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Eaton Bussmann CS-SP-3-200-333MV 200A CT
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CS-SP-3-200-333MV	Bulk			1	1 $176.5 10 $176.5 100 $176.5 1000 $176.5 10000 $176.5	Buy Now
Sager	CS-SP-3-200-333MV					1 - 10 - 100 - 1000 - 10000 -	Buy Now
Eaton Corporation CS-SP-3-200-333MV Current Transformer Split Core 333mV 200A - Bulk (Alt: CS-SP-3-200-333MV)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	CS-SP-3-200-333MV	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Mouser Electronics	CS-SP-3-200-333MV					1 $165.8 10 $158.03 100 $155.29 1000 $155.29 10000 $155.29	Get Quote
Eaton Cutler-Hammer CS-SP-3-100-333MV (ALTERNATE: CS-SP-3-100-333MV) SPLIT CORE CS 100A / 333MV, 0.50% ACCURACY, 0.75" X 0.93 \| Eaton - Cutler Hammer CS-SP-3-100-333MV
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CS-SP-3-100-333MV (ALTERNATE: CS-SP-3-100-333MV)	Bulk		5 Weeks	1	1 $165.9 10 $165.9 100 $165.9 1000 $165.9 10000 $165.9	Get Quote
Eaton Cutler-Hammer CS-SP-3-060-333MV (ALTERNATE: CS-SP-3-060-333MV) SPLIT CORE CS 60A / 333MV, 0.75% ACCURACY, 0.75" X 0.93 \| Eaton - Cutler Hammer CS-SP-3-060-333MV
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CS-SP-3-060-333MV (ALTERNATE: CS-SP-3-060-333MV)	Bulk		5 Weeks	1	1 $173.02 10 $173.02 100 $173.02 1000 $173.02 10000 $173.02	Get Quote
Eaton Cutler-Hammer CS-SP-3-300-333MV (ALTERNATE: CS-SP-3-300-333MV) SPLIT CORE CS 300A / 333MV, 0.5% ACCURACY, 0.75" X 0.93 \| Eaton - Cutler Hammer CS-SP-3-300-333MV
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	CS-SP-3-300-333MV (ALTERNATE: CS-SP-3-300-333MV)	Bulk		5 Weeks	1	1 $164.77 10 $164.77 100 $164.77 1000 $164.77 10000 $164.77	Get Quote

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CSSP3 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
FR4 substrat Abstract: CSSP1 fr4+substrate+1.6mm Text: Direct Link 1096 Products & Technologies Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei	Original	PDF
china mobile phone circuit diagram Abstract: gsm signal amplifier circuit diagram GSM module circuit diagram circuit diagram transceiver signal gsm GSM transceiver WCDMA duplexer D2027 mobile phone schematic diagram gsm switch epcos gsm module datasheet Text: Direct Link 1092 Applications & Cases RF modules for multimode multi-band mobile phones October 2007 Front-end solutions for world phones RF filter modules for GSM/WCDMA mobile phones must be highly integrated for worldwide use in all frequency bands. EPCOS supplies	Original	PDF
FR4 substrat Abstract: fr4+substrate+1.6mm Text: Gehäusetechnologien für SAW-Produkte Januar 2008 Harte Schalen Da SAW-Bauelemente bei der Verarbeitung zu Modulen Drücke von bis zu 100 bar aushalten müssen, sind neue Gehäusetechnologien erforderlich. Damit sich die Oberflächenwellen in SAW-Bauelementen störungsfrei	Original	PDF
epcos ltcc Abstract: No abstract text available Text: Direct Link 0917 Applications & Cases SAW-Komponenten April 2004 Klein und fein Surface-Acoustic-Wave-Komponenten sind dank ihrer hervorragenden Filtereigenschaften Schlüsselbauelemente der gesamten drahtlosen Kommunikation. Die Miniaturisierung, die sie im Laufe der	Original	PDF
UMTS frontend Abstract: GPS saw-filter B7837 B9501 d1015 Text: Direct Link 0933 Applications & Cases SAW-Komponenten Januar 2005 Gut verpackte Funktionen Die heutigen Mobiltelefone sind klein, leicht und multifunktional. Mit der dritten Generation des Mobilfunks entwickelt sich das herkömmliche Handy zu einem schnurlosen Multimedia-Terminal. High-End-Geräte werden	Original	PDF	D1015 UMTS frontend GPS saw-filter B7837 B9501
piezoelectric film for power generation Abstract: HTCC cavity duplexer EPCOS SAW Filters Text: Direct Link 0917 Applications & Cases SAW components April 2004 Tiny and sophisticated Outstanding filter properties make surface acoustic wave components indispensable throughout wireless communications. The miniaturization that they have undergone in recent years has only been made possible	Original	PDF
A00B Abstract: designing with the MC68008 Z80B AM8088 8-Bit Microprocessors CS8259 am8259 reset circuit in MC68008 AM8018 MK68590 Text: Advanced Micro Devices Interfacing the Am79C90 C-LANCE to 8-Bit Microprocessors Application Note TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1	Original	PDF	Am79C90 HLDA7990 CS7990 A00B designing with the MC68008 Z80B AM8088 8-Bit Microprocessors CS8259 am8259 reset circuit in MC68008 AM8018 MK68590
piezoelectric film for power generation Abstract: two cavity resonator cavity duplexer epcos ltcc nickel corrosion electroplating Text: Direct Link 1096 Products & Technologies Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate	Original	PDF
Qualcomm RTR6285 Abstract: RTR6285 Qualcomm RF LTE chipsets QUALCOMM LTE B8757 LV92A Qualcomm RTR6285 TD-scdma qualcomm chipsets b945 B9444 Text: SAW DEVICE SELECTION TABLE for Application in Mobile Communication Cellular Phone, Cordless Phone, GPS, WLAN, Bluetooth Content Page RF Filters for Cellular Phones Xin1 RF Filters for Cellular Phones Duplexers for Cellular Phones IF Filters for GSM Cellular Phones	Original	PDF	QCC12C QCC10B 250Ohm 200Ohm 50Ohm Qualcomm RTR6285 RTR6285 Qualcomm RF LTE chipsets QUALCOMM LTE B8757 LV92A Qualcomm RTR6285 TD-scdma qualcomm chipsets b945 B9444
FR4 substrate height and thickness Abstract: FR4 substrate HTCC Pressure lithium tantalate LTCC Substrate Duplexers epcos SAW ltcc CSSP3 nickel corrosion electroplating Text: Packaging technologies for SAW products January 2008 Hard shells During processing into modules, SAW components must withstand pressures of up to 100 bar, which requires new packaging technologies. To allow the surface acoustic waves in SAW components to propagate	Original	PDF
active and passive electronic components Abstract: gsm crosstalk epcos ltcc EPCOS SAW Filters B7837 B9501 LTCC D1015 UMTS transceiver ltcc chip Text: Direct Link 0933 Applications & Cases SAW components January 2005 Functionality package Compact, light and multifunctional, third-generation mobile phones are veritable wireless multimedia terminals. Today's high-end handsets integrate not only a PDA, digital camera and Bluetooth interface, but	Original	PDF	D1015 active and passive electronic components gsm crosstalk epcos ltcc EPCOS SAW Filters B7837 B9501 LTCC UMTS transceiver ltcc chip
UMTS frontend Abstract: Gunter D2027 GSM LNA BAND III EPCOS GSM Transceiver transceiver gsm wcdma frontend WCDMA TRANSCEIVER GSM-1900 Text: Direct Link 1092 Applications & Cases HF-Module für Multimode-Multiband-Mobiltelefone Oktober 2007 Frontend-Lösungen für Alleskönner HF-Filter-Baugruppen für GSM/WCDMA-Mobiltelefone müssen für den weltweiten Einsatz hochintegriert sein, um alle Frequenzbänder bedienen zu	Original	PDF
MC88100 Abstract: MC88200 ctp21 CTP01 MC88204 Text: 4. 1 U * ÌÌ MOTOROLA Order this document by MC88204/D • SEMICONDUCTOR TECHNICAL DATA Technical Sum m ary 64K-Byte Cache/Memory Management Unit CMMU The MC88204 CMMU is a high-performance, HCMOS VLSI device providing zero-wait-state memory management and data caching. The m emory management unit (MMU) efficiently	OCR Scan	PDF	MC88204/D 64K-Byte MC88204 56-entry, MK145BP A26875 MC88100 MC88200 ctp21 CTP01