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    BGA SOLDER BALL 0.35MM Search Results

    BGA SOLDER BALL 0.35MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BGA SOLDER BALL 0.35MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA Solder Ball 0.35mm collapse

    Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
    Text: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right


    Original     		PDF AN-5026 BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543

    BGA Solder Ball collapse

    Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
    Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to


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    "0.4mm" bga "ball collapse" height

    Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
    Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of


    Original     		PDF TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch

    "0.4mm" bga "ball collapse" height

    Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
    Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller


    Original     		PDF TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231

    0.65mm pitch BGA

    Abstract: BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout
    Text: Application Report SPRA429A TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		PDF SPRA429A TMS320C6000 C6000 0.65mm pitch BGA BGA reflow guide BGA Solder Ball 0.35mm BGA Package 0.35mm pitch SSYZ015 TMS320C6202 0.35mm BGA fanout

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


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    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


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    BGA reflow guide

    Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
    Text: Application Report SPRA429B TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		PDF SPRA429B TMS320C6000 C6000 BGA reflow guide TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


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    SnPb36Ag2

    Abstract: J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42
    Text: Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors June 2003 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation Moisture Sensitivity Level MSL statements


    Original     		PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42

    SnPb36Ag2

    Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
    Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation


    Original     		PDF 2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100

    eh 11757

    Abstract: 0.3mm pitch BGA JEDEC FBGA Coffin-Manson Equation thermal cycling data weibull 0.4mm pitch BGA BGA Solder Ball 0.35mm FBGA 63 PCB design for very fine pitch csp package bt resin
    Text: Daisy Chain Samples Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


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    0.65mm pitch BGA

    Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
    Text: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following


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    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    BOX21151

    Abstract: SG-BGA-6153 fillister head screw st 6153
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		PDF 225mm SG-BGA-6153 725mm 725mm 025mm BOX21151 fillister head screw st 6153

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		PDF CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide

    SG-BGA-6111

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		PDF 225mm 725mm 725mm 025mm SG-BGA-6111 125mm.

    ic 7085

    Abstract: FR4 thickness 7085 ic SG-BGA-7085 FR4 1.6mm thickness 0.35mm BGA FR4 0.8mm thickness
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. SG-BGA-7085 725mm 025mm ic 7085 FR4 thickness 7085 ic FR4 1.6mm thickness 0.35mm BGA FR4 0.8mm thickness

    0.35mm BGA

    Abstract: 7063 transistor SG-BGA-7063
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 725mm 025mm SG-BGA-7063 125mm. 0.35mm BGA 7063 transistor

    0.35mm BGA

    Abstract: 7060 SG-BGA-7060
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 725mm 025mm SG-BGA-7060 125mm. 0.35mm BGA 7060

    7062

    Abstract: ic 7062 SG-BGA-7062 0.35mm BGA
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 525mm 725mm 025mm SG-BGA-7062 125mm. 7062 ic 7062 0.35mm BGA

    7086

    Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 525mm 725mm 025mm SG-BGA-7086 125mm. 7086 BGA Solder Ball 0.6mm 0.35mm BGA BGA Solder Ball 0.35mm

    SG-BGA-7003

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. anodiA-7003 725mm SG-BGA-7003 125mm.

    SG-BGA-7056

    Abstract: No abstract text available
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. SG-BGA-7056 725mm 025mm 125mm.