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    CHIP DIE Search Results

    CHIP DIE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CHIP DIE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling This chip is used for: • IGBT-Modules G Applications: • drives Chip Type VCE ICn Die Size Package SIGC42T60SNC


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    SIGC42T60SNC Q67050-A4181A001 Q67050-A4181A002 7272-S, PDF

    code CFK

    Abstract: HP41952A 40mhz ceramic FILTER
    Text: Cal-Chip Electronics, Incorporated CFK SERIES Multi-layer Chip EMI Suppression Filter OUTLINE • Cal-Chip’s multi-layer chip EMI suppression filter is suitable as a noise filter counteracting personal computer and other highspeed digital signal line noise. Dielectric material and ferrite


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    106kPa code CFK HP41952A 40mhz ceramic FILTER PDF

    SIGC42T60SNC

    Abstract: 7272-S
    Text: SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling This chip is used for: • IGBT-Modules G Applications: • drives Chip Type VCE ICn Die Size Package SIGC42T60SNC


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    SIGC42T60SNC Q67050-A4181A001 Q67050-A4181A002 7272-S, SIGC42T60SNC 7272-S PDF

    SIGC42T60SNC

    Abstract: A001 BSM50GD60DLCE3226
    Text: Preliminary SIGC42T60SNC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE This chip is used for: • IGBT-Modules G Applications: • drives ICn Die Size


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    SIGC42T60SNC Q67050-A4181sawn Q67050-A4181unsawn 7272-S, SIGC42T60SNC A001 BSM50GD60DLCE3226 PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size


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    SIGC07T60NC Q67050-A4134A001 7212-M, PDF

    BUP213

    Abstract: SIGC25T120C
    Text: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size


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    SIGC25T120C C67078-A4674A001 7141-M, BUP213 SIGC25T120C PDF

    bup213

    Abstract: BUP21
    Text: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size


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    SIGC25T120C C67078-A4674A001 14ypes 7141-M, bup213 BUP21 PDF

    SIGC07T60NC

    Abstract: No abstract text available
    Text: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size


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    SIGC07T60NC Q67050-A4134A001 7212-M, SIGC07T60NC PDF

    SIGC07T60NC

    Abstract: No abstract text available
    Text: SIGC07T60NC IGBT Chip in NPT-technology C FEATURES: • 600V NPT technology • 100µm chip • positive temperature coefficient • easy paralleling Chip Type VCE SIGC07T60NC 600V This chip is used for: • IGBT-Modules G Applications: • drives ICn 6A Die Size


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    SIGC07T60NC Q67050-A4134A001 7212-M, SIGC07T60NC PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC25T120C IGBT Chip in NPT-technology FEATURES: • 1200V NPT technology • 200µm chip • positive temperature coefficient • easy paralleling This chip is used for: • BUP 213 C Applications: • drives Chip Type SIGC25T120C VCE ICn 1200V 15A G Die Size


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    SIGC25T120C C67078-A4674A001 7141-M, PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 Microwave Components Isolators Chip Multilayer Hybrid Couplers Field-Effect Transistors MESFET Chip Multilayer Antennas Chip Dielectric Antennas Dielectric Resonators (RESOMICS ) High-Frequency Monolithic Ceramic Capacitors High-Frequency Microchip Capacitors


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    PDF

    CR32 Resistor

    Abstract: CR10 resistor CR32 kyocera marking code r010 surface mount diode cr21 resistor 100k resistor network 0.25w resistor 1/4 diode 400V 4A cr21 kyocera 1K Ohm resistor 1/8W
    Text: chip resistors • chip resistor arrays • chip resistor networks Chip Resistors Thick Film Chip Resistors CR05/CR10/CR21/CR32 Series . 3-4 CR63 .5


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    CR05/CR10/CR21/CR32 FR10/FR21/FR32 CR32 Resistor CR10 resistor CR32 kyocera marking code r010 surface mount diode cr21 resistor 100k resistor network 0.25w resistor 1/4 diode 400V 4A cr21 kyocera 1K Ohm resistor 1/8W PDF

    CR32 kyocera

    Abstract: resistor kyocera CR10J CR32 avx crc avx CR32 Resistor CRB2 kyocera cr resistor CR32 resistor kyocera 102
    Text: KYOCERA Chip Resistors • Chip Resistor Arrays • Chip Resistor Networks Chip Resistors Thick Film Chip Resistors CR05/CR10/CR21/CR32 Series .1-2 CR63 Series .3


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    CR05/CR10/CR21/CR32 LR32/50 FR10/FR21/FR32 AP-CRAN39810M-C CR32 kyocera resistor kyocera CR10J CR32 avx crc avx CR32 Resistor CRB2 kyocera cr resistor CR32 resistor kyocera 102 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8-BIT SINGLE CHIP MICROCONTROLLER Under Development LC868B64A/48A/32A LC868B64A 8-bit single chip microcontroller with on chip 64K-byte ROM and on chip 1.5K -byte RAM LC868B48A 8-bit single chip microcontroller with on chip 48K-byte ROM and on chip 1.5K -byte RAM


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    LC868B64A/48A/32A LC868B64A 64K-byte LC868B48A 48K-byte LC868B32A 32K-byte LC868B64A/48A/32A 100pF 220pF PDF

    Untitled

    Abstract: No abstract text available
    Text: rev.2.0 08.05.15 DUV325-CHIP • • • • • Deep Ultraviolet Light Emission Source 325 nm, 1.5 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV325-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different


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    DUV325-CHIP DUV325-CHIP PDF

    Untitled

    Abstract: No abstract text available
    Text: rev.2.0 07.05.15 DUV310-CHIP • • • • • Deep Ultraviolet Light Emission Source 310 nm, 1.6 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV310-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different


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    DUV310-CHIP DUV310-CHIP PDF

    10 micro farad 16V capacitor

    Abstract: capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V lt 6249 3 pf Silver Dipped Mica Capacitor capacitor 10nf surface mount 1812 ceramic capacitor 100nF 104 CAP 100nF 50V 0603 2.2nf 2000v
    Text: AVX Multilayer Ceramic Chip Capacitor Ceramic Chip Capacitors Table of Contents MLC Chip Capacitors General Description How to Order - AVX Part Number Explanation C0G NP0 Dielectric General Specifications Typical Characteristic Curves Capacitance Range X7R Dielectric


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    MIL-C-55681/Chips S-MCC35M298-C 10 micro farad 16V capacitor capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V lt 6249 3 pf Silver Dipped Mica Capacitor capacitor 10nf surface mount 1812 ceramic capacitor 100nF 104 CAP 100nF 50V 0603 2.2nf 2000v PDF

    Untitled

    Abstract: No abstract text available
    Text: rev.2.0 07.05.15 DUV265-CHIP • • • • • Deep Ultraviolet Light Emission Source 265 nm, 0.9 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV265-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different


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    DUV265-CHIP DUV265-CHIP 100uring PDF

    Untitled

    Abstract: No abstract text available
    Text: rev.2.0 08.05.15 DUV280-CHIP • • • • • Deep Ultraviolet Light Emission Source 280 nm, 2.0 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV280-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different


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    DUV280-CHIP DUV280-CHIP 100uring PDF

    Untitled

    Abstract: No abstract text available
    Text: rev.2.0 08.05.15 DUV340-CHIP • • • • • Deep Ultraviolet Light Emission Source 340 nm, 1.5 mW Naked Bare Die Flip chip type Beam angle 144 deg. Description DUV340-CHIP is an AlGaN based DEEP-UV LED emission source, that is available as bare chip die, and in two different


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    DUV340-CHIP DUV340-CHIP PDF

    chip antennas

    Abstract: MMC Electronics America Mitsubishi Materials Antenna AHD1403 AHD1403-244ST25 surface mount bluetooth antenna
    Text: Surface Mountable Dielectric Chip Antennas AHD1403-244ST Series Surface Mountable Dielectric Chip Antennas AHD1403-244ST Series 1. Features We have developed high performance dielectric chip antennas suitable for mobile information devices, especially suitable for BluetoothTM. They


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    AHD1403-244ST AHD1403-244ST01 AHD1206-244ST01 APD1008-244ST01 APD1512-244ST02 APD1512-244ST01 Mar-2001 chip antennas MMC Electronics America Mitsubishi Materials Antenna AHD1403 AHD1403-244ST25 surface mount bluetooth antenna PDF

    Untitled

    Abstract: No abstract text available
    Text: Microwave Components Isolators Chip Multilayer Hybrid Couplers Chip Multilayer Hybrid Baiuns Field-Effect Transistors MESFET Chip Multilayer Antennas Chip Dielectric Antennas Dielectric Resonators (RESOMICS ) High-Frequency Monolithic Ceramic Capacitors


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    Untitled

    Abstract: No abstract text available
    Text: GPP CHIP GPP DIE CONSTRUCTION SMX CROSS SECTION 4/98 MOLDING COMPOUND CHIP


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    chips F8680

    Abstract: F8680A crt terminal interfacing in 8086 F8680 support chips of 8086 TL08 015 s79 SPDT switch MR25 resistor 22 NEB 063 T32 Chips and Technologies
    Text: Product Overview • F8680A PC/CHIP F8680A PC/CHIP Product Overview A mie single-chip PC, the F8680A PC/CHIP™ features die SuperState R management system, low power consumption, high performance, direct support of PCMCIA 2.0 memory and I/O cards, and flexible memory support


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    F8680A theF8680A 160-Pin chips F8680 crt terminal interfacing in 8086 F8680 support chips of 8086 TL08 015 s79 SPDT switch MR25 resistor 22 NEB 063 T32 Chips and Technologies PDF