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    CERAMIC LEADLESS CHIP CARRIER LCC 52 SOCKET Search Results

    CERAMIC LEADLESS CHIP CARRIER LCC 52 SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CERAMIC LEADLESS CHIP CARRIER LCC 52 SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 dimensions CERAMIC CHIP CARRIER LCC 68 socket LCC068 LCC124 LCC084 CERAMIC LEADLESS CHIP CARRIER LCC 52 sA 673 transistor
    Text: Request / Informations diverses : [email protected] Sales / Ventes : [email protected] HOME PRODUCT SALE DSMI Electronics SA DSMI acquires Precicontact SA assets All the standard products are available as ROHS compliant and as non ROHS upon request


    Original     		MIL-STD-1344, CERAMIC CHIP CARRIER LCC 68 socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 dimensions CERAMIC CHIP CARRIER LCC 68 socket LCC068 LCC124 LCC084 CERAMIC LEADLESS CHIP CARRIER LCC 52 sA 673 transistor PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package PDF

    i87C51

    Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
    Text: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30


    Original     		AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 87C51 i87C51 i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614 PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817 PDF

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 26-Mar-02 PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 52 socket

    Abstract: VSM85 VSM85, 86, 87, 88, 89 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 03-Jan-03 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket VSM85 VSM85, 86, 87, 88, 89 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PDF

    lcc 44 socket

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 21-Jun-01 lcc 44 socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 52

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket lcc 28 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 08-Mar-05 CERAMIC LEADLESS CHIP CARRIER LCC 52 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket lcc 28 socket PDF

    VSM85

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 08-Apr-05 VSM85 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 52 socket

    Abstract: VSM85
    Text: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product


    Original     		VSM85, VSM86, VSM87, VSM88 VSM89 18-Jul-08 CERAMIC LEADLESS CHIP CARRIER LCC 52 socket VSM85 PDF

    AD9020

    Abstract: AD9020JE AD9020JZ AD9020KE AD9020KZ AD708 equivalent
    Text: a FEATURES Monolithic 10-Bit/60 MSPS Converter TTL Outputs Bipolar ؎1.75 V Analog Input 56 dB SNR @ 2.3 MHz Input Low (45 pF) Input Capacitance MIL-STD-883-Compliant Versions Available 10-Bit 60 MSPS A/D Converter AD9020 FUNCTIONAL BLOCK DIAGRAM 61 59 MSB


    Original     		10-Bit/60 MIL-STD-883-Compliant 10-Bit AD9020 AD9020 AD9020JE AD9020JZ AD9020KE AD9020KZ AD708 equivalent PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 68 pad

    Abstract: No abstract text available
    Text: BACK a FEATURES Monolithic 10-Bit/60 MSPS Converter TTL Outputs Bipolar ؎1.75 V Analog Input 56 dB SNR @ 2.3 MHz Input Low (45 pF) Input Capacitance MIL-STD-883 Compliant Versions Available APPLICATIONS Digital Oscilloscopes Medical Imaging Professional Video


    Original     		10-Bit/60 MIL-STD-883 10-Bit AD9020 C1348b AD9020/PCB AD9617 AD9713, 12-bit AD9020 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PDF

    AD9020

    Abstract: AD9020JE AD9020JZ AD9020KE AD9020KZ Short range radar sensor
    Text: a FEATURES Monolithic 10-Bit/60 MSPS Converter TTL Outputs Bipolar ؎1.75 V Analog Input 56 dB SNR @ 2.3 MHz Input Low (45 pF) Input Capacitance MIL-STD-883-Compliant Versions Available APPLICATIONS Digital Oscilloscopes Medical Imaging Professional Video


    Original     		10-Bit/60 MIL-STD-883-Compliant 10-Bit AD9020 AD9020 AD9020JE AD9020JZ AD9020KE AD9020KZ Short range radar sensor PDF

    ultrasound air sensor

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 64 CERAMIC LEADLESS CHIP CARRIER LCC circuit diagram of 7432 how dsp is used in radar logic diagram of 7432 ttl 7432 ultrasound block diagram ccd wiring Circuit Schematic Diagram Electronic pin diagram of 7432
    Text: a FEATURES Monolithic 10-Bit/60 MSPS Converter TTL Outputs Bipolar ؎1.75 V Analog Input 56 dB SNR @ 2.3 MHz Input Low (45 pF) Input Capacitance MIL-STD-883 Compliant Versions Available APPLICATIONS Digital Oscilloscopes Medical Imaging Professional Video


    Original     		10-Bit/60 MIL-STD-883 10-Bit AD9020 AD9020 AD9617 AD9020/PCB 68-Terminal ultrasound air sensor CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 64 CERAMIC LEADLESS CHIP CARRIER LCC circuit diagram of 7432 how dsp is used in radar logic diagram of 7432 ttl 7432 ultrasound block diagram ccd wiring Circuit Schematic Diagram Electronic pin diagram of 7432 PDF

    Untitled

    Abstract: No abstract text available
    Text: VITESSE FEATURES • Serial Data Rates up to 1.25 Gb/s • Parallel Data Rates up to 155 Mb/s • ECL 100K Compatible Parallel Data I/Os • Divide-by-8 Clock for Synchronization of Par­ allel Data to Interfacing Chips • SONET Frame Recovery Circuitry VS8012


    OCR Scan     		VS8012) STS-24 52-pin VS8011 VS8012 VS8061 16-bit VS8062 VS80XX PDF

    Untitled

    Abstract: No abstract text available
    Text: WTL 2516/2516A/2516B/2516C PARALLEL ARRAY MULTIPLIER PRELIMINARY DATA APRIL, 1986 Features SELECTABLE O U TPU T M ODE 16 x 16 PA R A LLEL ARRAY M U LTIPLIER O utput latch m ode selectable for clocked or transpar­ ent operation LOW P O W E R k C M O g ^ IT H T T L C O M PA TIB LE I/O


    OCR Scan     		2516/2516A/2516B/2516C 2516C MPY16K PDF

    AAAC

    Abstract: No abstract text available
    Text: Philips Semiconductors-Signetlcs FAST TTL Logic Series Surface Mounted ICs SECTION 7 INTRODUCTION Easier Board Rework Economic survival is driving the electronics industry to use cheaper, faster, more reliable and more dense systems and components. Assembly technologies, such as SMD


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LPR520/521 ht vu t -, iNi u h K jh a ii h FEATURES DESCRIPTION □ Fou r 16-bit R egisters □ Im plem ents D ouble 2-Stage Pipe­ line or Sin g le 4-Stage P ipeline Register □ H old, Shift, and Load Instructions □ Separate D ata In and Data O ut Pins


    OCR Scan     		LPR520/521 16-bit LPR520 LPR521 T29FCT520/ IDT29FCT521 Am29521 LPR521PC25 PDF

    Untitled

    Abstract: No abstract text available
    Text: SPT SPT9687 SIGNAL PROCESSING TECHNOLOGIES DUAL ULTRA FAST VOLTAGE COMPARATOR APPLICATIONS FEATURES • • • • • Propagation Delay <2.3 ns Propagation Delay Skew <300 ps 300 MHz Minimum Tracking Bandwidth Low Offset ±3 mV Low Feedthrough and Crosstalk


    OCR Scan     		SPT9687 SPT9687 AD9687. PDF

    l29c520pc

    Abstract: No abstract text available
    Text: LOGIC D E V I CE S 40E » INC WM S S b S T G S 0 G 0 1 50 4 LQ Q ÊQ L 29C 520/521 4 d e v ic e s in c o r p o r a t e d x 8' bit Multilevel Pipeline Register DESCRIPTION FEATURES □ Four 8-bit Registers □ Im plem ents Double 2-Stage Pipe­ line or Single 4-Stage Pipeline


    OCR Scan     		L29C520 08/05/91-LD 28-pin 44-pin 08/05/91-LDS RBP-01 OOQ1S44 l29c520pc PDF

    M27C4096

    Abstract: Am27C4096
    Text: FINAL a Advanced Micro Devices Am27C4096 4 M egabit 262,144 x 16-B it C M O S EPROM DISTINCTIVE CHARACTERISTICS • Fast access time — 90 ns ■ Low power consumption — 100 pA maximum CMOS standby current ■ JEDEC-approved pinout ■ Single + 5 V power supply


    OCR Scan     		Am27C4096 40-pin 44-pin 16-038-SC 16-038-SQ 0257S2B M27C4096 PDF