db3 c
Abstract: break glass unit
Text: DB3-DB3TG Pb 350mW Bi-directional trigger diodes DO-35 RoHS COMPLIANCE Features Vbo : 32V Version Low break-over current. DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and terminals are readily solderable
|
Original
|
PDF
|
350mW
DO-35
DO-35
MIL-STD-202,
260oC/10
25ambient
100Hz
db3 c
break glass unit
|
ADG200-series
Abstract: ADG200CJ MIL-STO-883
Text: 01CMOS ProtectedDualSPSTAnalogSwitch ADG200 ANALOG W DEVICES FEATURES latch.Proof DI CMOS Overvoltage.Proof: VSUPPL Y :!:25V Superior DG-200 Replacement Break-Before-MakeSwitching Action RON: 100n max over Full Temperature Range Direct TTl/CMOS Interface OBS
|
Original
|
PDF
|
DG-200
01CMOS
ADG200
ADG200Cj
ADG200BP
ADG200BA
ADG200AP
ADG200
O-100
102mml.
ADG200-series
MIL-STO-883
|
Untitled
Abstract: No abstract text available
Text: DB3-DB3TG 150mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and
|
Original
|
PDF
|
150mW
DO-35
MIL-STD-202,
DO-35
|
Untitled
Abstract: No abstract text available
Text: DB3-DB3TG 350mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and
|
Original
|
PDF
|
350mW
DO-35
MIL-STD-202,
DO-35
|
DB3TG
Abstract: No abstract text available
Text: DB3-DB3TG 150mW Bi-directional Trigger Diodes Features • • • • • • • • • • VBO : 32V Version Low break-over current DO-35 package JEDEC Hermetically sealed glass Compression bonded construction All external surfaces are corrosion resistant and
|
Original
|
PDF
|
150mW
DO-35
MIL-STD-202,
DO-35
DB3TG
|
C22nF
Abstract: No abstract text available
Text: LLDB3-LLDB3TG Pb RoHS COMPLIANCE 150mW Bi-direction trigger diodes MINIMELF Features Vbo : 32V Version Low break-over current. LL-34 Mini-MELF package Hermetically sealed glass Compression bonded construction All external surfaces are corrosion
|
Original
|
PDF
|
150mW
LL-34(
MIL-STD-202,
260oC/10
25ambient
C22nF
|
MAX466
Abstract: MAX4664 MAX4664CPE MAX4664CSE MAX4664EPE MAX4664ESE MAX4665 MAX4666 5V SPST Reed Relay
Text: 19-1504; Rev 0; 7/99 5Ω, Quad, SPST, CMOS Analog Switches Features ♦ Low On-Resistance 5Ω max ♦ Guaranteed RON Match Between Channels (0.5Ω max) ♦ Guaranteed RON Flatness over Specified Signal Range (0.5Ω max) ♦ Guaranteed Break-Before-Make (MAX4666)
|
Original
|
PDF
|
MAX4666)
MAX4664CSE
MAX4664CPE
MAX4664ESE
MAX4664EPE
MAX4664/MAX4665/MAX4666
MAX466
MAX4664
MAX4664CPE
MAX4664CSE
MAX4664EPE
MAX4664ESE
MAX4665
MAX4666
5V SPST Reed Relay
|
MAX466
Abstract: MAX4664 MAX4664CPE MAX4664CSE MAX4664EPE MAX4664ESE MAX4665 MAX4666
Text: 19-1504; Rev 0; 7/99 5Ω, Quad, SPST, CMOS Analog Switches Features ♦ Low On-Resistance 5Ω max ♦ Guaranteed RON Match Between Channels (0.5Ω max) ♦ Guaranteed RON Flatness over Specified Signal Range (0.5Ω max) ♦ Guaranteed Break-Before-Make (MAX4666)
|
Original
|
PDF
|
MAX4666)
MAX4664CSE
MAX4664CPE
MAX4664ESE
MAX4664EPE
MAX4664/MAX4665/MAX4666
MAX466
MAX4664
MAX4664CPE
MAX4664CSE
MAX4664EPE
MAX4664ESE
MAX4665
MAX4666
|
HI-303-5
Abstract: HI1-0303-2 HI1-0303-5 HI-303 HI3-0303-5 HI9P0303-9 HI-303-2
Text: HI-303 Data Sheet August 2003 FN3125.9 Dual, SPDT CMOS Analog Switch Features The HI-303 switch is a monolithic device fabricated using CMOS technology and the Intersil dielectric isolation process. This switch features break-before-make switching, low and nearly constant ON resistance over the full analog
|
Original
|
PDF
|
HI-303
FN3125
HI-303
HI-303-5
HI1-0303-2
HI1-0303-5
HI3-0303-5
HI9P0303-9
HI-303-2
|
HI-303-5
Abstract: HI-303-2 HI1-0303-2 HI1-0303-5 HI-303 HI3-0303-5 HI9P0303-5 HI9P0303-9 MP2B
Text: HI-303 Data Sheet August 2002 FN3125.8 Dual, SPDT CMOS Analog Switch Features The HI-303 switch is a monolithic device fabricated using CMOS technology and the Intersil dielectric isolation process. This switch features break-before-make switching, low and nearly constant ON resistance over the full analog
|
Original
|
PDF
|
HI-303
FN3125
HI-303
HI-303-5
HI-303-2
HI1-0303-2
HI1-0303-5
HI3-0303-5
HI9P0303-5
HI9P0303-9
MP2B
|
Fiber-Bragg-Grating in EDWA
Abstract: HI1060 fibre pump laser UC974A UC960 Fiber Bragg Grating Fiber-Bragg-Grating UC960A UC980A 60825-1Edition
Text: Data sheet 980 nm Pump Laser Module, Un-cooled Features • Operating temperature range from 0°C to 70°C case • >120 mW linear power over full temperature range Bookham Technology’s UC9*A 980 nm Pump Laser Module is a break-through product enabling low-cost, highly reliable
|
Original
|
PDF
|
21CFR
Fiber-Bragg-Grating in EDWA
HI1060 fibre
pump laser
UC974A
UC960
Fiber Bragg Grating
Fiber-Bragg-Grating
UC960A
UC980A
60825-1Edition
|
C101
Abstract: IEC-61000-4-2 IEC61340-3-2 JESD22 STG4158 STG4158BJR marking 158
Text: STG4158 Low voltage 0.6 Ω typ single SPDT switch with break-before-make feature and 15 kV ESD protection Features • Power-off and over-voltage protection ■ Wide operating voltage range: VCC opr = 1.65 to 4.5 V ■ Low ON resistance VIN = 0 V: – RON = 0.85 Ω (max) at VCC = 4.5 V
|
Original
|
PDF
|
STG4158
IEC-61000-4-2
IEC61340-3-2
JESD22
STG4158
C101
JESD22
STG4158BJR
marking 158
|
V23134-A1052-X299
Abstract: "Power Relay"
Text: Power relay F4 V23134-A1052-X299 Data sheet change over with bracket and diode in parallel to the coil 3D40HB30.WMF Issued: 2005-11-14, Ed 02 Power relay F4 V23134-A1052-X299 02 max Dimensional drawing m ax Latching tab area max max Flat terminal similar
|
Original
|
PDF
|
V23134-A1052-X299
3D40HB30
volt40
V23134-A1052-X299
"Power Relay"
|
diac db3 specifications
Abstract: diac db3 DIAC 220v DIAC application db3 diac diac db3 applications DB3-22 db3 22 DIAC DATASHEET 220v break glass unit
Text: Continental Device India Limited An ISO/TS16949 and ISO 9001 Certified Company SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE DIAC DB3-22 DO-35 Glass Axial Package Marking C DB3 -22 APPLICATIONS For Triggering TRIACs, SCRs, Industrial and Commercial Equipments, Lamp Dimmer Circuits, Universal Motor
|
Original
|
PDF
|
ISO/TS16949
DB3-22
DO-35
120Hz
C-120
DB3-22Rev050803D
diac db3 specifications
diac db3
DIAC 220v
DIAC application
db3 diac
diac db3 applications
DB3-22
db3 22
DIAC DATASHEET 220v
break glass unit
|
|
|
DB3-22
Abstract: DIAC DB3 specifications diac db3 DIAC 220v 220v dimmer diac
Text: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company SILICON DIAC BIDIRECTIONAL TRIGGER DIODE GLASS PASSIVATED PNPN DEVICE DIAC DB3-22 DO-35 Glass Axial Package Marking C DB3 -22 APPLICATIONS For Triggering TRIACs, SCRs, Industrial and Commercial Equipments, Lamp Dimmer Circuits, Universal Motor
|
Original
|
PDF
|
DB3-22
DO-35
120Hz
C-120
DB3-22Rev050803D
DB3-22
DIAC DB3 specifications
diac db3
DIAC 220v
220v dimmer
diac
|
CPCI-204-1203
Abstract: CPCI-204-1203M ERNI CPCI DPCI-204-1203 DPCI-204-1203M DIN 41612 connector 48 pin condor B5 204m
Text: CompactPCI SYSTEM POWER SUPPLIES CPCI SERIES 200 Watts, Ac Input with PFC DPCI SERIES 200 Watts, 48 Vdc Input EXECUTIVE MEMBER FEATURES: • • • • • • • 200 W in 3U x 8HP, Fully compliant with PICMG CompactPCI® specifications Current sharing and internal OR-ing diodes for N+1 redundancy
|
Original
|
PDF
|
CPCI-154M,
DPCI-154M
CPCI-204M,
DPCI-204M
CPCI-204-1203
CPCI-204-1203M
ERNI CPCI
DPCI-204-1203
DPCI-204-1203M
DIN 41612 connector 48 pin
condor B5
204m
|
MIL-STD-1580B
Abstract: Microsemi cross Three bond tungsten slug glass diode
Text: MicroNote #030 by: Metallurgical Bond Evaluation Methods for Diodes Metallurgical bond evaluations of diodes have been a subject of interest for many years. It has stimulated the use of additional evaluation tools and methods over the last decade that are still evolving. This MicroNOTE will provide some added
|
Original
|
PDF
|
MIL-PRF-19500,
MIL-STD-1580A
MIL-STD-1580B
Microsemi cross
Three bond
tungsten slug glass diode
|
dg506abr
Abstract: 5202 GE SL4 diode DS5B
Text: SSSSS DG506A/507A 16-Channel and Dual 8-Channel CMOS Analog Multiplexers FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Easily Interfaced • Reduced Power Consumption • Low Power 30 mW typ. • Break-Before-Make Switching
|
OCR Scan
|
PDF
|
DG506A/507A
16-Channel
DG506A/507A
64-Channel
dg506abr
5202 GE
SL4 diode
DS5B
|
DG508ACK
Abstract: DG508AAK DG509ADY iC-MG
Text: DG508A/509A 8-Channel/Dual 4-Channel CMOS Analog Multiplexers JETS» FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Low Power 30 mW typ. • Break-Before-Make Switching • 44 V Power Supply Rating • •
|
OCR Scan
|
PDF
|
DG508A/509A
DG508A,
DG509A,
1N4148
DG508ACK
DG508AAK
DG509ADY
iC-MG
|
DG200BP
Abstract: 200BP S18A ADG20
Text: AN ALO G D E V IC E S □ Dl CMOS Protected Dual SPST Analog Switch FEATURES Latch-Proof Dl CMOS Overvoltage-Proof: ^ supply ± 25V Superior DG-200 Replacement Break-Before-Make Switching Action Ron: 100n max over Full Temperature Range Direct TTL/CMOS Interface
|
OCR Scan
|
PDF
|
ADG200
DG-200
DG200BP
200BP
S18A
ADG20
|
sil 9002
Abstract: DG506ABR iC-MHA MN 5198 K VAJI DG506A DG506AAK DG506ABK DG507A DG536
Text: üSSSfö DG 506A /507A 16-Channel and Dual 8-Channel C M O S Analog Multiplexers FEATURES BENEFITS APPLICATIONS • TTL & CMOS Direct Control Over Military Temperature Range • Low Power 30 mW typ. • Break-Before-Make Switching • ESD Protection > ± 2500 V
|
OCR Scan
|
PDF
|
DG506A/507A
16-Channel
DG506A/507A
1N4148
64-Channel
XXICJ0509
sil 9002
DG506ABR
iC-MHA
MN 5198 K
VAJI
DG506A
DG506AAK
DG506ABK
DG507A
DG536
|
5c2 zener diode
Abstract: zener 5c2 zener DIODE 5c2 ADG200CJ ADG200BP 310s ADG200AA 5c2 zener ADG200 ADG200BA
Text: DI CMOS Protected Dual SPST Analog Switch ANALOG DEVICES FEATURES Latch Proof Dl CMOS Overvoltage-Proof: V s u pply ± 2 5 V Superior DG 200 Replacement Break-Before-Make Switching Action Rq n • 100Î2 max over Full Temperature Range Direct TTL/CM O S Interface
|
OCR Scan
|
PDF
|
ADG200
14-PIN
102mm)
O-100
5c2 zener diode
zener 5c2
zener DIODE 5c2
ADG200CJ
ADG200BP
310s
ADG200AA
5c2 zener
ADG200BA
|
IH6216CPI
Abstract: DG507 S14B s24b IH6216 s25b AD7507 HI507 IH6216CDI IH6216MDI
Text: IH6216 8-Channel Differential C M O S A n alog M ultiplexer OffffiEÜ^DIL FEATURES GENERAL DESCRIPTION • Pin compatible with HI507, DG507 & AD7507 • ± 11V analog signal range • r o s o n < 700 ohms over full signal and temperature range • Break before make switching
|
OCR Scan
|
PDF
|
IH6216
HI507,
DG507
AD7507
100yuA
100pA
IH6216
DG507.
IH6216CPI
DG507
S14B
s24b
s25b
AD7507
HI507
IH6216CDI
IH6216MDI
|
diac N413
Abstract: N413 N413M n413m diac diac bidirectional diode ht 40 diac VB01 diac diac with triac DIAC DO35
Text: DIAC N413 SILICON BIDIRECTIONAL TRIGGER DIODE FEATURES Suitable fo r T R I AC trigger • DO-35 package MAXIMUM RATINGS PACKAGE DIMENSIONS U nit • mm ITEM SYMBOL Peak Current *P Storage Temperature Tstg Junction Temperature Ti 0 2.2 MAX. RATING U N IT
|
OCR Scan
|
PDF
|
DO-35
VbqIvB01
vB02l
1988M
diac N413
N413
N413M
n413m diac
diac bidirectional diode
ht 40 diac
VB01
diac
diac with triac
DIAC DO35
|
