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TAIYO YUDEN CBL2012T100M FIXED IND 10UH 370MA 1.3 OHM SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CBL2012T100M	Digi-Reel	15,790		1	1 $0.22 10 $0.173 100 $0.1346 1000 $0.10449 10000 $0.10449	Buy Now
	CBL2012T100M	Cut Tape	15,790		1	1 $0.22 10 $0.173 100 $0.1346 1000 $0.10449 10000 $0.10449	Buy Now
	CBL2012T100M	Reel	12,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.08295	Buy Now
Avnet Americas	CBL2012T100M	Reel		7 Weeks	4,000	1 - 10 - 100 - 1000 - 10000 $0.06875	Buy Now
Mouser Electronics	CBL2012T100M		4,045			1 $0.22 10 $0.146 100 $0.113 1000 $0.095 10000 $0.074	Buy Now
Newark	CBL2012T100M	Reel			4,000	1 $0.116 10 $0.116 100 $0.116 1000 $0.116 10000 $0.096	Buy Now
	CBL2012T100M	Cut Tape			4,000	1 - 10 - 100 $0.136 1000 $0.136 10000 $0.136	Buy Now
TTI	CBL2012T100M	Reel			4,000	1 - 10 - 100 - 1000 - 10000 $0.073	Buy Now

Chip1Stop	CBL2012T100M	Cut Tape	818			1 - 10 - 100 $0.0117 1000 $0.01 10000 $0.01	Buy Now
TAIYO YUDEN CBL2012T220M FIXED IND 22UH 250MA 2.73OHM SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CBL2012T220M	Cut Tape	12,759		1	1 $0.16 10 $0.123 100 $0.0956 1000 $0.07419 10000 $0.07419	Buy Now
	CBL2012T220M	Digi-Reel	12,759		1	1 $0.16 10 $0.123 100 $0.0956 1000 $0.07419 10000 $0.07419	Buy Now
	CBL2012T220M	Reel	8,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.06875	Buy Now
Avnet Americas	CBL2012T220M	Reel		7 Weeks	4,000	1 - 10 - 100 - 1000 - 10000 $0.06875	Buy Now
Mouser Electronics	CBL2012T220M		19,893			1 $0.16 10 $0.104 100 $0.081 1000 $0.075 10000 $0.069	Buy Now
Newark	CBL2012T220M	Cut Tape	3,328		1	1 $0.062 10 $0.062 100 $0.062 1000 $0.062 10000 $0.062	Buy Now
	CBL2012T220M	Reel			4,000	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Chip1Stop	CBL2012T220M	Cut Tape	5,740			1 - 10 - 100 $0.0526 1000 $0.0482 10000 $0.0446	Buy Now
TAIYO YUDEN CBL2012T1R0M FIXED IND 1UH 950MA 195 MOHM SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CBL2012T1R0M	Cut Tape	9,374		1	1 $0.23 10 $0.175 100 $0.136 1000 $0.10554 10000 $0.10554	Buy Now
	CBL2012T1R0M	Digi-Reel	9,374		1	1 $0.23 10 $0.175 100 $0.136 1000 $0.10554 10000 $0.10554	Buy Now
	CBL2012T1R0M	Reel	4,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.08378	Buy Now
Avnet Americas	CBL2012T1R0M	Reel		7 Weeks	4,000	1 - 10 - 100 - 1000 - 10000 $0.06875	Buy Now
Mouser Electronics	CBL2012T1R0M		3,928			1 $0.23 10 $0.147 100 $0.114 1000 $0.104 10000 $0.075	Buy Now
Newark	CBL2012T1R0M	Cut Tape			4,000	1 - 10 - 100 $0.154 1000 $0.154 10000 $0.154	Buy Now
Bristol Electronics	CBL2012T1R0M		3,725			1 - 10 - 100 - 1000 - 10000 -	Get Quote

Chip1Stop	CBL2012T1R0M	Cut Tape	3,136			1 - 10 - 100 $0.0912 1000 $0.074 10000 $0.0714	Buy Now
TAIYO YUDEN CBL2012T470M FIXED IND 47UH 140MA 5.46OHM SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CBL2012T470M	Cut Tape	5,520		1	1 $0.23 10 $0.175 100 $0.136 1000 $0.10554 10000 $0.10554	Buy Now
	CBL2012T470M	Digi-Reel	5,520		1	1 $0.23 10 $0.175 100 $0.136 1000 $0.10554 10000 $0.10554	Buy Now
	CBL2012T470M	Reel	4,000		4,000	1 - 10 - 100 - 1000 - 10000 $0.08378	Buy Now
Avnet Americas	CBL2012T470M	Reel		9 Weeks	4,000	1 - 10 - 100 - 1000 - 10000 $0.10088	Buy Now
Mouser Electronics	CBL2012T470M		6,801			1 $0.23 10 $0.147 100 $0.114 1000 $0.104 10000 $0.075	Buy Now
Newark	CBL2012T470M	Cut Tape			4,000	1 - 10 - 100 - 1000 - 10000 $0.116	Buy Now
	CBL2012T470M	Reel			4,000	1 $0.116 10 $0.116 100 $0.116 1000 $0.116 10000 $0.096	Buy Now
TTI	CBL2012T470M	Reel			4,000	1 - 10 - 100 - 1000 - 10000 $0.069	Buy Now

Component Electronics, Inc	CBL2012T470M		90			1 $0.31 10 $0.31 100 $0.23 1000 $0.2 10000 $0.2	Buy Now
New Advantage Corporation	CBL2012T470M		4,056		1	1 - 10 - 100 - 1000 $0.105 10000 $0.105	Buy Now
TAIYO YUDEN CBL2012T2R2M FIXED IND 2.2UH 590MA 507MOHM SM
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	CBL2012T2R2M	Digi-Reel	958		1	1 $0.22 10 $0.175 100 $0.1357 1000 $0.10534 10000 $0.10534	Buy Now
	CBL2012T2R2M	Cut Tape	958		1	1 $0.22 10 $0.175 100 $0.1357 1000 $0.10534 10000 $0.10534	Buy Now
Avnet Americas	CBL2012T2R2M	Reel		7 Weeks	4,000	1 - 10 - 100 - 1000 - 10000 $0.06875	Buy Now
Mouser Electronics	CBL2012T2R2M		2,334			1 $0.15 10 $0.104 100 $0.081 1000 $0.075 10000 $0.068	Buy Now
Newark	CBL2012T2R2M	Reel			4,000	1 $0.116 10 $0.116 100 $0.116 1000 $0.116 10000 $0.096	Buy Now
Ameya Holding Limited	CBL2012T2R2M		4,000			1 - 10 - 100 - 1000 - 10000 -	Get Quote

Chip1Stop	CBL2012T2R2M	Cut Tape	2,630			1 - 10 - 100 $0.036 1000 $0.0305 10000 $0.0296	Buy Now

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BL2012 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
BL2-012-S460-11/1		E-tec Interconnect	Connector: DIP Socket: F: 12: 1.27: THRU		Original	PDF

BL2012 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
ACX balun Abstract: ACX Multilayer Chip multilayer GHz Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.	Original	PDF	BL201205B1600_ ACX balun ACX Multilayer Chip multilayer GHz
BL201205B1850 Abstract: BL2012-05B ACX balun ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.	Original	PDF	BL201205B1850_ BL201205B1850 BL2012-05B ACX balun ACX Multilayer Chip multilayer GHz
ACX Multilayer Chip Abstract: B551-2 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B5512_ ACX Multilayer Chip B551-2 ACX balun multilayer GHz
BL201210B1600 Abstract: ACX balun ACX Multilayer Chip multilayer GHz Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.	Original	PDF	BL201210B1600_ BL201210B1600 ACX balun ACX Multilayer Chip multilayer GHz
BL2012 Abstract: BL201205L2450 ACX balun ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201205L2450_ 75ical BL2012 BL201205L2450 ACX balun ACX Multilayer Chip multilayer GHz
ACX Multilayer Chip Abstract: BL2012-05B3700 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201205B3700_ ACX Multilayer Chip BL2012-05B3700 ACX balun multilayer GHz
ACX balun Abstract: ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B5250_ ACX balun ACX Multilayer Chip multilayer GHz
ACX Multilayer Chip Abstract: BL2012 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.	Original	PDF	BL201220A1440_ ACX Multilayer Chip BL2012 ACX balun multilayer GHz
ACX Multilayer Chip Abstract: ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.1 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210H0465_ ACX Multilayer Chip ACX balun multilayer GHz
BL2012-05B2450 Abstract: AN5000 BL2012 SGN5010 IS11LV5010 QFN48 S0805 uPG158TB 10nf capacitor ISSI38 Text: ISSI IS11LV5010 BluetoothTM Transceiver PRELIMINARY INFORMATION JUNE 2003 FEATURES • A component of ISSI’s family of complete hardware and software BluetoothTM Solutions • Complete 2.45GHz radio transceiver in lowest-cost CMOS silicon • Complete Bluetooth GFSK data modem	Original	PDF	IS11LV5010 45GHz 40dBc BL2012-05B2450 AN5000 BL2012 SGN5010 IS11LV5010 QFN48 S0805 uPG158TB 10nf capacitor ISSI38
ACX Multilayer Chip Abstract: BL2012-20R0850 BL2012 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc.	Original	PDF	BL201220R0850_ ACX Multilayer Chip BL2012-20R0850 BL2012 ACX balun multilayer GHz
ACX Multilayer Chip Abstract: BL201210 BL2012-10 BL2012-10B5800 BL2012-10B ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B5800_ ACX Multilayer Chip BL201210 BL2012-10 BL2012-10B5800 BL2012-10B ACX balun multilayer GHz
BL2012-05B2450 Abstract: ACX Multilayer Chip bl2012 ACX balun multilayer GHz BL201205B2450 Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201205B2450_ BL2012-05B2450 ACX Multilayer Chip bl2012 ACX balun multilayer GHz BL201205B2450
BL201210B1850 Abstract: ACX balun ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B1850_ BL201210B1850 ACX balun ACX Multilayer Chip multilayer GHz

BL2012 Abstract: ACX Multilayer Chip BL2012-10B3301 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B3301_ BL2012 ACX Multilayer Chip BL2012-10B3301 ACX balun multilayer GHz
BL201205B0900 Abstract: 05b0900 ACX balun ACX Multilayer Chip multilayer GHz Text: ACX BL 2012 Series Advanced Ceramic X Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, etc.	Original	PDF	BL201205B0900_ BL201205B0900 05b0900 ACX balun ACX Multilayer Chip multilayer GHz
ACX Multilayer Chip Abstract: BL2012-20B3700 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201220B3700_ ACX Multilayer Chip BL2012-20B3700 ACX balun multilayer GHz
ACX Multilayer Chip Abstract: BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B3700_ ACX Multilayer Chip BL201210B3700 BL2012-10B3700 ACX balun multilayer GHz
BL2012-05B2450 Abstract: JEP106-K Signia Technologies JEP-106K AN5000 D908 HMC190 bl2012 D707 D709 Text: SGN5010 Bluetooth Transceiver PRELIMINARY SPECIFICATION Key Features: Product Description: The Signia SGN5010 IC is a low-cost, fully integrated CMOS radio frequency RF transceiver and GFSK data modem optimized for use in Bluetooth™ communications applications	Original	PDF	SGN5010 SGN5010 BL2012-05B2450 JEP106-K Signia Technologies JEP-106K AN5000 D908 HMC190 bl2012 D707 D709
ACX Multilayer Chip Abstract: 15B24 BL2012-15B2450 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201215B2450_ ACX Multilayer Chip 15B24 BL2012-15B2450 ACX balun multilayer GHz
BL201220B5388 Abstract: BL2012-20B5388 ACX Multilayer Chip C 5388 equivalent C 5388 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201220B5388_ BL201220B5388 BL2012-20B5388 ACX Multilayer Chip C 5388 equivalent C 5388 ACX balun multilayer GHz
BL2012-10 Abstract: ACX Multilayer Chip BL201210 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210K2450_ BL2012-10 ACX Multilayer Chip BL201210 ACX balun multilayer GHz
bl2012 Abstract: BL2012-10B2450 BL201210 BL201210B2450 ACX balun ACX Multilayer Chip multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201210B2450_ bl2012 BL2012-10B2450 BL201210 BL201210B2450 ACX balun ACX Multilayer Chip multilayer GHz
BL201205K5388 Abstract: BL2012-05K5388 ACX Multilayer Chip C 5388 ACX balun multilayer GHz Text: ACX Advanced Ceramic X BL 2012 Series Multilayer Chip Baluns Features Monolithic SMD with small, low-profile and light-weight type. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN,	Original	PDF	BL201205K5388_ BL201205K5388 BL2012-05K5388 ACX Multilayer Chip C 5388 ACX balun multilayer GHz

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BL2012 Price and Stock

TAIYO YUDEN CBL2012T100M

TAIYO YUDEN CBL2012T220M

TAIYO YUDEN CBL2012T1R0M

TAIYO YUDEN CBL2012T470M

TAIYO YUDEN CBL2012T2R2M

BL2012 Datasheets (1)

BL2012 Datasheets Context Search

ACX balun

BL201205B1850

ACX Multilayer Chip

BL201210B1600

BL2012

ACX Multilayer Chip

ACX balun

ACX Multilayer Chip

ACX Multilayer Chip

BL2012-05B2450

ACX Multilayer Chip

ACX Multilayer Chip

BL2012-05B2450

BL201210B1850

BL2012

BL201205B0900

ACX Multilayer Chip

ACX Multilayer Chip

BL2012-05B2450

ACX Multilayer Chip

BL201220B5388

BL2012-10

bl2012

BL201205K5388