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    BGA NSMD BALL Search Results

    BGA NSMD BALL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    BGA NSMD BALL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Routability

    Abstract: XAPP157 FG676 BGA 23 x 23 array FG1156 FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball
    Text: Application Note: Virtex Series R XAPP157 v1.0 July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilinx supplies full array fine-pitch BGA (Ball Grid Array) packages with 1.00 mm ball pitch.


    Original     		PDF XAPP157 FG1156 Routability XAPP157 FG676 BGA 23 x 23 array FG256 XCV300 pcb design 0,4 mm pitch via diameter pitch BGA NSMD ball

    EPF10K50E

    Abstract: BGA and QFP Package mounting
    Text: Designing with FineLine BGA Packages August 2001, ver. 1.1 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the


    Original     		PDF

    EPF10K50E

    Abstract: No abstract text available
    Text: Designing with FineLine BGA Packages November 1999, ver. 1.03 Introduction Application Note 114 6 As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues to grow. Ball-grid array (BGA) packages are an ideal solution because the


    Original     		PDF

    "x-ray machine"

    Abstract: BGA and QFP Package nsmd smd wicked popular NMSD hot air bga
    Text: PCB Layout Recommendations for BGA Packages Introduction BGA Disadvantages As Ball Grid Array BGA packages become increasingly more popular, it is important to understand how they are affected by various board layout techniques. This document provides a brief overview of PCB layout


    Original     		PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    TN1074

    Abstract: solder mask FTBGA FPBGA ultra fine pitch BGA ball grid array image BGA NSMD ball pcb design 0,5 mm pitch Ultra Chip
    Text: PCB Layout Recommendations for BGA Packages May 2009 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular, it is important to understand how they are affected by various board layout techniques. This document provides a brief overview of PCB layout considerations


    Original     		PDF TN1074 TN1074 solder mask FTBGA FPBGA ultra fine pitch BGA ball grid array image BGA NSMD ball pcb design 0,5 mm pitch Ultra Chip

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    EPC16U88

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 December 2007, ver. 5.1 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    Untitled

    Abstract: No abstract text available
    Text: Designing With High-Density BGA Packages for Altera Devices Application Note 114 January 2014, ver. 5.2 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    BGA PROFILING

    Abstract: fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V
    Text: 211xx-APP-002-A April 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Products Affected: M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, M21161G5 Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to


    Original     		PDF 211xx-APP-002-A M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, BGA PROFILING fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V

    micro fineline BGA

    Abstract: Epoxy, glass laminate EPC16U88
    Text: Designing With Fineline BGA Packages for APEX, FLEX, ACEX, MAX 7000 & MAX 3000 Devices Application Note 114 October 2005, ver. 3.0 Introduction As programmable logic devices PLDs increase in density and I/O pins, the demand for small packages and diverse packaging options continues


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    pcb warpage in ipc standard

    Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
    Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.


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    BGA PROFILING

    Abstract: hot air bga bga rework fine BGA thermal profile reflow hot air BGA
    Text: 2xxxx-APP-002-A September 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to ensure high assembly yield and product reliability for Ball Grid Array (BGA) packages. The BGA packages that can


    Original     		PDF 2xxxx-APP-002-A BGA PROFILING hot air bga bga rework fine BGA thermal profile reflow hot air BGA

    "0.4mm" bga "ball collapse" height

    Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
    Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of


    Original     		PDF TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch

    90Pb10Sn

    Abstract: FODB10X 5SN3 AN-3011 FODB100 95Pb-5 62Sn36Pb2Ag 95Pb5Sn
    Text: www.fairchildsemi.com Application Note AN-3011 Surface Mounting Technology Assembly Guidelines for Fairchild’s Microcouplers Ball Grid Array Optocoupler technology, consisting of a light source and a photosensitive detector surrounded by a transparent light


    Original     		PDF AN-3011 FODB100 AN3006009 90Pb10Sn FODB10X 5SN3 AN-3011 95Pb-5 62Sn36Pb2Ag 95Pb5Sn

    IPC-7095

    Abstract: J-STD-013 SM-782A
    Text: AND8075/D Board Mounting Considerations for FCBGA Packages Prepared by: Phill Celaya, Packaging Manager Mark D. Barrera, Broadband Knowledge Engineer http://onsemi.com APPLICATION NOTE APPLICATION NOTE USAGE Resin Seal Package Board Organic ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ


    Original     		PDF AND8075/D r14525 IPC-7095 J-STD-013 SM-782A

    SAC405

    Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
    Text: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent


    Original     		PDF countrieESD51 JESD5112, SAC405 IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station

    PBGA 256 reflow profile

    Abstract: bt 2328 pbga 144 BGA cte pbga JESD22-A113 OSP FLIPCHIP CRACK 304-pin dimensions bga jedec thermocouple WELD nsmd smd
    Text: Customer Applications Support and Reliability Test Center Page 1 Motorola General Business Information Customer Applications Support and Reliability Test Center Customer support for new and current packaging technology; Package-to-board Interconnect reliability


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    AN-1126

    Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement
    Text: Table of Contents Introduction . 2 Package Overview . 3


    Original     		PDF AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement

    bga 0,8 mm

    Abstract: tray matrix bga AN-1126 MO-151 fine BGA thermal profile an1126
    Text: National Semiconductor Application Note 1126 December 2000 CONTENTS Introduction Package Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations Solder Pad Geometry Escape Routing Guidlines Via Density Assembly Recommendations


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    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    nsmd smd

    Abstract: AN-289 PBGA256
    Text: BGA 256-pin Routing 1RWHV Application Note AN-289 By Paul Snell and John Afonasiev ,QWU ,QWURGXFWLRQ IDT uses the 256 PBGA package for several of its products. Although creating an optimal layout with a PBGA package is more challenging than with peripherally leaded packages such as the PQFP, this extra


    Original     		PDF 256-pin AN-289 nsmd smd AN-289 PBGA256

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern