C505C
Abstract: KABEL KOMPLETT STK 641 DS301 stk 402 STK IC MM-214
Text: CANopen-Chip System-Manual Ausgabe Februar 2001 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG CANopen-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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L-315d
L-370d
D-55135
C505C
KABEL KOMPLETT
STK 641
DS301
stk 402
STK IC
MM-214
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STK 641
Abstract: C505C DS301 STK IC dipsw_4 CIA DSP 402 STK 6
Text: CANopen-Chip System-Manual Ausgabe Februar 2000 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG CANopen-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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L-370d
D-55135
STK 641
C505C
DS301
STK IC
dipsw_4
CIA DSP 402
STK 6
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78L05TO-92
Abstract: 74XX574 IEC1131-3 74xx138 C505C C540U C541U DO15 IEC1131-SPS-Chip sps_chip
Text: Systemhandbuch IEC1131-SPS-Chip Kurzübersicht Ausgabe März 1999 Ein Produkt eines Unternehmens der PHYTEC Technologie Holding AG IEC1131-SPS-Chip Im Buch verwendete Bezeichnungen für Erzeugnisse, die zugleich ein eingetragenes Warenzeichen darstellen, wurden nicht besonders gekennzeichnet. Das
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IEC1131-SPS-Chip
L-417d
D-55135
78L05TO-92
74XX574
IEC1131-3
74xx138
C505C
C540U
C541U
DO15
IEC1131-SPS-Chip
sps_chip
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
slis089
THMC10DBQR
SSYA008
SZZA017A
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inductive proximity sensor transistor schematic
Abstract: DD 127 D TRANSISTOR SMBus programmable
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
inductive proximity sensor transistor schematic
DD 127 D TRANSISTOR
SMBus programmable
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
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PDF
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 − DECEMBER 1999 D Two-Wire SMBus Serial Interface D On-Chip and External Diode-Connected D D D D D Transistor Temperature Monitoring − ±2.5°C Accuracy for On-Die − ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
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PDF
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Untitled
Abstract: No abstract text available
Text: THMC10 REMOTE/LOCAL TEMPERATURE MONITOR WITH SMBus INTERFACE SLIS089 – DECEMBER 1999 D D D D D D D Two-Wire SMBus Serial Interface On-Chip and External Diode-Connected Transistor Temperature Monitoring – ±2.5°C Accuracy for On-Die – ±3°C Accuracy for External
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THMC10
SLIS089
THMC10
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SM 6185
Abstract: MSA0886 MSA-1104 200 mil BeO package GHZ micro-X Package INA-52063 msa-0504 MSA-0670 INA-01100 sot 326
Text: RFIC and MMIC Amplifiers Selection Guides Fixed Gain RFIC Amplifiers in order from lowest to highest frequency Part Number Type MSA-2111 MSA-3111 MSA-3135 MSA-3185 MSA-3186 INA-01100 INA-01170 HPMX-3002 INA-02100 INA-02170 INA-02184 INA-02186 MSA-0600 MSA-0611
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MSA-2111
MSA-3111
MSA-3135
MSA-3185
MSA-3186
INA-01100
INA-01170
HPMX-3002
INA-02100
INA-02170
SM 6185
MSA0886
MSA-1104
200 mil BeO package
GHZ micro-X Package
INA-52063
msa-0504
MSA-0670
INA-01100
sot 326
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Untitled
Abstract: No abstract text available
Text: NBB-500 NBB-500Cascadable Broadband GaAs MMIC Amplifier DC to 4GHz CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz RoHS Compliant & Pb-Free Product Package Style: Micro-X, 4-Pin, Ceramic Features GENERAL PURPOSE AMPLIFIERS LNAs, HPAs, LINEAR AMPS
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NBB-500
NBB-500Cascadable
2002/95/EC
DS070123
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integrated circuits equivalents list
Abstract: digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic
Text: HPND-0002 Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Data Sheet Description Features These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization
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HPND-0002
5965-9143E
AV01-0640EN
integrated circuits equivalents list
digital phase shifters
HPND-0002
hydrofluoric acid
HPND0002
HSMP3810
5965-9143E
eutectic
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hydrofluoric acid
Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression
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HPND-0001
HPND-0002
HPND-000X
5965-9143E
hydrofluoric acid
thermocompression
HPND0001
HPND-0001
HPND-0002
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tms 374 chip
Abstract: MSA-0200 MSA-0200-GP4
Text: Cascadable Silicon Bipolar MMIC␣ Amplifier Technical Data MSA-0200 Features • Cascadable 50 Ω Gain Block • 3 dB Bandwidth: DC to 2.8 GHz • 12.0 dB Typical Gain at 1.0␣ GHz • Unconditionally Stable k>1 The MSA-series is fabricated using HP’s 10 GHz fT, 25␣ GHz f MAX,
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MSA-0200
MSA-0200
tms 374 chip
MSA-0200-GP4
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hp 3080 diode
Abstract: No abstract text available
Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression
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HPND-0001
HPND-0002
HPND-000X
5965-9143E
hp 3080 diode
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Untitled
Abstract: No abstract text available
Text: 8.5-11.0 GHz GaAs MMIC Power Amplifier Velocium Products 18 - 20 GHz HPA - APH478 P1014 November 2006 - Rev 01-Nov-06 Features XP1006 Driver Amplifier 18.0 dB Small Signal Gain +31.0 dBm Saturated Output Power 35% Power Added Efficiency On-chip Gate Bias Circuit
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APH478
P1014
01-Nov-06
XP1006
MIL-STD-883
XP1014
I0005129
XP1014-BD-000W
XP1014-BD-000V
XP1014-BD-EV1
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PT 2102 ic
Abstract: HXTR-41Q1 HXTR-4101TXV 2N6679 HPAC-70GT HXTR-2101 HXTR-4101 hxtr-6105 6105tx BV EI 302 2003
Text: H E W L E T T - P A C K A R D n CMPNTS EOE D £3 44475Û4 m General Purpose Transistors HXTR-2001 Chip Technical Data Features ^ k laert ; LJ Generic Chip HXTR-2001 Recommended Die Attach and Bonding Procedures Eutectic Die Attach at a stage temperature of 410 ± 10°C under
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HXTR-2001
2N6679,
HXTR-2101,
HXTR-2102,
HXTR-4101,
HXTR-6105,
HXTR-6106,
HXTR-6106
MIL-S-19500,
PT 2102 ic
HXTR-41Q1
HXTR-4101TXV
2N6679
HPAC-70GT
HXTR-2101
HXTR-4101
hxtr-6105
6105tx
BV EI 302 2003
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Untitled
Abstract: No abstract text available
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C HV7022DJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022-C
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
44-lead
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HV09
Abstract: No abstract text available
Text: H V09 Lji Supertex inc. Product Objective Specification 32-Channel Symmetric Row Drivers Ordering Information Package Options * Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 - Lead Ceramic J-Bend MIL-STD-883 Processed"
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OCR Scan
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32-Channel
HV0923DJ
HV0923PJ
HV0923X
MIL-STD-883
RBHV0923DJ
HV0923
200mA
44-lead
V09Function
HV09
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ARSA
Abstract: 2C3741 2C3767
Text: 4-A PNP Power Transistor Chips 2C3741 FEATURES CHIP TYPE: AP • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 30,000 A Nominal Collector - Gold - 3,000 A Nominal • Die Thickness - 10 Mils Nominal • Complement to NPN 2C3767
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2C3741
2C3767
350/is.
0000e!
ARSA
2C3741
2C3767
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Untitled
Abstract: No abstract text available
Text: MPY100 B U R R -B R O W N * E 1 MI L I TARY & DIE VERSIONS AVAILABLE MULTIPLIER-DIVIDER FEATURES A P P LIC A T IO N S LOW COST DIFFERENTIAL INPUT ACCURACY 100% TESTED AND GUARANTEED NO EXTERNAL TRIMMING REQUIRED LOW NOISE 90pV. rmi, 10Hz I* 10kHz HIGHLY RELIABLE ONE-CHIP DESIGN
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MPY100
10kHz
T0-100
ANAL06
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PDF
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Untitled
Abstract: No abstract text available
Text: HEWLETT-PACKARD/ CMPNTS blE D • 44475A4 aaiOElb TTT IH HPA MGA-66100 2-6 GHz Cascadable GaAs MMIC Amplifier HEWLETT PACKARD Chip Outline Features • Cascadable 50 a Gain Block • Broadband Performance: 2-6 GHz 12.5 dB Typical Gain ±1.0 dB Gain Flatness
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44475A4
MGA-66100
MGA-66100
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PDF
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Untitled
Abstract: No abstract text available
Text: 1.4 GBd Transmitter/Receiver Chip Set with CIMT Encoder/Decoder and Variable Data Rate Preliminary Technical Data March 29,1999 Rev 1.23 All Sperifîcaâons Subject to Change without Notice For more information call (408) 435-6455 or email [email protected]
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HDMP-1032
HDMP-1034
PASS15*
TXC12]
4447SA4
Q021bD3
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PDF
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Untitled
Abstract: No abstract text available
Text: What H E W L E T T * mLliM PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features D escription • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization
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OCR Scan
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HPND-0001
HPND-0002
HPND-000X
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PDF
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Untitled
Abstract: No abstract text available
Text: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid
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OCR Scan
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HPND-0001
HPND-0002
HPND-000X
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PDF
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