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    Text: PROCESS CPZ37R Transient Voltage Suppressor 12 Volt TVS Chip PROCESS DETAILS Die Size 6.7 x 6.7 MILS Die Thickness 3.54 MILS Anode Bonding Pad Area 4.3 x 4.3 MILS Top Side Metalization Al - 13,000Å Back Side Metalization Au-As/Ag - 13,000Å/6,000Å GEOMETRY


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    PDF CPZ37R CTLTVS12 16-March