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    CARRIER 28U Search Results

    CARRIER 28U Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    IN80C188-12 Rochester Electronics LLC Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    N80C188-25 Rochester Electronics LLC Microprocessor, 16-Bit, 25MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    IN80C186-20 Rochester Electronics LLC Microprocessor, 16-Bit, 20MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    N80C188-20 Rochester Electronics LLC Microprocessor, 16-Bit, 20MHz, CMOS, PQCC68, PLASTIC, LCC-68 Visit Rochester Electronics LLC Buy
    R80186 Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 Visit Rochester Electronics LLC Buy

    CARRIER 28U Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


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    PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


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    PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


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    PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


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    PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    MO-142

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,


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    PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide

    TSOP 66 Package

    Abstract: TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A
    Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability


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    PDF 32D6/DW6 40D6/DW6 28L/LW 32L/LW 44L/LW 68L/LW 28K/KW 32K/KW 44K/KW TSOP 66 Package TSOP 66 Package thermal resistance CERAMIC LEADLESS CHIP CARRIER 28P6 DW67 0636A

    TSOP 66 Package thermal resistance

    Abstract: 7244k 20P3 28P6 TSOP 66 thermal resistance
    Text: Packages Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability


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    PDF 28K/KW 32K/KW 44K/KW 68K/KW 24C/CW TSOP 66 Package thermal resistance 7244k 20P3 28P6 TSOP 66 thermal resistance

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 tsop 66 atmel 24c 20P3 28P6 0636C 7244k ATMEL 719 24C
    Text: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability


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    PDF 0636C 09/99/xM 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 68 tsop 66 atmel 24c 20P3 28P6 7244k ATMEL 719 24C

    20P3

    Abstract: 28P6 ATMEL 40T
    Text: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability


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    PDF 0636B 10/98/xM 20P3 28P6 ATMEL 40T

    atmel Heat Resistance SOIC

    Abstract: atmel 24c ATMEL SOIC 8S1 PACKAGE MATERIAL ATMEL Package type 8S1 20P3 28P6 ATMEL 719 24C
    Text: Thermal Characteristics of Atmel Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device increases, the stability


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    PDF 0636D 04/01/xM atmel Heat Resistance SOIC atmel 24c ATMEL SOIC 8S1 PACKAGE MATERIAL ATMEL Package type 8S1 20P3 28P6 ATMEL 719 24C

    eeprom 28c64

    Abstract: 5962-87514 AT28C64B-20DM at28c64-20dm AT28C64B-25DM 28C64 EEPROM 5962-88525 15 ZX at28c6425dm smd code led AT28C64-25DM
    Text: Introduction to the SMD Product Listing Each Standard Microcircuit Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MILSTD-883, paragraph 1.2.1 and to the requirements of the applicable standard


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    PDF MILSTD-883, 0553B 06/98/xM eeprom 28c64 5962-87514 AT28C64B-20DM at28c64-20dm AT28C64B-25DM 28C64 EEPROM 5962-88525 15 ZX at28c6425dm smd code led AT28C64-25DM

    ATMEL 350

    Abstract: 5962-87514 AT28C64-15DM/883 transistor smd list at28hc64b-70dm atmel 718 AT28C64-20DM "SMD Code" SMD CODE list smd code book
    Text: SMD Products Introduction to the SMD Product Listing Each Standard Microcircuit Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MILSTD-883, paragraph 1.2.1 and to the requirements of the applicable standard


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    PDF MILSTD-883, lAT28HC256-90LM/883 AT28HC256-90FM/883 AT28HC256F-90UM/883 AT28HC256F-90DM/883 AT28HC256F-90LM/883 AT28HC256F-90FM/883 ATMEL 350 5962-87514 AT28C64-15DM/883 transistor smd list at28hc64b-70dm atmel 718 AT28C64-20DM "SMD Code" SMD CODE list smd code book

    ATMEL 719 24C

    Abstract: TQFP PACKAGE thermal resistance 20P3 28P6
    Text: Thermal Characteristics of Atmel Standard Packages The thermal performance of the semiconductor package is a very important consideration for the board designer. The reliability and functional life of the device is directly related to its junction operating temperature. As the temperature of the device


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    PDF 0636E ATMEL 719 24C TQFP PACKAGE thermal resistance 20P3 28P6

    5962-88525 15 ZX

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC AT28C256 CERAMIC LEADLESS CHIP CARRIER AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F
    Text: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte 0006J 5962-88525 15 ZX 64 CERAMIC LEADLESS CHIP CARRIER LCC AT28C256 CERAMIC LEADLESS CHIP CARRIER AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F

    at28c256

    Abstract: ATMEL at28c256
    Text: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte 0006H 12/99/xM at28c256 ATMEL at28c256

    28c256 atmel

    Abstract: AT28C256 AT28C256-25 32-pad 28C256 AT28C256-15 AT28C256-20 AT28C256-35 AT28C256F
    Text: Features • Fast Read Access Time - 150 ns • Automatic Page Write Operation • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-Byte 0006G 10/98/xM 28c256 atmel AT28C256 AT28C256-25 32-pad 28C256 AT28C256-15 AT28C256-20 AT28C256-35 AT28C256F

    ATMEL at28c256

    Abstract: AT28C256 AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F
    Text: Features • Fast Read Access Time – 150 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte 0006I ATMEL at28c256 AT28C256 AT28C256-15 AT28C256-20 AT28C256-25 AT28C256-35 AT28C256F

    Untitled

    Abstract: No abstract text available
    Text: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte AT28HC25right 0007K

    28HC256

    Abstract: AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F
    Text: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte 0007J 28HC256 AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F

    28HC256

    Abstract: AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F
    Text: Features • Fast Read Access Time – 70 ns • Automatic Page Write Operation • • • • • • • • • • – Internal Address and Data Latches for 64 Bytes – Internal Control Timer Fast Write Cycle Times – Page Write Cycle Time: 3 ms or 10 ms Maximum


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    PDF 64-byte 0007L 28HC256 AT28C256 AT28HC256 AT28HC256-12 AT28HC256-70 AT28HC256-90 AT28HC256F

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: No abstract text available
    Text: ATV750 L Ordering Information Wx (ns) (ns) (MHz) Ordering Code Package 20 20 55 ATV750-20JC"' 28J ATV75U-20PC'1' 24P3 ATV750-20SC'1’ 24S 25 22 45 A T V 7 5 0 -2 0 jr""" "" 28J ATV750-20PI'-’-' 24P3 ATV750-20SI-1-' 24S ATV750-20DM'''1 24DW3 ATV750-20GM!:’-


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    PDF ATV750 ATV750-20JC" ATV75U-20PC ATV750-20SC ATV750-20PI ATV750-20SI-1 ATV750-20DM' ATV750-20GM! ATV750-20LM ATV750-20NM, CERAMIC LEADLESS CHIP CARRIER

    MJL-STD-1835

    Abstract: No abstract text available
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types.01 Package Description 32B 32 Lead, 0.600” Wide, Ceramic Side Braze Dual Inline Side


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Features • Fast Read Access Time - 150 ns • Automatic Page Write Operation - Internal Address and Data Latches for 64 Bytes - Internal Control Timer • Fast Write Cycle Times - Page Write Cycle Time: 3 ms or 10 ms Maximum - 1 to 64-Byte Page Write Operation


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    PDF 64-Byte AT28C2 0006G --10/98/xM

    EZ722

    Abstract: A7t smd EZ524 smd code A7t smd A6t zd 409 5962-88525 07 xa Select 642 UX A14C AT28C256
    Text: Features • Fast Read Access Time -150 ns • Automatic Page Write Operation - Internal Address and Data Latches for 64 Bytes - Internal Control Timer • Fast Write Cycle Times - Page Write Cycle Time: 3 ms or 10 ms Maximum - 1 to 64-Byte Page Write Operation


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    PDF 64-Byte AT28C256 EZ722 A7t smd EZ524 smd code A7t smd A6t zd 409 5962-88525 07 xa Select 642 UX A14C