220,
OT-223,
SOL-20
217-36CTT6
ebonol
217-36CT6
230-75AB-10
MO-169
204-CB
260-6SH5B
215AP
627 Series
260-4T5
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ebonol
Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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Original
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O-220,
OT-223,
SOL-20
ebonol
abe sot-223
217-36CTRE6
217-36CT6
MO-169
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ebonol
Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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WTS001
p1-25
O-220,
OT-223,
SOL-20
ebonol
637-10ABEP
MO-169
217-36CT6
634-20ABEP
637-15ABEP
236-150ABE-01
abe sot-223
sot-223 package dimensions
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Untitled
Abstract: No abstract text available
Text: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
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Original
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WTS001
p1-25
O-220,
OT-223,
SOL-20
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transistor cross reference
Abstract: MPT3N40 Westinghouse SCR handbook LT 8224 ZENER DIODE sje389 N9602N npn transistor RCA 467 TFK 7 segment displays PUT 2N6027 delco 466
Text: C K TBD DOLLY LIST LOGO LIST SAFETY & RELIABLTY TEK PN SYSTEM II DIGITAL IC's MEMORIES. MOS. CM OS.ECL. TTL MICROPROCESSOR SPECIAL FUNCTION IC's DIGITAL / LINEAR ARRAYS LINEAR IC'S (PURCH) TEK-MADE IC’s 3 IC's INDEX (COLORED PGS) INCL PRGMD. SCRND.ETC
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EATON CM20A
Abstract: A5 GNE mosfet Hall sensor 44e 402 2N8491 FTG 1087 S TRIAC BCR 10km FEB3T smd transistor marking 352a sharp EIA 577 sharp color tv schematic diagram MP-130 M mh-ce 10268
Text: Table of Contents N E W A R K E L E C T R O N IC S “Where serving you begins even before you call” Newark Electronics is a UNIQUE broadline distributor of electronic components, dedicated to provid ing complete service, fast delivery and in-depth inventory. Our main
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thyristor TAG 8506
Abstract: nais inverter vf 7f operation manual 922AA1Y-A4P optek A400 817 Sprague 513D sprague 926c Sprague 195P Rapa relay 12vdc triac tag 8948 Mascot 719
Text: TABLE OF CONTENTS Catalog Number 11Q New For 1989! • Over 7,900 New Products • 13 New M anufacturers PRODUCT INDICES tiamp*,'fminei forskSockets ' Solder Equipment endTtfob ] vriHp\< lint Equipment, Panel Meters, Aejulpmant, i A P R E M IE R C o m p an y
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11PM104
thyristor TAG 8506
nais inverter vf 7f operation manual
922AA1Y-A4P
optek A400 817
Sprague 513D
sprague 926c
Sprague 195P
Rapa relay 12vdc
triac tag 8948
Mascot 719
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